Abstract: Various embodiments herein relate to methods and systems for backscatter communication using pre-defined templates. In accordance with at least one embodiment, there is provided a backscattering communication system, comprising a transmitting unit, a backscattering tag, and a receiving unit. The transmitting unit is configured to transmit a signal comprising a transmitted frame including a pre-defined data payload. The backscattering tag is configured to: receive, from the transmitting unit, the signal comprising the transmitted frame; encode tag data over the pre-defined data payload to generate a modified data payload; and transmit a backscattered signal comprising a backscattered frame including the modified data payload.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: Various embodiments herein relate to methods and systems for backscatter communication using pre-defined templates. In accordance with at least one embodiment, there is provided a backscattering communication system, comprising a transmitting unit, a backscattering tag, and a receiving unit. The transmitting unit is configured to transmit a signal comprising a transmitted frame including a pre-defined data payload. The backscattering tag is configured to: receive, from the transmitting unit, the signal comprising the transmitted frame; encode tag data over the pre-defined data payload to generate a modified data payload; and transmit a backscattered signal comprising a backscattered frame including the modified data payload.

Abstract: In one embodiment an apparatus includes: a mixer to downconvert a radio frequency (RF) spectrum including at least a first RF signal of a first channel of interest and a second RF signal of a second channel of interest to at least a first second frequency signal and a second second frequency signal; a first digitizer to digitize the first second frequency signal to a first digitized signal, the first digitizer configured to operate as a low-pass analog-to-digital converter (ADC); a second digitizer to digitize the second second frequency signal to a second digitized signal, the second digitizer configured to operate as a band-pass ADC; and a digital processor to digitally process the first digitized signal and the second digitized signal.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component may include a first dielectric layer having a top and a bottom, and a first conductive trace positioned on the bottom of the first dielectric layer. The component may also include a first ground layer positioned on the bottom of the first dielectric layer and spaced apart from the first conductive trace and a first solder layer connecting the first conductive trace to a second conductive trace of the printed circuit board and extending the full length of the first conductive trace. The component may also include a third conductive trace over the top of the first dielectric layer. The component may also include a pad under the first dielectric layer. The pad is soldered to a signal contact region of the printed circuit board. The third conductive trace is coupled to signal outputs formed by the signal contact region of the printed circuit board through a first via.

Abstract: In one embodiment an apparatus includes: a mixer to downconvert a radio frequency (RF) spectrum including at least a first RF signal of a first channel of interest and a second RF signal of a second channel of interest to at least a first second frequency signal and a second second frequency signal; a first digitizer to digitize the first second frequency signal to a first digitized signal, the first digitizer configured to operate as a low-pass analog-to-digital converter (ADC); a second digitizer to digitize the second second frequency signal to a second digitized signal, the second digitizer configured to operate as a band-pass ADC; and a digital processor to digitally process the first digitized signal and the second digitized signal.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: In one embodiment an apparatus includes: a mixer to downconvert a radio frequency (RF) spectrum including at least a first RF signal of a first channel of interest and a second RF signal of a second channel of interest to at least a first second frequency signal and a second second frequency signal; a first digitizer to digitize the first second frequency signal to a first digitized signal, the first digitizer configured to operate as a low-pass analog-to-digital converter (ADC); a second digitizer to digitize the second second frequency signal to a second digitized signal, the second digitizer configured to operate as a band-pass ADC; and a digital processor to digitally process the first digitized signal and the second digitized signal.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: In one embodiment an apparatus includes: a mixer to downconvert a radio frequency (RF) spectrum including at least a first RF signal of a first channel of interest and a second RF signal of a second channel of interest to at least a first second frequency signal and a second second frequency signal; a first digitizer to digitize the first second frequency signal to a first digitized signal, the first digitizer configured to operate as a low-pass analog-to-digital converter (ADC); a second digitizer to digitize the second second frequency signal to a second digitized signal, the second digitizer configured to operate as a band-pass ADC; and a digital processor to digitally process the first digitized signal and the second digitized signal.

Abstract: In one embodiment an apparatus includes: a mixer to downconvert a radio frequency (RF) spectrum including at least a first RF signal of a first channel of interest and a second RF signal of a second channel of interest to at least a first second frequency signal and a second second frequency signal; a first digitizer to digitize the first second frequency signal to a first digitized signal, the first digitizer configured to operate as a low-pass analog-to-digital converter (ADC); a second digitizer to digitize the second second frequency signal to a second digitized signal, the second digitizer configured to operate as a band-pass ADC; and a digital processor to digitally process the first digitized signal and the second digitized signal.

Abstract: A signal conditioner for conditioning a differential oscillation signal into a compliant clock signal including first and second signal paths and a coincident gate. The first signal path toggles a first binary signal in response to the differential oscillation signal when the differential oscillation signal reaches a small amplitude level. The second signal path toggles a second binary signal in response to the differential oscillation signal only when the differential oscillation signal reaches a large amplitude level that is greater than the small amplitude level. The coincident gate toggles the clock signal high only when the first and second binary signals are both high, and toggles the clock signal low only when the first and second binary signals are both low. When the clock signal begins toggling, it may skip one or more cycles but is nonetheless compliant in terms of timing and amplitude.

Abstract: Method of preparing monolithic SCR catalyst with a plurality of gas flow channels comprising the steps of (a) providing a monolithic shaped substrate with a plurality of parallel gas flow channels; (b) coating the substrate with a wash coat slurry comprising vanadium oxide precursor compounds and titania and optionally tungsten oxide precursor compounds; and (c) drying the thus coated substrate with a drying rate of 5 mm/min or less along flow direction through the gas flow channels; and (d) activating the dried coated substrate by calcining.

Abstract: In one embodiment an apparatus includes: a mixer to downconvert a radio frequency (RF) spectrum including at least a first RF signal of a first channel of interest and a second RF signal of a second channel of interest to at least a first second frequency signal and a second second frequency signal; a first digitizer to digitize the first second frequency signal to a first digitized signal, the first digitizer configured to operate as a low-pass analog-to-digital converter (ADC); a second digitizer to digitize the second second frequency signal to a second digitized signal, the second digitizer configured to operate as a band-pass ADC; and a digital processor to digitally process the first digitized signal and the second digitized signal.

Abstract: A signal conditioner for conditioning a differential oscillation signal into a compliant clock signal including first and second signal paths and a coincident gate. The first signal path toggles a first binary signal in response to the differential oscillation signal when the differential oscillation signal reaches a small amplitude level. The second signal path toggles a second binary signal in response to the differential oscillation signal only when the differential oscillation signal reaches a large amplitude level that is greater than the small amplitude level. The coincident gate toggles the clock signal high only when the first and second binary signals are both high, and toggles the clock signal low only when the first and second binary signals are both low. When the clock signal begins toggling, it may skip one or more cycles but is nonetheless compliant in terms of timing and amplitude.

Abstract: The present invention is directed to an impedance matching network for use at a predetermined frequency.

Abstract: Method of preparing monolithic SCR catalyst with a plurality of gas flow channels comprising the steps of (a) providing a monolithic shaped substrate with a plurality of parallel gas flow channels; (b) coating the substrate with a wash coat slurry comprising vanadium oxide precursor compounds and titania and optionally tungsten oxide precursor compounds; and (c) drying the thus coated substrate with a drying rate of 5 mm/min or less along flow direction through the gas flow channels; and (d) activating the dried coated substrate by calcining.

Abstract: Method of preparing a monolithic SCR catalyst with a plurality of gas flow channels comprising the steps of (a) providing a monolithic shaped substrate with a plurality of parallel gas flow channels; (b) coating the substrate with a washcoat slurry comprising titania; (c) drying and calcining the washcoat slurry; (d) impregnating the dried and calcined washcoat with an 10 aqueous impregnation solution comprising a precursor of a vanadium oxide; (e) drying the thus coated and impregnated washcoat at a drying rate of 5 mm/min or less along flow direction through the gas flow channels; and 15 (f) activating the dried, coated and impregnated washcoat by calcining.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: The present invention is directed to an impedance matching network for use at a predetermined frequency.