Abstract: Embodiments provide a method for manufacturing a microelectronic arrangement. The method includes a step of providing a chip-film module with a semiconductor chip and a film substrate having arranged thereon the semiconductor chip, wherein the chip-film module includes at least one coupling element spaced apart from the semiconductor chip and electrically coupled to at least one terminal of the semiconductor chip. Furthermore, the method includes a step of embedding the chip-film module into a printed circuit board, wherein, in embedding the chip-film module into the printed circuit board, the at least one coupling element of the chip-film module is coupled vertically [e.g. in the vertical direction [e.g. in relation to the printed circuit board]] [e.g. perpendicular to a surface of the printed circuit board] to at least one coupling counter element of the printed circuit board.

Abstract: The invention relates to a vertical compound semiconductor structure having a substrate with a first main surface and an opposite second main surface, a vertical channel opening extending completely through the substrate between the first main surface and the second main surface and a layer stack arranged within the vertical channel opening. The layer stack includes an electrically conductive layer arranged within the vertical channel opening and a compound semiconductor layer arranged within the vertical channel opening. The compound semiconductor layer includes a compound semiconductor layer arranged on the electrically conductive layer and connected galvanically to the electrically conductive layer. Further, the invention relates to a method for producing such a vertical compound semiconductor structure.

Abstract: The invention relates to a vertical compound semiconductor structure having a substrate with a first main surface and an opposite second main surface, a vertical channel opening extending completely through the substrate between the first main surface and the second main surface and a layer stack arranged within the vertical channel opening. The layer stack includes an electrically conductive layer arranged within the vertical channel opening and a compound semiconductor layer arranged within the vertical channel opening. The compound semiconductor layer includes a compound semiconductor layer arranged on the electrically conductive layer and connected galvanically to the electrically conductive layer. Further, the invention relates to a method for producing such a vertical compound semiconductor structure.

Abstract: A cryo-compatible quantum computing arrangement includes a microelectronic quantum computing component having a substrate structure, a plurality of first contact elements and a plurality of conductive feedthroughs through the substrate structure, wherein the conductive feedthroughs are electrically connected on a first main surface area of the substrate structure to associated first contact elements of the microelectronic quantum computing component, and a further microelectronic component having a plurality of second contact elements, wherein on a second main surface area of the substrate structure, the conductive feedthroughs are electrically connected to associated second contact elements of the further microelectronic component, and wherein the conductive feedthroughs each include, between the first and second contact elements, a layer element including a first material that is superconducting at a quantum computing operating temperature, and a filling element including a second material that is electrica

Abstract: Embodiments provide a method for manufacturing a microelectronic arrangement. The method includes a step of providing a chip-film module with a semiconductor chip and a film substrate having arranged thereon the semiconductor chip, wherein the chip-film module includes at least one coupling element spaced apart from the semiconductor chip and electrically coupled to at least one terminal of the semiconductor chip. Furthermore, the method includes a step of embedding the chip-film module into a printed circuit board, wherein, in embedding the chip-film module into the printed circuit board, the at least one coupling element of the chip-film module is coupled vertically [e.g. in the vertical direction [e.g. in relation to the printed circuit board]] [e.g.

Abstract: A radio-frequency arrangement is described. The radio-frequency arrangement has a first radio-frequency component, a second radio-frequency component and a wiring substrate having a coaxial radio-frequency line formed in the wiring substrate, wherein the first radio-frequency component and the second radio-frequency component are connected via the coaxial radio-frequency line.

Abstract: A radio-frequency arrangement is described. The radio-frequency arrangement has a radio-frequency device having a radio-frequency circuit. Additionally, the radio-frequency arrangement has a flexible substrate having at least two antennas, wherein the radio-frequency circuit is coupled to the at least two antennas, and wherein the flexible substrate is arranged at least partly around the radio-frequency device, wherein at least one first antenna of the at least two antennas is arranged adjacent to a first side of the radio-frequency device and at least one second antenna of the at least two antennas is arranged adjacent to a second side of the radio-frequency device opposite the first side.

Abstract: An antenna module Includes a first substrate, a second substrate, the second substrate including at least one cavity at one of the first main surface. The first substrate includes at feast an RF antenna element and/or an RF chip and/or an RF conductive trace, which are arranged on the first main surface of the substrate. The first substrate is connected, with its first main surface, to the first main surface of the second substrate so that the RF elements project into the at least one cavity.

Abstract: The invention relates to a vertical compound semiconductor structure having a substrate with a first main surface and an opposite second main surface, a vertical channel opening extending completely through the substrate between the first main surface and the second main surface and a layer stack arranged within the vertical channel opening. The layer stack includes an electrically conductive layer arranged within the vertical channel opening and a compound semiconductor layer arranged within the vertical channel opening. The compound semiconductor layer includes a compound semiconductor layer arranged on the electrically conductive layer and connected galvanically to the electrically conductive layer. Further, the invention relates to a method for producing such a vertical compound semiconductor structure.

Abstract: A method for manufacturing an electronic circuit component includes: providing a first electronic component with one or several electrically conductive first contacts and with one or several insulating first supporting elements; providing a second electronic component with one or several electrically conductive second contacts and with one or several insulating second supporting elements; configuring a connecting structure with an interposer substrate, with electrically conductive third contacts, with one or several electrically conductive fourth contacts, with one or several insulating third supporting elements, with one or several electrically conductive fifth contacts, and with one or several insulating fourth supporting elements; connecting the first electronic component and the second electronic component to the connecting structure, wherein the first contacts are electrically connected to the fourth contacts, wherein the first supporting elements are mechanically connected to the third supporting elemen

Abstract: A system for performing automated cell screening in drug discovery, includes an automated microscope, a fast autofocus device, and a digital imaging system. Processes are implemented in software through which relevant cellular material is segmented and quantified with minimal user interaction. Improvements in the following areas: known methods for image processing are implemented in such a way that automated segmentation is achieved; sets of known measurements (pixel counting, etc.) are implemented as methods which demonstrate aspects of biology in a reliable fashion; components for automated positioning, focusing, imaging and processing of a multiplicity of samples are integrated as systems within which the segmentation and measurement methods may be mounted; and components and methods are adapted into systems which yield more highly automated and more rapid cell screening.

Abstract: A method for manufacturing a three-dimensional, electronic system includes: providing a first integrated circuit structure in a first substrate, wherein the first integrated circuit structure has a first contact pad at a first main side of the first substrate; providing a second substrate with a second main side; forming a vertical contact area in the second substrate; after step (c) forming a semiconductor layer on the second main side of the second substrate; forming a semiconductor device of a second integrated circuit structure in the second substrate with the semiconductor layer; removing the substrate material from a side of the second substrate opposite the second main side, so that the vertical contact area at the opposite side is electrically exposed; arranging the first and second substrates on top of each other aligning the vertical contact area with the contact pad, so that an electrical connection between the first and second integrated circuit structures is produced via the vertical contact area

Abstract: A method for manufacturing a three-dimensional, electronic system includes: providing a first integrated circuit structure in a first substrate, wherein the first integrated circuit structure has a contact pad at a first main side of the first substrate; providing a second substrate with a main side; forming a vertical contact area in the second substrate; after step (c) forming a semiconductor layer on the main side of the second substrate; forming a semiconductor device of a second integrated circuit structure in the second substrate with the semiconductor layer; removing the substrate material from a side of the second substrate opposite the main side, so that the vertical contact area at the opposite side is electrically exposed; arranging the first and second substrates on top of each other aligning the vertical contact area with the contact pad, so that an electrical connection between the first and second integrated circuit structures is produced via the vertical contact area and the contact pad.

Abstract: A system for performing automated cell screening in drug discovery, includes an automated microscope, a fast autofocus device, and a digital imaging system. Processes are implemented in software through which relevant cellular material is segmented and quantified with minimal user interaction. Improvements in the following areas: known to methods for image processing are implemented in such a way that automated segmentation is achieved; sets of known measurements (pixel counting, etc.) are implemented as methods which demonstrate aspects of biology in a reliable fashion; components for automated positioning, focusing, imaging and processing of a multiplicity of samples are integrated as systems within which the segmentation and measurement methods may be mounted; and components and methods are adapted into systems which yield more highly automated and more rapid cell screening.

Abstract: A system for performing automated cell screening in drug discovery, includes an automated microscope, a fast autofocus device, and a digital imaging system. Processes are implemented in software through which relevant cellular material is segmented and quantified with minimal user interaction. Improvements in the following areas: known methods for image processing are implemented in such a way that automated segmentation is achieved; sets of known measurements (pixel counting, etc.) are implemented as methods which demonstrate aspects of biology in a reliable fashion; components for automated positioning, focusing, imaging and processing of a multiplicity of samples are integrated as systems within which the segmentation and measurement methods may be mounted; and components and methods are adapted into systems which yield more highly automated and more rapid cell screening.

Abstract: A system for performing automated cell screening in drug discovery, includes an automated microscope, a fast autofocus device, and a digital imaging system. Processes are implemented in software through which relevant cellular material is segmented and quantified with minimal user interaction. Improvements in the following areas: known methods for image processing are implemented in such a way that automated segmentation is achieved; sets of known measurements (pixel counting, etc.) are implemented as methods which demonstrate aspects of biology in a reliable fashion; components for automated positioning, focusing, imaging and processing of a multiplicity of samples are integrated as systems within which the segmentation and measurement methods may be mounted; and components and methods are adapted into systems which yield more highly automated and more rapid cell screening.

Abstract: A system for performing automated cell screening in drug discovery, including an automated microscope, a fast autofocus device and a digital imaging system. Processes are implemented in software through which relevant cellular material is segmented and quantified with minimal user interaction. Improvements in the following areas: known methods for image processing are implemented in such a way that automated segmentation is achieved; sets of known measurements (pixel counting, etc.) are implemented as methods which demonstrate aspects of biology in a reliable fashion; components for automated positioning, focusing, imaging and processing of a multiplicity of samples are integrated as systems within which the segmentation and measurement methods may be mounted; and components and methods are adapted into systems which yield more highly automated and more rapid cell screening.

Abstract: A system for performing automated cell screening in drug discovery, including an automated microscope, a fast autofocus device and a digital imaging system. Processes are implemented in software through which relevant cellular material is segmented and quantified with minimal user interaction. Improvements in the following areas: known methods for image processing are implemented in such a way that automated segmentation is achieved; sets of known measurements (pixel counting, etc.) are implemented as methods which demonstrate aspects of biology in a reliable fashion; components for automated positioning, focusing, imaging and processing of a multiplicity of samples are integrated as systems within which the segmentation and measurement methods may be mounted; and components and methods are adapted into systems which yield more highly automated and more rapid cell screening.

Abstract: An analytical process is disclosed, for discriminating data acquired from samples with overlapping distributions, and for improving and assessing the statistical validity of hybridization signal in arrays of assays. The process includes method of convolving data into two or more discrete probability density functions representing signal and nonsignal, discrete fluors, or other convolved independent variables. The system uses the probability density functions to assign hybridization signals, objectively, to one of the modeled distributions. Subsequent processes assess variability inherent to the arrays, and use this assessed variation to establish reliability scores and confidence limits for complete hybridization arrays, and for discrete hybridization assays within arrays.

Abstract: A method for improving the reliability and/or accuracy of physical measurements obtained from array hybridization studies performed on an array having a large number of genomic samples uses a small number of replicates insufficient for making precise and valid statistical inferences. This is overcome by estimating an error in measurement of a sample by averaging errors obtained when measuring the large number of samples or a subset of the large number of samples. The estimated sample error is utilized as a standard for accepting or rejecting the measurement of the respective sample. The samples may be independent or dependent in that correlated across two or more conditions.