Abstract: The present invention relates to an apparatus and method for imaging time resolved fluorescence in biochemical and medical samples. In a primary aspect, the device includes a lens of large aperture, a flash lamp in the illumination path, a fast-acting solid state shutter or a gated detector in the emission path, a device for delivering homogenous monochromatic illumination to a plurality of wells distributed within a microwell plate, a digital camera of high quantum efficiency, and a computer under computer control, the lamp is pulsed at short intervals. The fast-acting emission shutter or gated detector operates to limit exposure of the camera to a period some microseconds after the extinction of each lamp pulse, during which only delayed fluorescence is transmitted to the camera. The invention achieves simultaneous time resolved imaging of a plurality of samples, with high sensitivity and high throughput.

Abstract: In a method of producing three-dimensional circuits, a first and a second substrate are first provided, each of said substrates having arranged therein a plurality of components which have been tested with regard to their operability. The second substrate is diced so as to obtain a plurality of individual chips, each individual chip comprising at least one component. Subsequently, the individual chips are arranged on the first substrate and connected to said first substrate so that operative components in said first substrate are connected to individual chips including an operative component, and so that non-operative components in said first substrate are connected to chip elements having no function, so as to obtain a three-dimensional complete structure. Finally, the three-dimensional complete structure is diced so as to obtain three-dimensional circuits.

Abstract: The present invention relates to an apparatus and method for imaging time resolved fluorescence in biochemical and medical samples. In a primary aspect, the device includes a lens of large aperture, a flash lamp in the illumination path, a fast-acting solid state shutter or a gated detector in the emission path, a device for delivering homogenous monochromatic illumination to a plurality of wells distributed within a microwell plate, a digital camera of high quantum efficiency, and a computer under computer control, the lamp is pulsed at short intervals. The fast-acting emission shutter or gated detector operates to limit exposure of the camera to a period some microseconds after the extinction of each lamp pulse, during which only delayed fluorescence is transmitted to the camera. The invention achieves simultaneous time resolved imaging of a plurality of samples, with high sensitivity and high throughput.

Abstract: An analytical process is disclosed, for discriminating data acquired from samples with overlapping distributions, and for improving and assessing the statistical validity of hybridization signal in arrays of assays. The process includes method of convolving data into two or more discrete probability density functions representing signal and nonsignal, discrete fluors, or other convolved independent variables. The system uses the probability density functions to assign hybridization signals, objectively, to one of the modeled distributions. Subsequent processes assess variability inherent to the arrays, and use this assessed variation to establish reliability scores and confidence limits for complete hybridization arrays, and for discrete hybridization assays within arrays.

Abstract: An electronic imaging system is disclosed, for assessing the intensity of colorimetric, fluorescent or luminescent signal in a matrix consisting of wells, microwells, hybridization dot blots on membranes, gels, or other specimens. The system includes a very sensitive area CCD detector, a fast, telecentric lens with epi-illumination, a reflective/transmissive illumination system, an illumination wavelength selection device, and a light-tight chamber. A computer and image analysis software are used to control the hardware, correct and calibrate the images, and detect and quantify targets within the images.

Abstract: The present invention relates to a method of connecting two semiconductor components comprising the steps of providing in a first main surface of a first semiconductor substrate first component structures including first contact areas, forming in said first semiconductor substrate via holes filled with electrically conductive material and electrically insulated from said first semiconductor substrate, said via holes extending down to the second main surface of the first semiconductor substrate and being connected in an electrically conductive manner to said first contact areas via an electrically conductive connection material on the first main surface of said first semiconductor substrate, forming on the second main surface of the first semiconductor substrate first lands which are connected in an electrically conductive manner to the first contact areas via the electrically conductive material in the via holes, providing on a second semiconductor substrate second component structures including second contac

Abstract: An analytical process is disclosed, for discriminating data acquired from samples with overlapping distributions, and for improving and assessing the statistical validity of hybridization signal in arrays of assays. The process includes method of convolving data into two or more discrete probability density functions representing signal and nonsignal, discrete fluors, or other convolved independent variables. The system uses the probability density functions to assign hybridization signals, objectively, to one of the modeled distributions. Subsequent processes assess variability inherent to the arrays, and use this assessed variation to establish reliability scores and confidence limits for complete hybridization arrays, and for discrete hybridization assays within arrays.

Abstract: An electronic imaging system is disclosed, for assessing the intensity of calorimetric, fluorescent or luminescent signal in a matrix consisting of wells, microwells, hybridization dot blots on membranes, gels, or other specimens. The system includes a very sensitive area CCD detector, a fast, telecentric lens with epi-illumination, a reflective/transmissive illumination system, an illumination wavelength selection device, and a light-tight chamber. A computer and image analysis software are used to control the hardware, correct and calibrate the images, and detect and quantify targets within the images.

Abstract: An electronic imaging system is disclosed, for assessing the intensity of calorimetric, fluorescent or luminescent signal in a matrix consisting of wells, microwells, hybridization dot blots on membranes, gels, or other specimens. The system includes a very sensitive area CCD detector, a fast, telecentric lens with epi-illumination, a reflective/transmissive illumination system, an illumination wavelength selection device, and a light-tight chamber. A computer and image analysis software are used to control the hardware, correct and calibrate the images, and detect and quantify targets within the images.

Abstract: An electronic imaging system is disclosed, for assessing the intensity of calorimetric, fluorescent or luminescent signal in a matrix consisting of wells, microwells, hybridization dot blots on membranes, gels, or other specimens. The system includes a very sensitive area CCD detector, a fast, telecentric lens with epi-illumination, a reflective/transmissive illumination system, an illumination wavelength selection device, and a light-tight chamber. A computer and image analysis software are used to control the hardware, correct and calibrate the images, and detect and quantify targets within the images.

Abstract: The invention relates to a wiring method for vertical system integration. According to the method described in the invention, the individual component layers in different substrates are first processed independently of each other in accordance with the state of the art (DE 44 33 846 A1) and then assembled. First, via holes are opened up on the front side of the top substrate which preferably pass through all the component layers present. The top substrate is then thinned from the rear side as far as the via holes, after which a fully processed bottom substrate is joined to the top substrate. Next, the via holes are extended (so-called interchip via holes) as far as a metallized level of the bottom substrate and the contact between the top and bottom substrates is established (wiring). According to the present invention the wiring is carried out in a way which allows for a maximum density of the vertical contacts between the metallization of the top substrate and that of the bottom substrate.

Abstract: In a method for producing a titanium monophosphide layer, a carrier is first placed in a reactor. Thereafter, a TiN layer is deposited on the carrier by supplying TiCl4 ad NH3 into the reactor. The TiN layer is annealed immediately after deposition of the TiN layer while PH3 is supplied to the reactor, in order to form the titanium monophosphide layer on the TiN layer.

Abstract: An electronic imaging system is disclosed, for assessing the intensity of colorimetric, fluorescent or luminescent signal in a matrix consisting of wells, microwells, hybridization dot blots on membranes, gels, or other specimens. The system includes a very sensitive area CCD detector, a fast, telecentric lens with epi-illumination, a reflective/transmissive illumination system, an illumination wavelength selection device, and a light-tight chamber. A computer and image analysis software are used to control the hardware, correct and calibrate the images, and detect and quantify targets within the images.

Abstract: A method for improving the reliability and/or accuracy of physical measurements obtained from array hybridization studies performed on an array having a large number of genomic samples uses a small number of replicates insufficient for making precise and valid statistical inferences. This is overcome by estimating an error in measurement of a sample by averaging errors obtained when measuring the large number of samples or a subset of the large number of samples. The estimated sample error is utilized as a standard for accepting or rejecting the measurement of the respective sample. The samples may be independent or dependent in that correlated across two or more conditions.

Abstract: An electronic imaging system is disclosed, for assessing the intensity of calorimetric, fluorescent or luminescent signal in a matrix consisting of wells, microwells, hybridization dot blots on membranes, gels, or other specimens. The system includes a very sensitive area CCD detector, a fast, telecentric lens with epi-illumination, a reflective/transmissive illumination system, an illumination wavelength selection device, and a light-tight chamber. A computer and image analysis software are used to control the hardware, correct and calibrate the images, and detect and quantify targets within the images.

Abstract: An analytical process is disclosed, for discriminating data acquired from samples with overlapping distributions, and for improving and assessing the statistical validity of hybridization signal in arrays of assays. The process includes method of convolving data into two or more discrete probability density functions representing signal and nonsignal, discrete fluors, or other convolved independent variables. The system uses the probability density functions to assign hybridization signals, objectively, to one of the modeled distributions. Subsequent processes assess variability inherent to the arrays, and use this assessed variation to establish reliability scores and confidence limits for complete hybridization arrays, and for discrete hybridization assays within arrays.

Abstract: A method and apparatus are disclosed for use in an area digital imaging system for assays to extract targets on a specimen containing an array of targets that may not be arranged in perfect regularity. A matrix is defined of nominal target locations including a probe template of predefined, two-dimensional size and shape at each of a plurality of fixed, predefined grid points on the specimen, and a determination is made of the most probable location of the probe template corresponding to a specific target by sensing both pixel intensity and the spatial distribution of pixel intensities in an image of the specimen at a plurality of locations in the vicinity of a nominal target location.

Abstract: An electronic imaging system is disclosed, for assessing the intensity of calorimetric, fluorescent or luminescent signal in a matrix consisting of wells, microwells, hybridization dot blots on membranes, gels, or other specimens. The system includes a very sensitive area CCD detector, a fast, telecentric lens with epi-illumination, a reflective/transmissive illumination system, an illumination wavelength selection device, and a light-tight chamber. A computer and image analysis software are used to control the hardware, correct and calibrate the images, and detect and quantify targets within the images.

Abstract: The invention relates to a method of fabricating a metallized circuit structure for preventing product piracy and product manipulation, a semiconductor component fabricated by the method as well as the use of the semiconductor component in a chip card. The method may be practiced with CMOS-compatible standard Semiconductor technologies and complicates the use of so-called reverse engineering for appropriating foreign technology knowhow or for reading and/or manipulating data stored in the component. It is also possible by the method in accordance with the invention to fabricate a semiconductor component protected from ambient influences. In the method in accordance with the invention the component layer in the substrate (1) is processed up to a metallization complex. Thereafter, the front surface of the component substrate (1) thus obtained is connected to the front surface of a handling substrate (6) and the component substrate (1) is thinned from the rear side.

Abstract: A method of making a three-dimensional integrated circuit by transferring fully processed devices from a device layer of first substrate to an auxiliary substrate, separating the auxiliary substrate and the devices thereon into individual chips, testing the chips for their functionality and mounting functioning chips on a carrier substrate in a side-by-side arrangement to form a device layer therein and thereafter mounting a further device layer on said device layer of said carrier substrate. Electrical inter-connection are formed between the devices of said to layers through passage ways in their respective substrates.