Abstract: A method and encapsulation of a sensitive mechanical component structure in one embodiment includes a semiconductor substrate, and a film covering a component structure on the substrate, said film including at least one polymer layer, and at least one cavity formed between the component structure and the film, wherein at least one through contact penetrates through the film.

Abstract: A microvalve, in particular for a micropump, is described, which includes a valve member which is adjustable between an open position and a closed position, in contact with a valve seat in its closed position. The valve seat is made of a polymer material. A micropump and a manufacturing method are also described.

Abstract: A microfluidic cell for the dielectrophoretic separation, accumulation, and/or lysis of polarizable bioparticles, including an interdigital electrode system composed of two electrode groups having interdigitated electrodes, and a micromixer having microchannels and microelevations. The interdigital electrode system and the micromixer are situated on the same side of the cell to improve the separation, accumulation, and/or lysis characteristics. Moreover, also described is a microfluidic system which includes such a microfluidic cell, and use thereof, and a method for separating, accumulating, and/or lysing polarizable bioparticles.

Abstract: A microfluidic cell for the dielectrophoretic separation, accumulation, and/or lysis of polarizable bioparticles, including an interdigital electrode system composed of two electrode groups having interdigitated electrodes, a flat electrode in which the interdigital electrode system and the flat electrode are situated on opposite sides of the cell in order to improve the separation, accumulation and/or lysis characteristics. Moreover, a microfluidic system which includes such a microfluidic cell, and use thereof, and a method for separating, accumulating, and/or lysing polarizable bioparticles is also described.

Abstract: The invention relates to an encapsulation (4) of a sensitive component structure (3) on a semiconductor substrate (2) with a film (5) covering the component structure (3). According to the invention, it is provided that a cavity (8) for the component structure (3) is provided in the film (5). The invention also relates to a MEMS (1) and to a method for encapsulating a sensitive component structure (3).