Abstract: An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds.

Abstract: A lighting apparatus including an LED light emitter having an axis. The apparatus comprising a first lens over the emitter a second lens spaced over the first lens. The first lens is configured to direct LED-emitted light primarily toward a preferential radial side with respect to the emitter axis. The first lens may be an asymmetric primary lens. The first lens may have a centerline which is offset from the emitter axis toward the preferential radial side. Alternatively or in addition, the first lens may have an outer surface configured to direct LED-emitted light primarily toward the preferential radial side. The second lens may be asymmetric and be configured to further direct the light primarily toward the preferential radial side. The secondary lens may include inner and outer surfaces each shaped to direct received light primarily toward the preferential side.

Abstract: A Light Emitting Diode (LED) component includes an LED die and a contact expansion frame having an expanded anode contact and/or an expanded cathode contact. A patterned solder mask is provided on the contact expansion frame that exposes a portion of the outer face of the expanded anode contact and/or a portion of the outer face of the expanded cathode contact. A solder layer is provided on the portion of the outer face of the expanded anode contact and on the portion of the outer face of the expanded cathode contact. Multiple die components and related fabrication methods are also described.

Abstract: Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions.

Abstract: A method of making a semiconductor light emitting device having one or more light emitting surfaces includes positioning a stencil on a substrate such that a chip disposed on the substrate is positioned within an opening in the stencil. Phosphor-containing material is deposited in the opening to form a coating on one or more light emitting surfaces of the chip. The opening may or may not substantially conform to a shape of the chip. The phosphor-containing material is cured with the stencil still in place. After curing, the stencil is removed from the substrate and the coated chip is separated from the substrate. The chip may then be subjected to further processing.

Abstract: Methods are disclosed including generating a substrate surface topography that includes a mounting portion that is higher than a relief portion that defines a perimeter of the mounting portion.

Abstract: A method of forming can be provided by applying an optical conversion material to a mold to form a unitary layer of optical conversion material and removing the unitary layer of optical conversion material from the mold.

Abstract: A light emitting diode is disclosed, together with associated wafer structures, and fabrication and mapping techniques. The diode includes an active portion, a raised border on the top surface of the active portion and around the perimeter of the top surface of the active portion, a resin in the space defined by the border and the top surface of the active portion, and phosphor particles in the resin that convert the frequencies emitted by the active portion.

Abstract: An LED light source for use in LED lighting fixtures, the LED light source comprising a submount including an LED-populated area which has an aspect ratio greater than 1, an array of LEDs on the LED-populated area, and a lens on the submount over the LED-populated area. Various embodiments facilitating preferential-side lighting, such as for roadway uses, are also disclosed.

Abstract: A lighting apparatus including an LED light emitter having an axis. The apparatus comprising a first lens over the emitter a second lens spaced over the first lens. The first lens is configured to direct LED-emitted light primarily toward a preferential radial side with respect to the emitter axis. The first lens may be an asymmetric primary lens. The first lens may have a centerline which is offset from the emitter axis toward the preferential radial side. Alternatively or in addition, the first lens may have an outer surface configured to direct LED-emitted light primarily toward the preferential radial side. The second lens may be asymmetric and be configured to further direct the light primarily toward the preferential radial side. The secondary lens may include inner and outer surfaces each shaped to direct received light primarily toward the preferential side.

Abstract: Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described.

Abstract: Lighting apparatus having a first lens over the LED emitter and a second lens over the first lens, and including: a first optical surface which is a first-lens outer surface configured to refract light from the emitter; a second optical surface which is a second-lens inner surface spaced from the first optical surface; and a third optical surface which is a second-lens outer surface configured to refract light from the second optical surface toward a preferential side. One embodiment includes asymmetric primary and secondary lenses.

Abstract: Solid state light emitting diode packages can be provided including a ceramic material and a leadframe structure, on the ceramic material, the leadframe structure including a portion thereof that integrates the leadframe structure with the ceramic material.

Abstract: A Light Emitting Diode (LED) component includes an LED die and a contact expansion frame having an expanded anode contact and/or an expanded cathode contact. A patterned solder mask is provided on the contact expansion frame that exposes a portion of the outer face of the expanded anode contact and/or a portion of the outer face of the expanded cathode contact. A solder layer is provided on the portion of the outer face of the expanded anode contact and on the portion of the outer face of the expanded cathode contact. Multiple die components and related fabrication methods are also described.

Abstract: A Light Emitting Diode (LED) component includes an LED die having first and second opposing faces and a sidewall. A contact is provided that is spaced apart from the LED die. The contact includes an inner face adjacent the first face and an outer face adjacent the second face. The contact may be a portion of a lead frame or a discrete contact slug. A wire bond extends between the first face and the inner face. A reflective layer is provided on the inner face that extends to the sidewall and also extends along the sidewall. The reflective layer may include white paint. Related fabrication methods are also described.

Abstract: A Light Emitting Diode (LED) component includes discrete LED dies that are spaced apart from one another. An electrical connection element is provided adjacent the LED dies and configured to electrically connect the discrete LED dies in series and/or in parallel. A unitary optically transparent structure is provided on the second faces of the LED dies remote from the anode and cathode contacts, that spans the plurality of LED dies. The LED component is unsupported by a submount that spans adjacent ones of the LED dies. The electrical connection element may be a patterned metal sheet that is patterned to electrically connect the discrete LED dies in series and/or in parallel. The electrical connection element may also be wire bonds adjacent the LED dies that are arranged to electrically connect the discrete LED dies in series and/or in parallel.

Abstract: Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrical contacts disposed on a same side. The positive and negative electrical contacts can be adapted to electrically communicate to conductive portions of the submount. Light emitter packages can further include a lens overmolded on the submount and covering a portion of the array.

Abstract: Methods are disclosed including applying a conformal coating to multiple light emitters. The conformal coating forms in gap areas between adjacent ones of the light emitters. The plurality of light emitters are separated into individual light emitters. The individual light emitters include the conformal coating that extends to a space corresponding to respective gap areas. Light emitting structures are disclosed including a semiconductor light emitting diode (LED) having an active region and a conformal coating including a first portion and a second portion, the first portion corresponding to at least one surface of the LED and the second portion extending from the first portion.

Abstract: A method of forming an optical device includes providing an optical element, providing a luminescent suspension including a liquid encapsulant material, phosphor particles, a solvent and a thixotropic agent, atomizing the luminescent suspension, and spraying the atomized luminescent suspension onto the optical element using a flow of pressurized gas. A light emitting structure includes an optical element configured to emit light upon energization thereof, and a thin phosphor layer including a thixotropic agent on the optical element.

Abstract: A semiconductor structure includes an active region configured to emit light upon the application of a voltage thereto, a window layer configured to receive the light emitted by the active region, and a plurality of discrete phosphor-containing regions on the window layer and configured to receive light emitted by the active region and to convert at least a portion of the received light to a different wavelength than a wavelength of light emitted by the active region. Methods of forming a semiconductor structure including an active region configured to emit light and a window layer include forming a plurality of discrete phosphor-containing regions on the window layer.