Patents by Inventor Peter S. Locke

Peter S. Locke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to produce high quality metal fill in deep submicron vias and lines
    Publication number: 20010046565
    Abstract: A process for plating metal in submicron structures. A seedlayer is deposited on surfaces of submicron structures. The seedlayer is annealed at a temperature of about 80° C. to about 130° C. Metal is plated on the seedlayer.
    Type: Application
    Filed: July 9, 2001
    Publication date: November 29, 2001
    Inventors: Cyprian E. Uzoh, Peter S. Locke
  • Electroplating apparatus and method using a compressible contact
    Patent number: 6270646
    Abstract: A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. The compressible member is porous so as to absorb the plating solution and transmit the plating solution to the substrate. The wafer and compressible member may rotate with respect to each other. The compressible member may be at cathode potential or may be a passive circuit element.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: August 7, 2001
    Assignee: International Business Machines Corporation
    Inventors: Erick Gregory Walton, Dean S. Chung, Lara Sandra Collins, William E. Corbin, Jr., Hariklia Deligianni, Daniel Charles Edelstein, James E. Fluegel, Josef Warren Korejwa, Peter S. Locke, Cyprian Emeka Uzoh
  • Method to produce high quality metal fill in deep submicron vias and lines
    Patent number: 6258717
    Abstract: A process for plating metal in submicron structures. A seedlayer is deposited on surfaces of submicron structures. The seedlayer is annealed at a temperature of about 80° C. to about 130° C. Metal is plated on the seedlayer.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: July 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Cyprian E. Uzoh, Peter S. Locke