Abstract: A method includes receiving, by a piezoelectric stack of a transducer, a first piezoelectric voltage. The transducer has a base structure and a first layer, the base structure having a first displacement between a first portion of the base structure and the first layer. The method also includes transmitting, by the transducer, a first ultrasound frequency while receiving a first piezoelectric voltage, and receiving, by the transducer, a first bias voltage. The received first bias voltage alters the first displacement between the first portion of the base structure and the first layer, and the altered first displacement is smaller than the first displacement. The method further includes receiving, by the piezoelectric stack of the transducer, a second piezoelectric voltage to the transducer, and transmitting, by the transducer, a second ultrasound frequency while receiving the first bias voltage and the second piezoelectric voltage.

Abstract: A method is disclosed of fabricating a MEMS device that includes one or more wafers configured as pump or valve. The pump or valve includes an inlet port to receive fluid and an outlet port to release the fluid within the pump or valve. The method comprises growing silicon dioxide on a silicon layer of the one or more wafers to form a silicon dioxide layer on the silicon layer, depositing silicon nitride on the silicon dioxide layer of the one or more wafers to form a silicon nitride layer on the silicon dioxide layer, spinning a front side to create a pattern thereon defining an area for the pump or valve, dry etching the one or more wafers at the area for the pump or valve to remove the silicon dioxide and silicon nitride layers to define an opening for the pump or valve.

Abstract: A method includes receiving, by a piezoelectric stack of a transducer, a first piezoelectric voltage. The transducer has a base structure and a first layer, the base structure having a first displacement between a first portion of the base structure and the first layer. The method also includes transmitting, by the transducer, a first ultrasound frequency while receiving a first piezoelectric voltage, and receiving, by the transducer, a first bias voltage. The received first bias voltage alters the first displacement between the first portion of the base structure and the first layer, and the altered first displacement is smaller than the first displacement. The method further includes receiving, by the piezoelectric stack of the transducer, a second piezoelectric voltage to the transducer, and transmitting, by the transducer, a second ultrasound frequency while receiving the first bias voltage and the second piezoelectric voltage.

Abstract: In one example, an integrated circuit (IC) comprises: a lead frame including first terminals and second terminals; a first transducer and a second transducer, the first transducer coupled to the first terminals, and the second transducer coupled to the second transducer; an acoustic medium coupled to the first and second transducers; and a mold compound encapsulating at least parts of the lead frame, the first and second transducers, and the acoustic medium.

Abstract: In one example, a semiconductor device includes an acoustic medium, a first transducer on the acoustic medium, a first electrode coupled to the first transducer, a second transducer on the acoustic medium, and a second electrode coupled to the second acoustic transducer. The semiconductor device also includes a semiconductor substrate to support the acoustic medium and first and second transducers. Mold compound encapsulates at least a portion of the acoustic medium, the first acoustic transducer, the second acoustic transducer, and the semiconductor substrate.

Abstract: In some examples, a semiconductor device comprises a substrate, a trench, and a layer of a dielectric material. The substrate includes a semiconductor material and has opposing first and second surfaces. The trench extends between the first surface and the second surface, the trench having the dielectric material. The layer of the dielectric material is on the second surface of the substrate and is contiguous with the dielectric material in the trench.

Abstract: In described examples of an integrated circuit (IC) there is a substrate of semiconductor material having a first region with a first transistor formed therein and a second region with a second transistor formed therein. An isolation trench extends through the substrate and separates the first region of the substrate from the second region of the substrate. An interconnect region having layers of dielectric is disposed on a top surface of the substrate. A dielectric polymer is disposed in the isolation trench and in a layer over the backside surface of the substrate. An edge of the polymer layer is separated from the perimeter edge of the substrate by a space.

Abstract: A circuit includes: a first resonator; a temperature compensation circuit including a resonator group-delay analyzer and a second resonator; oscillator control circuitry; and a controller. The resonator group-delay analyzer is configured to determine a group-delay parameter responsive to operations of the second resonator. The controller is configured to provide a control signal responsive to the group-delay parameter. The oscillator control circuitry is configured to adjust a frequency of an output signal of the oscillator control circuitry responsive to the control signal.

Abstract: A method includes receiving, by a piezoelectric stack of a transducer, a first piezoelectric voltage. The transducer has a base structure and a first layer, the base structure having a first displacement between a first portion of the base structure and the first layer. The method also includes transmitting, by the transducer, a first ultrasound frequency while receiving a first piezoelectric voltage, and receiving, by the transducer, a first bias voltage. The received first bias voltage alters the first displacement between the first portion of the base structure and the first layer, and the altered first displacement is smaller than the first displacement. The method further includes receiving, by the piezoelectric stack of the transducer, a second piezoelectric voltage to the transducer, and transmitting, by the transducer, a second ultrasound frequency while receiving the first bias voltage and the second piezoelectric voltage.

Abstract: A laterally vibrating bulk acoustic wave (LVBAW) resonator includes a piezoelectric plate sandwiched between first and second metal layers. The second metal layer is patterned into an interdigital transducer (IDT) with comb-shaped electrodes having interlocking fingers. The width and pitch of the fingers of the electrodes determine the resonant frequency. A combined thickness of the first and second metal layers and the piezoelectric layer is less than the pitch of the interlocking fingers.

Abstract: In one embodiment, a transducer comprises a first piezoelectric stack comprising a piezoelectric material; a first layer in contact with the piezoelectric stack; and a base structure beneath the first layer. The first layer has a first displacement between a first portion of the base structure and the first layer, and the first displacement is configurable by a first bias voltage received by the transducer.

Abstract: A laterally vibrating bulk acoustic wave (LVBAW) resonator includes a piezoelectric plate sandwiched between first and second metal layers. The second metal layer is patterned into an interdigital transducer (IDT) with comb-shaped electrodes having interlocking fingers. The width and pitch of the fingers of the electrodes determine the resonant frequency. A combined thickness of the first and second metal layers and the piezoelectric layer is less than the pitch of the interlocking fingers.

Abstract: A torque sensor chip including a semiconductor substrate, an acoustic reflector formed on the semiconductor substrate, and first and second Lamb wave resonators (LWRs). The first LWR is formed on a side of the acoustic reflector opposite the semiconductor substrate. The first LWR is at a first angle with respect to an axis of the IC. The second LWR also is formed on the side of the acoustic reflector opposite the semiconductor substrate. The second LWR is at a second angle, different than the first angle, with respect to the axis of the IC.

Abstract: An encapsulation chip manufacturing method includes forming first and second dicing grooves in a surface of a cap wafer and aligning the cap wafer and a device substrate such that the surface of the cap wafer faces a surface of the device substrate. The device substrate includes a device affixed to the surface and a bond pad on the surface and coupled to the device. The cap wafer is bonded to the device substrate and partially diced at the first and second dicing grooves such that the bond pad is exposed. Aligning the cap wafer and the device substrate includes aligning the first and second dicing grooves between the bond pad and a bonding area at which the cap wafer is bonded to the device substrate. A width of the first and second dicing grooves prevents cap wafer dust formed during the partial dicing from falling on the bond pad.

Abstract: An interposer to be used in a device for delivering medication to a patient is disclosed. The device includes a reservoir for storing the medication and a needle for releasing the medication in the patient, the interposer configured to mount the reservoir and needle. The interposer comprises a channel for distributing the medication from the reservoir to the needle, a thin membrane defining a portion of the channel as a chamber for receiving the medication, and a piezoelectric transducer positioned on the thin membrane that functions as an actuator for moving the thin membrane toward and away from the chamber of the channel.

Abstract: A device is disclosed that is configured as a fully autonomous and integrated wearable apparatus for diabetes management. The device comprises a reservoir for storing the medication for subsequent delivery to a patient, a needle for delivering the medication to the patient subcutaneously, a micropump for pumping the medication from the reservoir through the needle for delivering the medication to the patient, control circuitry controlling operations of the micropump, an interposer configured as an adapter for (1) mounting the reservoir, micropump, the control circuitry and the needle, and (2) distributing medication through one or more channels within the interposer from the reservoir to the needle via the micropump and electrical signals between the control circuitry and micropump.

Abstract: A device is disclosed that is configured as a fully autonomous and integrated wearable apparatus for diabetes management. The device comprise a self-pressurized reservoir for storing the medication for subsequent delivery to a patient, a needle for delivering the medication to the patient subcutaneously, a first MEMS device configured as a microvalve in a fluid path between the self-pressurized reservoir and needle for controlling flowrate of medication through the needle as the self-pressurized reservoir discharges, a second MEMS device configured as a micropump configured to increase flowrate of the medication in the fluid path to ensure a constant flowrate in the fluid path as the self-pressurized discharges independent of orientation of the device, a flow sensor configured to measure flowrate in the fluid path for controlling microvalve and micropump, and control circuitry connected to the microvalve, micropump and flow sensor for controlling operation of the micropump and microvalve.

Abstract: A device for delivering a medication to a patient in a drug infusion system is disclosed. The device is configured as a fully autonomous and integrated wearable apparatus for managing the medication delivery. The device comprises: a reservoir for storing the medication to be delivered to the patient; a continuous glucose monitoring device for monitoring glucose levels in the patient to set flow rates for medication delivery; a needle for delivering the medication from reservoir into the patient; and a pumping unit including one or more MEMS devices configured to function as (a) a pump for pumping the medication from the reservoir through a flow path for medication to the needle at set flow rates and/or (b) a valve for regulating flow of the medication in the flow path from the reservoir through the needle.

Abstract: A method is disclosed of fabricating a MEMS device that includes one or more wafers configured as pump or valve. The pump or valve includes an inlet port to receive fluid and an outlet port to release the fluid within the pump or valve. The method comprises growing silicon dioxide on a silicon layer of the one or more wafers to form a silicon dioxide layer on the silicon layer, depositing silicon nitride on the silicon dioxide layer of the one or more wafers to form a silicon nitride layer on the silicon dioxide layer, spinning a front side to create a pattern thereon defining an area for the pump or valve, dry etching the one or more wafers at the area for the pump or valve to remove the silicon dioxide and silicon nitride layers to define an opening for the pump or valve.

Abstract: A method for managing delivery of medication to a patient including medication dosage control and medication flow rate control for the patient. The method comprises controlling flow rate of the medication to be delivered to the patient through a needle that is subcutaneously inserted into the patient including: monitoring glucose levels in the patient using a continuous glucose monitoring device; converting the glucose levels from the continuous glucose monitoring device into instructions by control algorithms within a microcontroller unit; commanding a pumping unit to deliver the medication through the needle at a flow rate based on the converted instructions; and delivering the medication through the needle into the patient at the flow rate; and adjusting the flow rate continually to reduce a difference between actual flow rate measured off of the pumping unit and a converted flow rate from the continuous glucose monitoring device.