Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

Abstract: Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include removing contaminants disposed on the substrate surface using a plasma process, and then cleaning the substrate surface by use of a remote plasma assisted dry etch process.

Abstract: A method and system for teaching an artificial intelligent agent where the agent can be placed in a state that it would like it to learn how to achieve. By giving the agent several examples, it can learn to identify what is important about these example states. Once the agent has the ability to recognize a goal configuration, it can use that information to then learn how to achieve the goal states on its own. An agent may be provided with positive and negative examples to demonstrate a goal configuration. Once the agent has learned certain goal configurations, the agent can learn policies and skills that achieve the learned goal configuration. The agent may create a collection of these policies and skills from which to select based on a particular command or state.

Abstract: Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include removing contaminants disposed on the substrate surface using a plasma process, and then cleaning the substrate surface by use of a remote plasma assisted dry etch process.

Abstract: Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process, where at least one etching process gas comprising chlorine gas and an inert gas is used during the plasma etch process and forming an epitaxial layer on the surface of the silicon-containing substrate.

Abstract: Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process, where at least one etching process gas comprising chlorine gas and an inert gas is used during the plasma etch process and forming an epitaxial layer on the surface of the silicon-containing substrate.

Abstract: Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process, where at least one etching process gas comprising chlorine gas and an inert gas is used during the plasma etch process and forming an epitaxial layer on the surface of the silicon-containing substrate.

Abstract: Disclosed is a vending system for supply of product from a plurality of containers each having a corresponding access door having an electrically activatable lock arrangement 200. The system has an interface module by which a predetermined maximum electrical power is made available for supply to the containers and lock arrangements such that each lock arrangement has a plurality of operational modes. The modes include: an active mode by which the lock arrangement is activatable in response to a vending instruction; a standby mode by which the lock arrangement awaits a vending instruction; and a sleep mode by which the lock arrangement minimises power drawn from the interface module. The interface module operates the lock arrangements in the standby mode and the interface module operates at least one lock arrangement in the sleep mode, and at least one lock arrangement in the active mode.

Abstract: Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include removing contaminants disposed on the substrate surface using a plasma process, and then cleaning the substrate surface by use of a remote plasma assisted dry etch process.

Abstract: Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process, where at least one etching process gas comprising chlorine gas and an inert gas is used during the plasma etch process and forming an epitaxial layer on the surface of the silicon-containing substrate.

Abstract: Disclosed is a vending system for supply of product from a plurality of containers each having a corresponding access door having an electrically activatable lock arrangement 200. The system has an interface module by which a predetermined maximum electrical power is made available for supply to the containers and lock arrangements such that each lock arrangement has a plurality of operational modes. The modes include: an active mode by which the lock arrangement is activatable in response to a vending instruction; a standby mode by which the lock arrangement awaits a vending instruction; and a sleep mode by which the lock arrangement minimises power drawn from the interface module. The interface module operates the lock arrangements in the standby mode and the interface module operates at least one lock arrangement in the sleep mode, and at least one lock arrangement in the active mode.

Abstract: Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process to form an etched surface of the silicon-containing substrate and forming an epitaxial layer on the etched surface of the silicon-containing substrate. The plasma etch process comprises flowing an etchant gas mixture comprising a fluorine-containing precursor and a hydrogen-containing precursor into a substrate-processing region of a first processing chamber and forming a plasma from the etchant gas mixture flowed into the substrate-processing region.

Abstract: Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include removing contaminants disposed on the substrate surface using a plasma process, and then cleaning the substrate surface by use of a remote plasma assisted dry etch process.

Abstract: Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process, where at least one etching process gas comprising chlorine gas and an inert gas is used during the plasma etch process and forming an epitaxial layer on the surface of the silicon-containing substrate.

Abstract: Disclosed is a vending system for supply of product from a plurality of containers each having a corresponding access door having an electrically activatable lock arrangement 200. The system has an interface module by which a predetermined maximum electrical power is made available for supply to the containers and lock arrangements such that each lock arrangement has a plurality of operational modes. The modes include: an active mode by which the lock arrangement is activatable in response to a vending instruction; a standby mode by which the lock arrangement awaits a vending instruction; and a sleep mode by which the lock arrangement minimises power drawn from the interface module. The interface module operates the lock arrangements in the standby mode and the interface module operates at least one lock arrangement in the sleep mode, and at least one lock arrangement in the active mode.

Abstract: A portable gymnastic device comprising a suspension means having two opposed and complementary rigid hooks, which are pivotally connected together and to a U-shaped frame by a pin. Hooked upper ends of the hooks are engaged over a horizontal cross member of the doorframe or a horizontal bar. The hooks are normally biased to a closed position permanently by the spring. A rope is connected with the U-shaped frame by a knot, which is placed on a top end of the rope. A handle is connected with a bottom end of the rope by suitable means such as a cam within the handle. On the bottom end of the rope several handles may be set on different levels to accommodate different height users and different exercises.

Abstract: A method, system and computer program product for efficiently utilizing a heat-pump based HVAC system with an auxiliary heating system. Possible actions (e.g., cooling, off, heat-pump heating and auxiliary heating) are selected over a period of time (e.g., three days). The effects of selecting actions are recorded in terms of a data set of tuples. A regression is fitted to model a transition function separately for each of the possible actions using the data set of tuples. A model is selected to fit a regression using regression features (e.g., historic indoor temperatures). An action (e.g., off) to take is determined using a lookahead planning approach during a don't care period (period of time occupants do not care about the inside temperature) for every time-step within the don't care period until an end of the don't care period, where the effects of the actions continue to be recorded.

Abstract: Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include removing contaminants disposed on the substrate surface using a plasma process, and then cleaning the substrate surface by use of a remote plasma assisted dry etch process.

Abstract: A deal with automatic line-locking includes a cam formed of a plurality of generally flat pressure-engaging segments or pressure pads that are angularly laterally offset to opposite sides of the cam plane an beyond the sheet(s) of flat material forming the cam, the segments or pads generally defining a line-receiving region having a generally uniform cross-section greater than the thickness of the sheet(s) of flat material configured to frictionally engage the line in the line locking position. Auxiliary sheave assemblies may be used to provide automatic failsafe operation by means of the cleat when raising or lowering an object on a hook or loop. A pusher may be used to automatically urge the line to move in the direction of the cam to lock the line especially when the line is released.