Abstract: A method for writing data to and/or reading data from locations on a surface via a tip comprises moving the tip between the locations on the surface. At each location, energy is selectively applied to the surface via the tip and the tip and the surface are selectively forced together in synchronization with the application of energy.

Abstract: A method for forming a microstructures is described. The method comprises: depositing a seed material on a substrate; growing a nanotube from the seed material; depositing microstructure material on the substrate to embed the nanotube in the microstructure material; and, detaching the substrate to release the microstructure. The resulting mictostructure comprises a body portion and a nanotube embedded in the body portion.

Abstract: A semiconductor device having a higher thermal dissipation efficiency comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.

Abstract: Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.

Abstract: The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.

Abstract: A transducer for detecting movement of an article mounted for movement in a plane, the transducer comprising: a heater facing the plane of movement of the article and having a temperature dependent resistance; and, an edge defined in the article between regions of different thermal conductivity; wherein, as the article describes the movement, the edge moves relative to the heater producing a corresponding variation in heat loss from the heater and a corresponding variation in resistance of the heater.

Abstract: In accordance with the present invention, there is provided an apparatus comprising a tape having an information layer on which information is storable in the form of perturbations, an array of probes that in function faces the tape such that the probes scan the surface of the tape, means for selectively forming the perturbations via the probes, means for detecting the presence of the perturbations via the probes, and drive means for moving the tape relative to the array of probes. The apparatus allows to store high data capacities at a small form factor.

Abstract: A microsystem switch (1, 20, 25, 30, 33) has a support (2) defining a recess (3), and a flexible bridge (6) is mounted on the support (2) bridging the recess (3). The bridge (6) is shaped so as to hold selectively a concave stable state, in which the bridge bulges into the recess (3), and a convex stable state in which the bridge bulges out of the recess (3). The switch includes an actuator (8, 9; 26, 27) for effecting flexing of the bridge (6) between the stable states, and a switching element (7, 31, 34) is mounted on the bridge (6) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch (40, 55) has a support (41) defining a recess (42), and an elongate torsion member (44) is mounted on the support (41) bridging the recess (42). A flexible bridge (43, 56) is mounted on the support (41) bridging the recess (42) in a direction substantially perpendicular to the torsion member (44).

Abstract: Apparatus for detecting data in a sensor signal generated by a read sensor in a local probe data storage device comprises a differentiation for subtracting a value of the sensor signal from the succeeding value of the sensor signal to generate a ternary difference signal; and a convertor connected to the differentiator for converting the difference signal into a binary output signal indicative of the detected data. A local probe data storage device comprising such apparatus is also described.

Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pad on an underside thereof contacting the metal stud. The MEMS is spaced from the chip by a distance corresponding to a height of the metal stud, and the MEMS includes a doped region in contact with the conducting pad. In particular, the MEMS may include a cantilever structure, with the end portion including a tip extending in the vertical direction. A support structure (e.g. of polyimide) may surround the metal stud and contact both the underside of the MEMS and the surface of the chip. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.

Abstract: An apparatus and method for moving a first object relative to a second object is provided. One of the first and second objects is moved and thereby guided by a tracking device. The tracking device uses a pattern on the first object and/or second object and a releasable clamping device for holding the first and second object in contact. The first and second object can then be releasably clamped such that the patterns match and the clamping device holds the first and second object in a position defined by the pattern. This invention is particularly well suited for nanomechanical or micromechanical applications.

Abstract: Read/write components for AFM-based data storage devices are provided. In particular embodiments, a read/write component comprises lever means and a support structure, the lever means being connected to the support structure for substantially pivotal movement. The lever means provides first and second current paths between a pair of electrical supply lines on the support structure via which the lever means can be connected in use to power supply means operable in a write mode and a read mode. A write-mode heater is provided on the lever means in the first current path, and a read/write tip is provided on the write-mode heater. A read-mode heater is provided on the lever means in the second current path. Decoupling means is arranged to inhibit current flow to the write-mode heater via the first current path in use when the power supply means is operated in the read mode.

Abstract: A transducer for detecting movement of an article mounted for movement in a plane, the transducer comprising: a heater facing the plane of movement of the article and having a temperature dependent resistance; and, an edge defined in the article between regions of different thermal conductivity; wherein, as the article describes the movement, the edge moves relative to the heater producing a corresponding variation in heat loss from the heater and a corresponding variation in resistance of the heater.

Abstract: Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.

Abstract: The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.

Abstract: Apparatus for detecting data in a sensor signal generated by a read sensor in a local probe data storage device comprises a differentiation for subtracting a value of the sensor signal from the succeeding value of the sensor signal to generate a ternary difference signal; and a convertor connected to the differentiator for converting the difference signal into a binary output signal indicative of the detected data. A local probe data storage device comprising such apparatus is also described.

Abstract: A device for contacting and/or modifying a surface having a cantilever connected to an almost plane carrier element staying apart from said surface, said cantilever having a tip at its loose end being in close contact to said surface. It is proposed that the cantilever stand out of the plane of said carrier element. Further, a method for producing the cantilever having a tip at its loose end. The device is suitable for thermomechanical writing and thermal readout of binary information, lithographic and imaging techniques, and for surface modification.

Abstract: A data storage medium from which information is reproduced by scanning a surface of the medium with a probe-based tip, such as an Atomic Force Microscope (AFM) tip positioned in contact therewith. The medium comprises a substrate; and a polymer recording surface within which data bit values are determined by the topographical state at the bit location. The polymer contains thermally reversible crosslinkages. The data bit value is a function of the depth of the pit at the bit location.

Abstract: A data storage device is introduced. The data storage device comprises a write head. The write head comprises a heating element and a tip. The write head scans a data storage medium, wherein in an operation mode of the data storage device the tip is in contact with a surface of the data storage medium and heat is applied to the tip by means of the heating element. In order to achieve a good thermal contact between the tip and the data storage medium, the tip comprises a carbon element that is at least partially in contact with the surface in that operation mode. Such a write head can also be applied in the field of scanning probe lithography.

Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The MEMS has an anchor portion having a conductor therethrough, by which it is connected to a substrate. The chip is attached to the MEMS substrate in a direction normal to the substrate surface, so as to make a conductive path from the chip to the MEMS. The chip may be attached by bonding the conductor to C4 metal pads formed on the chip, or by bonding the conductor to metal studs on the chip. The MEMS substrate may be thinned before attachment to the chip, or may be removed from the underside of the MEMS. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.