Abstract: The present invention provides a microprobe capable of simplifying constitution, capable of promoting measurement accuracy of sample face and capable of dispensing with alignment adjustment at each measurement and a scanning type probe apparatus using thereof.

Abstract: A scanning or positioning system with at least two degrees of freedom is provided comprising a supporting base equipped with magnets, a movable platform equipped with at least two electrical coils, and suspension elements providing an elastic connection between the movable platform and the supporting base. The electrical coils are positioned flat on the movable platform, thereby forming an essentially flat arrangement with the movable platform. Combining the flat arrangement with the flat supporting base yields a scanning or positioning system which is potentially compact, lightweight and flat and which features fast response, low power consumption and a relatively large range of motion, e.g. up to 10 mm. The scanning or positioning system with at least two degrees of freedom can be used in the field of scanning probe microscopy or in the field of data storage or imaging.

Abstract: A device for contacting and/or modifying a surface having a cantilever connected to an almost plane carrier element staying apart from said surface, said cantilever having a tip at its loose end being in close contact to said surface. It is proposed that the cantilever stand out of the plane of said carrier element. Further, a method for producing the cantilever having a tip at its loose end. The device is suitable for thermomechanical writing and thermal readout of binary information, lithographic and imaging techniques, and for surface modification.

Abstract: A method of manufacturing a cantilever with tip comprising the steps of forming a tip-like indent in a substrate, depositing a photoresist layer which fills said tip-like indent and covers at least a part of said substrate, and photolithographically structuring said photoresist layer to form said cantilever with tip out of said photoresist.

Abstract: The present invention relates to computer storage systems which have a tip (24) directed close or in contact to the storage medium (10) by which bit-writing and bit-reading is enforced. It is proposed to use a magnetizable storage medium (10), expose it to an artificial, external magnetic field H coupled externally to the storage medium, and—during bit writing—to concurrently apply heat very locally in bit size dimension in order to let the external magnetic field become locally larger than the (temperature-dependent) coercive field at the location (32) where heat is applied.

Abstract: An investigation and/or manipulation tool for a sample which is locally deformed when subjected to a local heat treatment includes a power supply for heating a tip of the tool wherein the tool has a structure such that the power supplied to the tip heats substantially only the tip of the tool and includes a region of relatively high heat conductivity that provides fast cooling of the tip when power is not supplied to the tip.

Abstract: The present invention discloses a method of forming ultrasmall (nano) structures in a thin film provided on a substrate by means of a tip which is movable relative to the surface of the thin film. According to principles of the invention, the penetration depth of the tip is limited, thereby avoiding wear of the tip. Furthermore, an apparatus for carrying out the method is disclosed.

Abstract: The present invention concerns mechanical signal processing comprising a mechanical adder as a basic building block. Such a mechanical adder (40), which is a basic element of the present invention, comprises a first micromechanical member (40.1) being sensitive to a first frequency (f.sub.1) and a second micromechanical member (40.2) being sensitive to a second frequency (f.sub.2). The two micromechanical members (40.1, 40.2) are coupled via a linear coupling (41) to provide a superposition (sum) of the two frequencies (f.sub.1 and f.sub.2). Based on the adder, AND-gates and OR-gates can be realized by adding further micromechanical members and appropriate linear and non-linear coupling elements.

Abstract: The present invention concerns a storage medium for scanning probe storage devices. This storage medium comprises a substrate (20) carrying a shape memory alloy layer (24). The shape memory alloy layer (24) is chosen such that an indent (23) can be formed by mechanically deforming said shape memory alloy layer (24), if a local probe (21, 22) of said scanning probe system exerts pressure on said alloy layer (24). An indent (23) can be removed by locally heating said shape memory alloy layer (24) to its transformation temperature (Tc) or above such that the shape memory alloy returns to its Martensite form.

Abstract: The present invention concerns a cantilever arrangement for scanning a surface. This arrangement comprises a first cantilever having a first probe and a second cantilever having a second probe. Both cantilevers are mechanically coupled such that the second cantilever follows the movement of the first cantilever, i.e. the deflection of the first cantilever defines the deflection of the second cantilever.

Abstract: A surface of a substrate (3) is to be exposed to a medium (11) directed towards said surface and which modifies said surface. A mask (4) to be used therefor has at least one opening (9) through which said medium (11) is allowed to reach said surface. The opening (9) is located in a protrusion (10) of said mask (4) which is directed versus said surface.

Abstract: The present invention concerns a storage device comprising a local probe array (72) and a storage medium (70) with an array of storage fields (71). The local probe array (72) is situated opposite to the storage medium (70) such that each local probes (73) of the local probe array can be scanned over the corresponding storage field (71). The storage device further comprises circuit for distinguishing between information to be erased from a first section of the storage medium and information in this section which is not to be erased, circuit for selectively copying the information which is not to be erased into a memory, preferably another section of said medium, and circuit for erasing the whole first section.

Abstract: A cantilever for scanning probe microscopy and other force or deflection measurements is described. The cantilever includes at least one one integrated strain sensing element within a constriction section (62) . The cantilever is improved over known cantilevers by reducing the longitudinal extension of the constriction, such that its contribution to the total deflection of the cantilever is reduced. The design of the cantilever is further improved by applying a beam (63) with an essentially triangular cross section in either a vertical or a horizontal plane or both.

Abstract: Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink are disclosed. The inventive cooling structure consists of a current/voltage supply level, with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge is in thermal connection with the heat transfer structure that provides for heat flux between the inventive cooling structure and the heat sink. The inventive cooling structure of this invention can be used with semiconductor devices and/or with opto-electronic devices.

Abstract: An integrated light deflector and fabrication method are disclosed. In accordance with the method, a mold is constructed above the surface of a substrate using a thick photo resist and a mask to define a deflector plane. A collimated light beam is applied at an appropriate angle of incidence to the photo resist material and mask. The developed resist provides a mold into which the deflector body is cast, leaving a deflector body whose front surface serves as the deflecting surface.

Abstract: An integrated light deflector and fabrication method are disclosed. In accordance with the method, a mold is constructed above the surface of a substrate using a thick photo resist and a mask to define a deflector plane. A collimated light beam is applied at an appropriate angle of incidence to the photo resist material and mask. The developed resist provides a mold into which the deflector body is cast, leaving a deflector body whose front surface serves as the deflecting surface.

Abstract: Optoelectronic composite consisting of two chips, the first chip 10 being made of a first material, the second one 13 being made of another material. The first chip 10, for example, comprises a multiplicity of active optoelectronic devices e.g. a laser diode 11 and a photo diode 12, all being monolithically integrated. A multiplicity of other optical devices, e.g. a waveguide 16, is monolithically integrated on the second chip 13. In addition this second chip 13 has depressions of the size of the devices 11,12 integrated on said first chip 10. These devices and the waveguide 16 of the second chip 13 are automatically aligned when flipping both chips together.

Abstract: Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink are disclosed. The inventive cooling structure consists of a current/voltage supply level, with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge is in thermal connection with the heat transfer structure that provides for heat flux between the inventive cooling structure and the heat sink. The inventive cooling structure of this invention can be used with semiconductor devices and/or with opto-electronic devices.

Abstract: Alignment of an optical fiber coupled to a surface emitting or surface receiving optical element situated on a substrate wherein the optical fiber is situated in a via hole on an alignment chip. The alignment is bonded to the substrate using at least one solder bond.

Abstract: A method of passivating etched mirror facets of semiconductor laser diodes which enhances device reliability.The etched mirror facet is first subjected to a weet-etch process to substantially remove any native oxide as well as any surface layer which may have been mechanically damaged during the preceding mirror etch process. Then, a passivation pre-treatment is applied whereby any residual oxygen is removed and a sub-monolayer is formed which permanently reduces the non-radiative recombination of minority carriers at the mirror facet. Finally, the pre-treated mirror surface is coated with a passivation layer to avoid any environmental effect on the mirror.