Abstract: A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.

Abstract: In order to increase the depth of field of an optical system, there is provision to add a phase object, interposed between an object (O) to be imaged and an image plane (8) of the optical system. The phase object is interposed although a chromatic aberration of the system is not yet corrected. After interposition, the measured optical signal is corrected complementarily so as to eliminate the chromatic aberrations therefrom. It is shown that if a parameter of the expansion of the expression, a function of pupil dependency, that the difference in path length of the optical system possesses a significant value of higher order than that of the defocus, then an increase in the depth of field is obtained.

Abstract: In accordance with one embodiment of the present invention, a seal for a surge relief valve includes a) a valve housing having a flow inlet and a flow outlet; b) an annular retainer for coupling a plug to an interior of the valve housing, the retainer having a first end oriented toward the flow inlet and a second end remote therefrom; c) the plug having a first end oriented toward the flow inlet and a second end remote therefrom, the plug having a mating junction for coupling with the second end of the retainer, the plug having a first countersink, a second countersink, a first lip defined between the first and second countersinks and a second lip adjacent the second countersink; and d) an annular plug seal having a first end oriented toward the flow inlet and a second end remote from the first end for mating with the second countersink and a lip that abuts the second end of the retainer.

Abstract: To increase the depth of field of an optical system, an inversion of the chromatism is produced. This accommodates the fact that, in natural light, users prefer, for their photographs, taking long distance shots outdoors, where the illuminant is mostly composed of blue, and short-distance shots indoors, where the illuminant is mostly composed of red. While optical devices naturally focus the blue components at a shorter distance than the red components, which is unfavorable, with an inversion of the chromatism, a focus more in keeping with what is required is restored.

Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).

Abstract: The invention relates to a system for capturing at least one image of a scene. The system comprises: an optical system, a sensor, an autofocus module for adjusting the focus of the system, and a digital processing means. The system estimates at least one value representative of the sharpness in at least one area of at least one initial captured image of a scene. The autofocus module captures the initial image with a predefined focus. On the basis of at least the value representative of the estimated sharpness, the system selects a first operating mode or a second operating mode. In the first mode, the autofocus module controls the focus of the system to capture a sharper image of the scene. In the second mode, the initial captured image or another captured image is processed by the digital processing means, the other image being captured with the predefined focus.

Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.

Abstract: A system for capturing images includes a sensor with a plurality of photosensitive elements, an optical system for focusing the light towards the sensor, and an electronic rolling shutter arranged so as to expose the photosensitive elements to light at moments that depend on the relative positions thereof inside the sensor. The system for capturing images also includes a means for adapting, at each of at least two distinct given moments while capturing an image, the light focus towards the sensor and/or the light exposure for at least part of the photosensitive elements exposed to the light at said moment.

Abstract: In order to increase the depth of field of an optical system, there is provision to add a phase object, interposed between an object (O) to be imaged and an image plane (8) of the optical system. The phase object is interposed although a chromatic aberration of the system is not yet corrected. After interposition, the measured optical signal is corrected complementarily so as to eliminate the chromatic aberrations therefrom. It is shown that if a parameter of the expansion of the expression, a function of pupil dependency, that the difference in path length of the optical system possesses a significant value of higher order than that of the defocus, then an increase in the depth of field is obtained.

Abstract: Players participating in a preferred embodiment of the disclosed game and method of play are dealt three cards only, and are thereafter allowed to replace only one of the dealt cards to improve the rank of their hand. The game is played with at least three standard decks that are modified so that the modified decks contain only the ranks Ace, King, Queen, Jack and Ten in the suits of Spades, Hearts, Diamonds and Clubs. However, play is also possible using only two prepared decks and three cards per hand. Players are not paid on wagers listed on a “pay table” of predetermined winning poker outcomes and corresponding odds. Instead, wagers are paid off at a ratio of one-to-one (1:1). The dealer is not required to have a predetermined qualifying hand, but the dealer is required to discard according to a predetermined “House Way.

Abstract: To increase the depth of field of an optical system, an inversion of the chromatism is produced. This accommodates the fact that, in natural light, users prefer, for their photographs, taking long distance shots outdoors, where the illuminant is mostly composed of blue, and short-distance shots indoors, where the illuminant is mostly composed of red. While optical devices naturally focus the blue components at a shorter distance than the red components, which is unfavorable, with an inversion of the chromatism, a focus more in keeping with what is required is restored.

Abstract: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.

Abstract: In one embodiment, a system to inspect the edge of a wafer, comprises an surface analyzer assembly, a first drive assembly to impart linear motion between the surface analyzer and a first surface of the wafer, and a second drive assembly to impart rotary motion between the surface analyzer and the wafer about an axis parallel to the first surface of the wafer.

Abstract: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.

Abstract: A mask pattern may be decomposed into two or more masks, each having a pitch greater than that of the original mask pattern. New, “partial-pattern” masks may be created for each of the new mask patterns. The original mask pattern is transferred to the photoresist for the corresponding layer using a multiple exposure technique in which the photoresist is exposed with each of the partial-pattern masks individually, e.g., back-to-back in a pass through a scanner, to define all of the features in the original pattern.

Abstract: The thickness of a wafer, substrate, or magnetic disk is measured by a shadow technique. A light source is positioned to pass a portion of light beam intensity on both sides of the wafer, substrate, or magnetic disk. A detector measures the light beam intensity after the light beam passes the wafer, substrate, or magnetic disk.

Abstract: A mask pattern may be decomposed into two or more masks, each having a pitch greater than that of the original mask pattern. New, “partial-pattern” masks may be created for each of the new mask patterns. The original mask pattern is transferred to the photoresist for the corresponding layer using a multiple exposure technique in which the photoresist is exposed with each of the partial-pattern masks individually, e.g., back-to-back in a pass through a scanner, to define all of the features in the original pattern.

Abstract: The thickness of a wafer, substrate, or magnetic disk is measured by a shadow technique. A light source is positioned to pass a portion of light beam intensity on both sides of the wafer, substrate, or magnetic disk. A detector measures the light beam intensity after the light beam passes the wafer, substrate, or magnetic disk.