Patents by Inventor Philip A. Kraus
Philip A. Kraus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11315769Abstract: Plasma source assemblies comprising an RF hot electrode having a body and at least one return electrode spaced from the RF hot electrode to provide a gap in which a plasma can be formed. An RF feed is connected to the RF hot electrode at a distance from the inner peripheral end of the RF hot electrode that is less than or equal to about 25% of the length of the RF hot electrode.Type: GrantFiled: January 15, 2021Date of Patent: April 26, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Kallol Bera, Anantha K. Subramani, John C. Forster, Philip A. Kraus, Farzad Houshmand, Hanhong Chen
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Patent number: 11289312Abstract: Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.Type: GrantFiled: June 12, 2019Date of Patent: March 29, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Adolph M. Allen, Vanessa Faune, Zhong Qiang Hua, Kirankumar Neelasandra Savandaiah, Anantha K. Subramani, Philip A. Kraus, Tza-Jing Gung, Lei Zhou, Halbert Chong, Vaibhav Soni, Kishor Kalathiparambil
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Patent number: 11284018Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.Type: GrantFiled: September 15, 2020Date of Patent: March 22, 2022Assignee: Applied Materials, Inc.Inventors: Upendra Ummethala, Philip Kraus, Keith Berding, Blake Erickson, Patrick Tae, Devendra Channappa Holeyannavar, Shivaraj Manjunath Nara, Anandakumar Parameshwarappa, Sivasankar Nagarajan, Dhirendra Kumar
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Publication number: 20220086364Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.Type: ApplicationFiled: September 15, 2020Publication date: March 17, 2022Inventors: Upendra Ummethala, Philip Kraus, Keith Berding, Blake Erickson, Patrick Tae, Devendra Channappa Holeyannavar, Shivaraj Manjunath Nara, Anandakumar Parameshwarappa, Sivasankar Nagarajan, Dhirendra Kumar
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Patent number: 11244791Abstract: Provided herein is a rechargeable power source that can be quickly charged and used for charging mobile and cordless devices. The power source includes an ultracapacitor which comprises a composite structure including, for example open graphene structures or graphene nanoribbons attached to an oxide layer. The oxide layer is on a metal foil surface. The oxide layer includes more than one metal atom.Type: GrantFiled: July 26, 2018Date of Patent: February 8, 2022Assignee: Oxcion LimitedInventors: Cattien V. Nguyen, You Li, Darrell L. Niemann, Hoang Nguyen Ly, Philip A. Kraus
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Publication number: 20220028710Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body along a first surface of the first lid plate. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the plurality of apertures defined through the first lid plate. The systems may include a plurality of isolators. An isolator of the plurality of isolators may be positioned between each lid stack of the plurality of lid stacks and a corresponding aperture of the plurality of apertures defined through the first lid plate. The systems may include a plurality of dielectric plates. A dielectric plate of the plurality of dielectric plates may be seated on each isolator of the plurality of isolators.Type: ApplicationFiled: July 21, 2020Publication date: January 27, 2022Applicant: Applied Materials, Inc.Inventors: Anantha K. Subramani, Yang Guo, Seyyed Abdolreza Fazeli, Nitin Pathak, Badri N. Ramamurthi, Kallol Bera, Xiaopu Li, Philip A. Kraus, Swaminathan T. Srinivasan
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Publication number: 20210378119Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.Type: ApplicationFiled: June 2, 2020Publication date: December 2, 2021Inventors: Phillip A. Criminale, Zhiqiang Guo, Philip A. Kraus, Andrew Myles, Martin Perez-Guzman
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Publication number: 20210366722Abstract: Described is a process to clean up junction interfaces for fabricating semiconductor devices involving forming low-resistance electrical connections between vertically separated regions. An etch can be performed to remove silicon oxide on silicon surface at the bottom of a recessed feature. Described are methods and apparatus for etching up the bottom oxide of a hole or trench while minimizing the effects to the underlying epitaxial layer and to the dielectric layers on the field and the corners of metal gate structures. The method for etching features involves a reaction chamber equipped with a combination of capacitively coupled plasma and inductive coupled plasma. CHxFy gases and plasma are used to form protection layer, which enables the selectively etching of bottom silicon dioxide by NH3—NF3 plasma. Ideally, silicon oxide on EPI is removed to ensure low-resistance electric contact while the epitaxial layer and field/corner dielectric layers are—etched only minimally or not at all.Type: ApplicationFiled: May 22, 2020Publication date: November 25, 2021Applicant: Applied Materials, Inc.Inventors: Yu Lei, Xuesong Lu, Tae Hong Ha, Xianmin Tang, Andrew Nguyen, Tza-Jing Gung, Philip A. Kraus, Chung Nang Liu, Hui Sun, Yufei Hu
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Patent number: 11170982Abstract: Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.Type: GrantFiled: August 1, 2019Date of Patent: November 9, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Anantha K. Subramani, Praburam Raja, Steven V. Sansoni, John Forster, Philip Kraus, Yang Guo, Prashanth Kothnur, Farzad Houshmand, Bencherki Mebarki, John Joseph Mazzocco, Thomas Brezoczky
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Publication number: 20210343496Abstract: Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse-bias. In an embodiment, a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and modulating the amplitude of the wafer voltage to produce a predetermined number of pulses to determine an ion energy distribution function. In another embodiment a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and applying a ramp voltage to the electrode that overcompensates for ion current on the wafer or applying a ramp voltage to the electrode that undercompensates for ion current on the wafer.Type: ApplicationFiled: July 16, 2021Publication date: November 4, 2021Inventors: LEONID DORF, TRAVIS KOH, OLIVIER LUERE, OLIVIER JOUBERT, PHILIP A. KRAUS, RAJINDER DHINDSA, JAMES ROGERS
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Publication number: 20210287898Abstract: Method for selectively oxidizing the dielectric surface of a substrate surface comprising a dielectric surface and a metal surface are discussed. Method for cleaning a substrate surface comprising a dielectric surface and a metal surface are also discussed. The disclosed methods oxidize the dielectric surface and/or clean the substrate surface using a plasma generated from hydrogen gas and oxygen gas. The disclosed method may be performed in a single step without the use of separate competing oxidation and reduction reactions. The disclosed methods may be performed at a constant temperature and/or within a single processing chamber.Type: ApplicationFiled: March 10, 2021Publication date: September 16, 2021Applicant: Applied Materials, IncInventors: Bencherki Mebarki, Joung Joo Lee, Yi Xu, Yu Lei, Xianmin Tang, Kelvin Chan, Alexander Jansen, Philip A. Kraus
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Patent number: 11069504Abstract: Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse—bias. In an embodiment, a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and modulating the amplitude of the wafer voltage to produce a predetermined number of pulses to determine an ion energy distribution function. In another embodiment a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and applying a ramp voltage to the electrode that overcompensates for ion current on the wafer or applying a ramp voltage to the electrode that undercompensates for ion current on the wafer.Type: GrantFiled: May 5, 2020Date of Patent: July 20, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Leonid Dorf, Travis Koh, Olivier Luere, Olivier Joubert, Philip A. Kraus, Rajinder Dhindsa, James Rogers
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Publication number: 20210210312Abstract: Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.Type: ApplicationFiled: December 29, 2020Publication date: July 8, 2021Inventors: Anantha K. Subramani, Farzad Houshmand, Philip A. Kraus, Abhishek Chowdhury, John C. Forster, Kallol Bera
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Publication number: 20210166923Abstract: Plasma source assemblies comprising an RF hot electrode having a body and at least one return electrode spaced from the RF hot electrode to provide a gap in which a plasma can be formed. An RF feed is connected to the RF hot electrode at a distance from the inner peripheral end of the RF hot electrode that is less than or equal to about 25% of the length of the RF hot electrode.Type: ApplicationFiled: January 15, 2021Publication date: June 3, 2021Applicant: Applied Materials, Inc.Inventors: Kallol Bera, Anantha K. Subramani, John C. Forster, Philip A. Kraus, Farzad Houshmand, Hanhong Chen
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Publication number: 20210090877Abstract: A method of depositing nitride films is disclosed. Some embodiments of the disclosure provide a PEALD process for depositing nitride films which utilizes separate reaction and nitridation plasmas. In some embodiments, the nitride films have improved growth per cycle (GPC) relative to films deposited by thermal processes or plasma processes with only a single plasma exposure. In some embodiments, the nitride films have improved film quality relative to films deposited by thermal processes or plasma processes with only a single plasma exposure.Type: ApplicationFiled: September 18, 2020Publication date: March 25, 2021Applicant: Applied Materials, Inc.Inventors: Hanhong Chen, Philip A. Kraus, Joseph AuBuchon
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Publication number: 20210050186Abstract: A method of depositing titanium nitride is disclosed. Some embodiments of the disclosure provide a PEALD process for depositing titanium nitride which utilizes a direct microwave plasma. In some embodiments, the direct microwave plasma has a high plasma density and low ion energy. In some embodiments, the plasma is generated directly above the substrate surface.Type: ApplicationFiled: August 11, 2020Publication date: February 18, 2021Applicant: Applied Materials, Inc.Inventors: Hanhong Chen, Arkaprava Dan, Joseph AuBuchon, Kyoung Ha Kim, Philip A. Kraus
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Patent number: 10903056Abstract: Plasma source assemblies comprising an RF hot electrode having a body and at least one return electrode spaced from the RF hot electrode to provide a gap in which a plasma can be formed. An RF feed is connected to the RF hot electrode at a distance from the inner peripheral end of the RF hot electrode that is less than or equal to about 25% of the length of the RF hot electrode.Type: GrantFiled: May 15, 2018Date of Patent: January 26, 2021Assignee: Applied Materials, Inc.Inventors: Kallol Bera, Anantha K. Subramani, John C. Forster, Philip A. Kraus, Farzad Houshmand, Hanhong Chen
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Patent number: 10879042Abstract: Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.Type: GrantFiled: January 24, 2017Date of Patent: December 29, 2020Assignee: Applied Materials, Inc.Inventors: Anantha K. Subramani, Farzad Houshmand, Philip A. Kraus, Abhishek Chowdhury, John C. Forster, Kallol Bera
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Publication number: 20200395198Abstract: Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments a process kit configured for use in a process chamber for processing a substrate includes a shield having a cylindrical body having an upper portion and a lower portion; an adapter section configured to be supported on walls of the process chamber and having a resting surface to support the shield; and a heater coupled to the adapter section and configured to be electrically coupled to at least one power source of the processes chamber to heat the shield.Type: ApplicationFiled: June 12, 2019Publication date: December 17, 2020Inventors: ADOLPH M. ALLEN, VANESSA FAUNE, ZHONG QIANG HUA, KIRANKUMAR NEELASANDRA SAVANDAIAH, ANANTHA K. SUBRAMANI, PHILIP A. KRAUS, TZA-JING GUNG, LEI ZHOU, HALBERT CHONG, VAIBHAV SONI, KISHOR KALATHIPARAMBIL
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Publication number: 20200266022Abstract: Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse—bias. In an embodiment, a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and modulating the amplitude of the wafer voltage to produce a predetermined number of pulses to determine an ion energy distribution function. In another embodiment a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and applying a ramp voltage to the electrode that overcompensates for ion current on the wafer or applying a ramp voltage to the electrode that undercompensates for ion current on the wafer.Type: ApplicationFiled: May 5, 2020Publication date: August 20, 2020Inventors: LEONID DORF, TRAVIS KOH, OLIVIER LUERE, OLIVIER JOUBERT, PHILIP A. KRAUS, RAJINDER DHINDSA, JAMES ROGERS