Patents by Inventor Philip D. Knudsen
Philip D. Knudsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9863044Abstract: A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.Type: GrantFiled: September 30, 2013Date of Patent: January 9, 2018Assignee: Rohm and Haas Electronic Materials LLCInventors: Maria Anna Rzeznik, Philip D. Knudsen, Xuesong Wang, Martin W. Bayes, Yuhsin Tsai
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Publication number: 20140093647Abstract: A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.Type: ApplicationFiled: September 30, 2013Publication date: April 3, 2014Inventors: Maria Anna RZEZNIK, Philip D. KNUDSEN, Xuesong WANG, Martin W. BAYES, Yuhsin TSAI
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Patent number: 7693383Abstract: Provided are polymers comprising the condensation product of silicon-containing reactants. Also provided are compositions suitable for use in forming optical waveguides which include such polymers, as well as optical waveguides formed from such polymers. The polymers, compositions and optical waveguides have particular use in the formation of printed wiring boards having electrical and optical functionality.Type: GrantFiled: November 14, 2006Date of Patent: April 6, 2010Assignee: Rohm and Haas Electronics MaterialsInventors: Hai Bin Zheng, Philip D. Knudsen, James G. Shelnut
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Patent number: 7615130Abstract: Provided are methods of forming a printed circuit board having optical functionality. The methods involve: (a) providing a first, printed circuit board substrate; (b) forming an optical waveguide structure comprising a clad and a core structure on a second substrate separate from the printed circuit board substrate, wherein the optical waveguide structure comprises a silicon-containing material; (c) separating the optical waveguide structure from the second substrate; and (d) affixing the optical waveguide structure to the printed circuit board substrate. The invention has particular applicability in the electronics and optoelectronics industries for the formation of hybrid printed circuit boards.Type: GrantFiled: August 19, 2005Date of Patent: November 10, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: James G. Shelnut, Matthew L. Moynihan, Nicola Pugliano, Philip D. Knudsen
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Patent number: 7583880Abstract: Provided are methods of forming printed circuit boards having optical functionality. The methods involve applying a dry-film to a printed circuit board substrate and forming an optical waveguide over the dry-film. The invention finds particular applicability in the electronics and optoelectronics industries.Type: GrantFiled: December 28, 2007Date of Patent: September 1, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Edgardo Anzures, Philip D. Knudsen
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Publication number: 20080187267Abstract: Provided are methods of forming printed circuit boards having optical functionality. The methods involve applying a dry-film to a printed circuit board substrate and forming an optical waveguide over the dry-film. The invention finds particular applicability in the electronics and optoelectronics industries.Type: ApplicationFiled: December 28, 2007Publication date: August 7, 2008Applicant: Rohm and Haas Electronic Materials LLCInventors: Edgardo Anzures, Philip D. Knudsen
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Publication number: 20040196620Abstract: A dielectric composed of a core material between two polymer layers that have permittivity values less than the core material. The polymer layers provide structural integrity for the dielectric. The dielectric can be employed in a capacitor to fine tune the capacitance of the capacitor. The dielectric and the capacitor may have a thickness in the micron range. Accordingly, the dielectric and capacitor provide for the miniaturization of electronic devices. The dielectric may be employed in decoupling capacitors to reduce noise in electronic devices.Type: ApplicationFiled: April 24, 2004Publication date: October 7, 2004Applicant: Shipley Company, L.L.C.Inventors: Philip D. Knudsen, Craig S. Allen
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Publication number: 20020176989Abstract: A dielectric composed of a core material between two polymer layers that have permittivity values less than the core material. The polymer layers provide structural integrity for the dielectric. The dielectric can be employed in a capacitor to fine tune the capacitance of the capacitor. The dielectric and the capacitor may have a thickness in the micron range. Accordingly, the dielectric and capacitor provide for the miniaturization of electronic devices. The dielectric may be employed in decoupling capacitors to reduce noise in electronic devices.Type: ApplicationFiled: April 16, 2002Publication date: November 28, 2002Inventors: Philip D. Knudsen, Craig S. Allen
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Patent number: 5691395Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.Type: GrantFiled: July 12, 1994Date of Patent: November 25, 1997Assignee: Shipley Company Inc.Inventors: Philip D. Knudsen, Charles R. Shipley, Daniel Y. Pai
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Patent number: 5441770Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.Type: GrantFiled: August 14, 1991Date of Patent: August 15, 1995Assignee: Shipley Company Inc.Inventors: James E. Rychwalski, Paul J. Ciccolo, Robert B. Currie, Philip D. Knudsen
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Patent number: 5366846Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.Type: GrantFiled: June 28, 1993Date of Patent: November 22, 1994Assignee: Shipley Company Inc.Inventors: Philip D. Knudsen, Charles R. Shipley, Daniel Y. Pai
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Patent number: 5322976Abstract: Polyetherimide-metal laminates are formed by etching the surfaces of a polyetherimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.Type: GrantFiled: November 18, 1991Date of Patent: June 21, 1994Assignee: Polyonics CorporationInventors: Philip D. Knudsen, Daniel P. Walsh
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Patent number: 5262280Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.Type: GrantFiled: April 2, 1992Date of Patent: November 16, 1993Assignee: Shipley Company Inc.Inventors: Philip D. Knudsen, Charles R. Shipley, Daniel Y. Pai
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Patent number: 5120578Abstract: The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.Type: GrantFiled: July 29, 1991Date of Patent: June 9, 1992Assignee: Shipley Company Inc.Inventors: Jensheng Chen, Philip D. Knudsen
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Patent number: 5076841Abstract: The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.Type: GrantFiled: May 31, 1990Date of Patent: December 31, 1991Assignee: Shipley Company Inc.Inventors: Jensheng Chen, Philip D. Knudsen
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Patent number: 4992144Abstract: Both surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt and can also be coated with a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which serves the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating the porous metal layer.Type: GrantFiled: September 27, 1989Date of Patent: February 12, 1991Assignee: Polyonics CorporationInventors: Daniel P. Walsh, Philip D. Knudsen
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Patent number: 4950553Abstract: Bath surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt which can also include a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which services the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating said porous metal layer.Type: GrantFiled: January 23, 1989Date of Patent: August 21, 1990Assignee: Polyonics CorporationInventors: Daniel P. Walsh, Philip D. Knudsen
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Patent number: 4894124Abstract: Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.Type: GrantFiled: October 31, 1988Date of Patent: January 16, 1990Assignee: Polyonics CorporationInventors: Daniel P. Walsh, Philip D. Knudsen
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Patent number: 4868071Abstract: Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.Type: GrantFiled: February 16, 1988Date of Patent: September 19, 1989Assignee: Polyonics CorporationInventors: Daniel P. Walsh, Philip D. Knudsen
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Patent number: 4832799Abstract: At least one surface of a polyimide sheet surface is coated with copper in the absence of an adhesive. The polyimide surface is treated with a one phase aqueous solution comprising an alkylene diamine; an alkali metal hydroxide and a water miscible alcohol to render the surface uniformly and substantially completely textured. The treated surface then is treated with a catalyst, coated with cobalt or nickel and then coated with copper. The laminate produced passes the IPC tests for peel strength and solder float.Type: GrantFiled: July 30, 1987Date of Patent: May 23, 1989Assignee: Polyonics CorporationInventors: Philip D. Knudsen, Daniel P. Walsh