Patents by Inventor Philip D. Knudsen

Philip D. Knudsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4725504
    Abstract: One or both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.
    Type: Grant
    Filed: February 24, 1987
    Date of Patent: February 16, 1988
    Assignee: Polyonics Corporation
    Inventors: Philip D. Knudsen, Daniel P. Walsh