Patents by Inventor Philip D. Schumaker

Philip D. Schumaker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7292326
    Abstract: The present invention features a system to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The system senses relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: November 6, 2007
    Assignee: Molecular Imprints, Inc.
    Inventors: Pawan Kumar Nimmakayala, Tom H. Rafferty, Alireza Aghili, Byung-Jin Choi, Philip D. Schumaker, Daniel A. Babbs
  • Publication number: 20070246850
    Abstract: A method for detecting a particle between a nanoimprint mold assembly and a substrate in a nanoimprint lithography system.
    Type: Application
    Filed: April 19, 2007
    Publication date: October 25, 2007
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventor: Philip D. Schumaker
  • Publication number: 20070231981
    Abstract: A method of patterning a substrate comprising a plurality of fields, including, inter alia, positioning a first volume of fluid on a first subset of the plurality of fields of the substrate, with the first volume of fluid being subjected to a first evaporation time; positioning a second volume of fluid on a second subset of the plurality of fields of the substrate, differing from the first subset, with the second volume of fluid being subjected to a second evaporation time, differing from the first evaporation time; and patterning the first and second subsets of the plurality of fields, with the first subset of the plurality of fields being patterned prior to the second subset of the plurality of fields being patterned, with a volume associated with the second subset of the plurality of fields being greater than a volume associated with the first subset of the plurality of fields to compensate for the second evaporation time being greater than the first evaporation time.
    Type: Application
    Filed: March 28, 2007
    Publication date: October 4, 2007
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Sidlgata V. Sreenivasan, Philip D. Schumaker
  • Publication number: 20070231421
    Abstract: A imprint lithography system operable for imprinting a pattern into a material deposited between an imprint mold and a substrate, the system including, inter alia, a first set of imaging units positioned at a first angle relative to normal of the substrate; and a second set of imaging units positioned at a second angle relative to normal of the substrate, wherein the first and second angles are not equal to each other.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 4, 2007
    Applicant: Molecular Imprints, Inc.
    Inventors: Pawan Kumar Nimmakayala, Byung-Jin Choi, Tom H. Rafferty, Philip D. Schumaker
  • Patent number: 7136150
    Abstract: The present invention is directed to providing a template with alignment marks that are opaque to selective wavelength of light. In one embodiment, a template is provided having patterning areas and a template, with the template mark being formed from metal and disposed outside of the patterning areas. The alignment marks may be surrounded by a moat to prevent curable liquid from being in superimposition therewith during imprinting. In this manner, opaque alignment marks may be employed without degrading the quality of the pattern formed during imprinting.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: November 14, 2006
    Assignee: Molecular Imprints, Inc.
    Inventors: Sidlgata V. Sreenivasan, Philip D. Schumaker
  • Patent number: 6978229
    Abstract: A computer implemented method for statistical modeling and simulation of the impact of global variation and local mismatch on the performance of integrated circuits, comprises the steps of: estimating a representation of component mismatch from device performance measurements in a form suitable for circuit simulation; reducing the complexity of statistical simulation by performing a first level principal component or principal factor decomposition of global variation, including screening; further reducing the complexity of statistical simulation by performing a second level principal component decomposition including screening for each factor retained in the first level principal component decomposition step to represent local mismatch; and performing statistical simulation with the joint representation of global variation and local mismatch obtained in the second level principal component decomposition step.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: December 20, 2005
    Assignee: PDF Solutions, Inc.
    Inventors: Sharad Saxena, Carlo Guardiani, Philip D. Schumaker, Patrick D. McNamara, Dale Coder