Patents by Inventor Philip Damberg

Philip Damberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic adaptors, assemblies and methods
    Publication number: 20040217461
    Abstract: A first microelectronic element such as a semiconductor chip is mounted to a circuit board using an adaptor which has a region extending beneath the first microelectronic element and an additional region which may be folded over the first microelectronic element or which may project laterally from the first microelectronic element. The adaptor includes a functional element in the additional region, such as a further microelectronic element or an array of terminals for mounting another element. The assembly provides the benefits of a stacked chip assembly or other mustachio module, but can be made without the need for a special prepackaged stacked chip assembly. The adaptor can be configured so that it does not materially increase the height of the first microelectronic element above the circuit board.
    Type: Application
    Filed: June 7, 2004
    Publication date: November 4, 2004
    Applicant: Tessera, Inc.
    Inventor: Philip Damberg
  • Microelectronic adaptors, assemblies and methods
    Patent number: 6765288
    Abstract: A first microelectronic element such as a semiconductor chip is mounted to a circuit board using an adaptor which has a region extending beneath the first microelectronic element and an additional region which may be folded over the first microelectronic element or which may project laterally from the first microelectronic element. The adaptor includes a functional element in the additional region, such as a further microelectronic element or an array of terminals for mounting another element. The assembly provides the benefits of a stacked chip assembly or other mustachio module, but can be made without the need for a special prepackaged stacked chip assembly. The adaptor can be configured so that it does not materially increase the height of the first microelectronic element above the circuit board.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: July 20, 2004
    Assignee: Tessera, Inc.
    Inventor: Philip Damberg
  • Microelectronic adaptors, assemblies and methods
    Publication number: 20040021211
    Abstract: A first microelectronic element such as a semiconductor chip is mounted to a circuit board using an adaptor which has a region extending beneath the first microelectronic element and an additional region which may be folded over the first microelectronic element or which may project laterally from the first microelectronic element. The adaptor includes a functional element in the additional region, such as a further microelectronic element or an array of terminals for mounting another element. The assembly provides the benefits of a stacked chip assembly or other mustachio module, but can be made without the need for a special prepackaged stacked chip assembly. The adaptor can be configured so that it does not materially increase the height of the first microelectronic element above the circuit board.
    Type: Application
    Filed: September 6, 2002
    Publication date: February 5, 2004
    Applicant: Tessera, Inc.
    Inventor: Philip Damberg
  • Methods of making microelectronic assemblies including folded substrates
    Publication number: 20030168725
    Abstract: A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.
    Type: Application
    Filed: October 28, 2002
    Publication date: September 11, 2003
    Applicant: Tessera, Inc.
    Inventors: Michael Warner, Philip Damberg, John B. Riley, David Gibson, Young-Gon Kim, Belgacem Haba, Vernon Solberg
  • METHODS OF MAKING MICROELECTRONIC ASSEMBLIES USING BONDING STAGE AND BONDING STAGE THEREFOR
    Publication number: 20030054627
    Abstract: A method of making a microelectronic assembly comprises connecting a lead to a contact on a microelectronic element and to a stage. The microelectronic element is juxtaposed with a microelectronic component and the lead is disconnected from the stage. The lead is bonded to a terminal pad on the microelectronic component. A stage for making a microelectronic assembly has a conduit for introducing a bonding tool toward a lead bonded to the stage and extending across the conduit while the microelectronic element is juxtaposed with the microelectronic component.
    Type: Application
    Filed: September 14, 2001
    Publication date: March 20, 2003
    Inventors: Jim Behlen, Philip Damberg, Rene Kunz
  • Methods of making microelectronic assemblies using bonding stage and bonding stage therefor
    Patent number: 6534392
    Abstract: A method of making a microelectronic assembly comprises connecting a lead to a contact on a microelectronic element and to a stage. The microelectronic element is juxtaposed with a microelectronic component and the lead is disconnected from the stage. The lead is bonded to a terminal pad on the microelectronic component. A stage for making a microelectronic assembly has a conduit for introducing a bonding tool toward a lead bonded to the stage and extending across the conduit while the microelectronic element is juxtaposed with the microelectronic component.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: March 18, 2003
    Assignee: Tessera, Inc.
    Inventors: Jim Behlen, Philip Damberg, Rene Kunz
  • Low-height multi-component assemblies
    Publication number: 20030048624
    Abstract: A microelectronic assembly has a first microelectronic element, a second microelectronic element, and a structure which projects downwardly from the second microelectronic element and at least partially encompassing the first microelectronic element. The structure is at least partially flexible. A method of making a microelectronic assembly with a structure that is at least partially flexible is also disclosed.
    Type: Application
    Filed: August 21, 2002
    Publication date: March 13, 2003
    Applicant: Tessera, Inc.
    Inventors: Philip Damberg, Craig S. Mitchell, John B. Riley, Michael Warner