Patents by Inventor Philip Jason Stephanou

Philip Jason Stephanou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8584522
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: November 19, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra Vaman Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Publication number: 20130278609
    Abstract: This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems, and related processes. In one aspect, a device includes an evanescent-mode electromagnetic-wave cavity resonator. In some implementations, the resonator includes an isotropically-etched cavity operable to support one or more evanescent electromagnetic wave modes. In some implementations, the resonator also includes a cavity ceiling arranged to form a volume in conjunction with the isotropically-etched cavity. In some implementations, the resonator also includes a capacitive tuning structure having a portion that is located at least partially within the volume so as to support the evanescent electromagnetic wave modes. In some implementations, a distal surface of the tuning structure is separated from the closest surface to it by a gap distance, a resonant electromagnetic wave mode of the cavity resonator being dependent at least partially on the gap distance.
    Type: Application
    Filed: April 19, 2012
    Publication date: October 24, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason Stephanou, Sang-June Park, Ravindra V. Shenoy
  • Publication number: 20130278998
    Abstract: This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems, and related processes. In one aspect, a device includes an evanescent-mode electromagnetic-wave cavity resonator. In some implementations, the cavity resonator includes a lower cavity portion and an upper cavity portion that together form a volume. The cavity resonator also includes an in-plane lithographically-defined resonator structure having a portion that is located at least partially within the volume to support one or more evanescent electromagnetic wave modes. In some implementations, an upper surface of the resonator structure is connected with the upper cavity portion while a lower mating surface is connected with the lower cavity portion.
    Type: Application
    Filed: April 19, 2012
    Publication date: October 24, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason Stephanou, Sang-June Park, Ravindra V. Shenoy
  • Publication number: 20130278542
    Abstract: A touch sensor may include a digital resistive touch (DRT) sensor architecture that is substantially free of air gaps. The DRT touch sensor may include a layer of force-sensitive resistor (FSR) material on an array of row and column electrodes. The electrodes may be formed on a substantially transparent substrate. Near the intersection of each row and column, one or more thin transparent patterned conductive bridges may be situated above the FSR. The conductive bridges may be configured for electrical connection with row and column electrodes when force is applied to the conductive bridge or surface of the touch sensor. Some touch sensors may include both DRT and projected capacitive touch (PCT) functionality.
    Type: Application
    Filed: April 23, 2012
    Publication date: October 24, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason Stephanou, Nicholas Ian Buchan, David William Burns, Kristopher Andrew Lavery, Srinivasan Kodaganallur Ganapathi
  • Publication number: 20130278359
    Abstract: This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems, and related processes. In one aspect, a method includes providing a first substrate and a second substrate. In some implementations, the first substrate includes a cavity ceiling, an array of dielectric spacers, and an assembly platform arranged adjacent the array of dielectric spacers opposite the cavity ceiling surface. The assembly platform includes a plurality of post tops. In some implementations, the second substrate has an array of cavities and an array of resonator posts. In some implementations, the method includes mating the first substrate with the second substrate, connecting the post tops with the posts to form an array that includes a plurality of evanescent-mode electromagnetic wave cavity resonators, wherein at least a statically-defined magnitude of a gap distance between the distal surface of each post top and the cavity ceiling is defined by the dielectric spacers.
    Type: Application
    Filed: April 19, 2012
    Publication date: October 24, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason Stephanou, Sang-June Park, Ravindra V. Shenoy
  • Publication number: 20130278610
    Abstract: This disclosure provides implementations of electromechanical systems (EMS) resonator structures, devices, apparatus, systems, and related processes. In one aspect, a device includes an evanescent-mode electromagnetic-wave cavity resonator that includes a cavity operable to support one or more evanescent electromagnetic wave modes. The resonator includes a cavity ceiling arranged to form a volume in conjunction with the cavity. The resonator also includes a capacitive tuning structure. In some implementations, the resonator also includes a post top positioned at a distal surface of the capacitive tuning structure. In some implementations, the post top has a dimension that is larger than a corresponding dimension of the capacitive tuning structure. In some implementations, a distal surface of the post top is separated from a surface by a gap distance, a resonant electromagnetic wave mode of the cavity resonator being dependent at least partially upon the gap distance and the dimension of the post top.
    Type: Application
    Filed: April 19, 2012
    Publication date: October 24, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason Stephanou, Sang-June Park, Ravindra V. Shenoy
  • Patent number: 8516886
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: August 27, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra Vaman Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Patent number: 8516887
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: August 27, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Cenk Acar, Ravindra Vaman Shenoy, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou
  • Publication number: 20130181893
    Abstract: This disclosure provides systems, methods and apparatus for glass electromechanical systems (EMS) electrostatic devices. In one aspect, a glass EMS electrostatic device includes sidewall electrodes. Structural components of a glass EMS electrostatic device such as stationary support structures, movable masses, coupling flexures, and sidewall electrode supports, can be formed from a single glass body. The glass body can be a photochemically etched. In some implementations, pairs of sidewall electrodes can be arranged in interdigitated comb or parallel plate configurations and can include plated metal layers and narrow capacitive gap spacing.
    Type: Application
    Filed: April 17, 2012
    Publication date: July 18, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Justin Phelps Black, Ravindra V. Shenoy, Jon Bradley Lasiter, Philip Jason Stephanou
  • Publication number: 20130136280
    Abstract: This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 30, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason Stephanou, David William Burns, Ravindra V. Shenoy
  • Publication number: 20130127879
    Abstract: This disclosure provides systems, methods and apparatus for glass-encapsulated pressure sensors. In one aspect, a glass-encapsulated pressure sensor may include a glass substrate, an electromechanical pressure sensor, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, glass frit, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may partially define a port for the electromechanical pressure sensor at an edge of the glass-encapsulated pressure sensor. In some configurations, the cover glass may form a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical pressure sensor.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 23, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: David William Burns, Philip Jason Stephanou, Ravindra V. Shenoy, Kurt Edward Petersen
  • Publication number: 20130057557
    Abstract: This disclosure provides implementations of high surface area stacked layered metallic structures, devices, apparatus, systems, and related methods. A plurality of stacked layers on a substrate may be manufactured from a plating bath including a first metal and a second metal. A modulated plating current can deposit alternate first metal layers and alloy layers, the alloy layers including the first metal and the second metal. Gaps between the alloy layers can be formed by selectively etching some portions of the first metal layers to define a stacked layered structure. Stacked layered structures may be useful in applications to form capacitors, inductors, catalytic reactors, heat transfer tubes, non-linear springs, filters, batteries, and heavy metal purifiers.
    Type: Application
    Filed: September 7, 2011
    Publication date: March 7, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Ravindra Vaman Shenoy, Philip Jason Stephanou, Ana Rangelova Londergan, Evgeni Petrovich Gousev
  • Publication number: 20130051587
    Abstract: This disclosure provides systems, methods and apparatus for sense elements in an electromechanical microphone device. In one aspect, a piezoelectric sense element may include a glass substrate, electrode layers, piezoelectric layers, and elastic layers. The elastic layers may serve to modify the neutral plane of the piezoelectric sense element. Including an elastic layer or layers to modify the neutral plane of the piezoelectric sense element may serve to configure the sense element such that the piezoelectric layer generates a voltage in response to a sound wave or may serve to increase the sensitivity of the sense element.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason STEPHANOU, David William BURNS
  • Publication number: 20130050155
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan
  • Publication number: 20130051586
    Abstract: This disclosure provides systems, methods and apparatus for glass-encapsulated microphones. In one aspect, a glass-encapsulated microphone may include a glass substrate, an electromechanical microphone device, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may define an aperture for the electromechanical microphone device at an edge of the glass-encapsulated microphone. In some configurations, the cover glass may define a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical microphone device.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason STEPHANOU, David William BURNS
  • Publication number: 20130050228
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan
  • Publication number: 20130050227
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan
  • Publication number: 20120234093
    Abstract: This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device.
    Type: Application
    Filed: March 15, 2011
    Publication date: September 20, 2012
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Justin Phelps Black, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Kurt Edward Petersen, Cenk Acar, Ravindra Vaman Shenoy, Nicholas Ian Buchan
  • Publication number: 20110265568
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.
    Type: Application
    Filed: December 30, 2010
    Publication date: November 3, 2011
    Applicant: Qualcomm MEMS Technologies, Inc.
    Inventors: Philip Jason Stephanou, David William Burns, Ravindra Vaman Shenoy
  • Publication number: 20110270569
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using x-axis gyroscopes, y-axis gyroscopes, z-axis gyroscopes, two-axis accelerometers and three-axis accelerometers. Combining fabrication processes for such devices can enable the monolithic integration of six inertial sensing axes on a single substrate, such as a single glass substrate. Such devices may be included in a mobile device, such as a mobile display device.
    Type: Application
    Filed: December 30, 2010
    Publication date: November 3, 2011
    Applicant: Qualcomm MEMS Technologies, Inc.
    Inventors: Philip Jason Stephanou, Cenk Acar, Ravindra Vaman Shenoy, David William Burns, Justin Phelps Black, Kurt Edward Petersen, Srinivasan Kodaganallur Ganapathi