Abstract: A method for inspecting a transparent workpiece comprises: directing light from an illumination source onto a plurality of defects formed in the transparent workpiece, wherein the plurality of defects extends in a defect direction, wherein the transparent workpiece comprises a first surface and a second surface; detecting a scattering image signal from light scattered by the plurality of defects using an imaging system, wherein an imaging axis of the imaging system extends at a non-zero imaging angle relative to the defect direction, wherein entireties of at least a subset of the plurality of defects are within a depth of field of the imaging system; and generating a three-dimensional image of at least one of the plurality of defects based on the scattering signal.

Abstract: Apparatuses and systems for pedestals are provided. An example pedestal may have a body with an upper annular seal surface that is planar, perpendicular to a vertical center axis of the body, and has a radial thickness, a lower recess surface offset from the upper annular seal surface, and a plurality of micro-contact areas (MCAs) protruding from the lower recess surface, each MCA having a top surface offset from the lower recess surface by a second distance less, and one or more electrodes within the body. The upper annular seal surface may be configured to support an outer edge of a semiconductor substrate when the semiconductor substrate is being supported by the pedestal, and the upper annular seal surface and the tops of the MCAs may be configured to support the semiconductor substrate when the semiconductor substrate is being supported by the pedestal.

Abstract: A system to process a semiconductor substrate includes a substrate support assembly configured to support the semiconductor substrate. The substrate support assembly includes M resistive heaters respectively arranged in M zones in a layer of the substrate support assembly, where M is an integer greater than 1. The layer is adjacent to the semiconductor substrate. The substrate support assembly includes N temperature sensors arranged at N locations in the layer, where N is an integer greater than 1 and less than or equal to M. The system further includes a controller configured to control one or more of the M resistive heaters based on a temperature sensed by one of the N temperature sensors and average temperatures of one or more of the M zones.

Abstract: A pedestal is arranged in a processing chamber to support a substrate on a top surface of the pedestal. A first annular recess in the pedestal extends downwardly from the top surface of the pedestal and radially inwardly from an outer edge of the pedestal towards an outer edge of the substrate. The first annular recess has an inner diameter that is greater than a diameter of the substrate. An annular ring made of a dielectric material is arranged around the substrate in the first annular recess. A second annular recess in the pedestal is located under the annular ring. The second annular recess has a height and extends radially inwardly from the outer edge of the pedestal towards the outer edge of the substrate.

Abstract: A method for evacuating a volume below a substrate in a substrate processing system includes arranging the substrate on a lift mechanism of a substrate support to define the volume below the substrate between the substrate and an upper surface of the substrate support. An evacuation step is initiated to evacuate the volume below the substrate. The evacuation step includes pumping down the volume below the substrate at least one of through and around the lift mechanism. The lift mechanism is lowered during the evacuation step to position the substrate on the upper surface of the substrate support and the evacuation step is terminated.

Abstract: There is disclosed a method of forming a polymer coated sulphur cured rubber composition wherein the bond strength between the polymer coating and the sulphur cured rubber is surprisingly great. The method includes providing a sulphur curable rubber composition comprising a compound including at least one thiol group, and/or contacting a sulphur curable rubber composition with a compound including at least one thiol group, and contacting the sulphur curable composition with a second polymeric precursor including a diallylamide group. The compound including at least one thiol group and the second polymeric precursors are reacted together to form a polymeric layer; and the sulphur curable rubber composition is cured to form a polymer coated sulphur cured rubber composition.

Abstract: The disclosed container defines (i) an “interior” configured to interact with a fluid and/or developing plants, and (ii) an “exterior” that at least partially defines a perimeter around the interior. The disclosed container may further include stacking features/elements which allow one container to be stacked/nested one upon the other. The disclosed container may further include features/elements which enable one container to be connected adjacent to the other. The disclosed container may further include (i) features/elements for delivering fluid, (ii) features/elements for draining fluid, and (iii) features/elements for supporting developing plants that are conducive to their growing within the disclosed container.

Abstract: Apparatuses and systems for pedestals are provided. An example pedestal may have a body with an upper annular seal surface that is planar, perpendicular to a vertical center axis of the body, and has a radial thickness, a lower recess surface offset from the upper annular seal surface, and a plurality of micro-contact areas (MCAs) protruding from the lower recess surface, each MCA having a top surface offset from the lower recess surface by a second distance less, and one or more electrodes within the body. The upper annular seal surface may be configured to support an outer edge of a semiconductor substrate when the semiconductor substrate is being supported by the pedestal, and the upper annular seal surface and the tops of the MCAs may be configured to support the semiconductor substrate when the semiconductor substrate is being supported by the pedestal.

Abstract: A wheelie bar wrench system is configured for adjusting a height of a wheelie bar. The wheelie bar wrench system includes a wrench and a slider assembly. The wrench includes a shaft portion including a plurality of detents spaced along a longitudinal axis of the wrench. The slider assembly includes a slider body, a retractable device, and a laser device. The slider body includes a shaft opening configured to receive the shaft portion therein such that the slider assembly is moveable along the shaft portion. The retractable device extends through a first opening defined through the slider body and selectively engages the detents in the shaft portion as the slider assembly moves along the shaft portion. The laser device extends through a second opening defined through the slider body and is configured to emit a laser beam for use in adjusting the height of the wheelie bar.

Abstract: A system to deposit a film on a substrate using atomic layer deposition includes a pedestal arranged in a processing chamber to support the substrate on a top surface of the pedestal when depositing the film on the substrate. A first annular recess in the pedestal extends downwardly from the top surface of the pedestal and radially inwardly from an outer edge of the pedestal towards an outer edge of the substrate. The first annular recess has an inner diameter that is greater than a diameter of the substrate. An annular ring is made of a dielectric material and is arranged around the substrate in the first annular recess. A second annular recess in the pedestal is located under the annular ring. The second annular recess has a height and extends radially inwardly from the outer edge of the pedestal towards the outer edge of the substrate.

Abstract: A determination is made whether a requested transaction of a certain type or class is available (i.e., suitable for execution or queueing) within a processing environment. In the case that a transaction of the certain type or class is not available, the request to be rejected is enabled, thus avoiding queuing of the requested transaction. Embodiments may thus provide a mechanism to protect a processing environment by avoiding the overhead of creating and removing specific transactions of the certain type or class.

Abstract: A substrate processing system is provided and includes a substrate support, a memory, and calibration, operating parameter, and solving modules. The substrate support supports a substrate and includes temperature control elements. The memory stores, for the temperature control elements, temperature calibration values and sensitivity calibration values. The calibration module, during calibration of the temperature control elements, performs a first calibration process to determine the temperature calibration values or a second calibration process to determine the sensitivity calibration values. The sensitivity calibration values relate at least one of trim amounts or deposition amounts to temperature changes. The operating parameter module determines operating parameters for the temperature control elements based on the temperature and sensitivity calibration values.

Abstract: A sensor system includes a first member that extends along a rotational axis and has a surface disposed circumferentially about the rotational axis. A conductive element is disposed on the surface of the first member and disposed about the rotational axis. A second member extends along the rotational axis. A rotational position between the first member and the second member is adjustable. A target is mounted to and rotatable with the second member and is movable relative to the second member between first and second positions. The target is spaced apart from the conductive element in both the first and second positions and is spaced further from the conductive element in the second position compared to the first position. The conductive element detects a change in movement of the target from the first position to the second position for any rotational position between the first member and the second member.

Abstract: The present disclosure relates to a system for a semiconductor processing. The system includes a semiconductor processing chamber having a plurality of processing stations, a plurality of manifold trunks, a plurality of valves, and a plurality of fluid manifolds. Each manifold trunk includes an outlet, a common flowpath, a plurality of trunk inlets, a plurality of orifices, and a plurality of valve interfaces.