Abstract: The present invention is related to a method for aligning and bonding a first element (1) and a second element (2), comprising: obtaining a first element (1) having at least one protrusion, the protrusion having a base portion (12) made of a first material and an upper portion (13) made of a second, deformable material, different from the first material; obtaining a second element (2) having a first main surface and second main surface (8) and at least one through-hole between the first and second main surface; placing the first and second element onto each other; receiving in the through-hole of the second element (2) the protrusion of the first element (1), the protrusion being arranged and constructed so as to extend from an opening of the through-hole in the first main surface to a position beyond an opening of the through-hole in the second main surface (8); deforming the deformable portion (13) of the protrusion, such that the deformed portion mechanically fixes the second element (2) on the first el

Abstract: An electrostatically actuatable micro electromechanical device is provided with enhanced reliability and lifetime. The electrostatically actuatable micro electromechanical device comprises: a substrate, a first conductor fixed to the top layer of the substrate, forming a fixed electrode, a second conductor fixed to the top layer of the substrate, and a substrate area. The second conductor is electrically isolated from the first conductor and comprises a moveable portion, suspended at a predetermined distance above the first conductor, the moveable portion forming a moveable electrode which approaches the fixed electrode upon applying an actuation voltage between the first and second conductors. The selected substrate surface area is defined as the orthogonal projection of the moveable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess is provided in at least the top layer of the substrate.

Abstract: An electrostatically actuatable micro electromechanical device is provided with enhanced reliability and lifetime. The electrostatically actuatable micro electromechanical device comprises: a substrate, a first conductor fixed to the top layer of the substrate, forming a fixed electrode, a second conductor fixed to the top layer of the substrate, and a substrate area. The second conductor is electrically isolated from the first conductor and comprises a moveable portion, suspended at a predetermined distance above the first conductor, the moveable portion forming a moveable electrode which approaches the fixed electrode upon applying an actuation voltage between the first and second conductors. The selected substrate surface area is defined as the orthogonal projection of the moveable portion on the substrate between the first and second conductors. In the substrate surface area at least one recess is provided in at least the top layer of the substrate.

Abstract: A method is disclosed for packaging a device, e.g., for bio-medical applications. In one aspect, the method includes obtaining a component on a substrate and separating the component and a first part of the substrate from a second part of the substrate using at least one physical process inducing at least one sloped side wall on the first part of the substrate. The method also includes providing an encapsulation for the chip. The resulting packaged chip advantageously has a good step coverage resulting in a good hermeticity, less sharp edges resulting in a reduced risk of damaging or infection after implantation and has a relatively small packaged volume compared to conventional big box packaging techniques.

Abstract: Disclosed are methods for forming semiconductor devices and the semiconductor devices thus obtained. In one embodiment, the method may include providing a semiconductor wafer comprising a surface, forming on the surface at least one device, forming a release layer at least in an area of the surface that encircles the at least one device, forming on the release layer at least one wall structure around the at least one device, and forming at least one cap on the at least one wall structure. In one embodiment, the device may include a substrate comprising a surface, at least one device formed on the surface, a release layer formed at least in an area of the surface that encircles the at least one device, at least one wall structure formed around the at least one device, and at least one removable cap formed on the at least one wall structure.

Abstract: A method for providing an oxide layer on a semiconductor substrate is disclosed. In one aspect, the method includes obtaining a semiconductor substrate. The substrate may have a three-dimensional structure, which may comprise at least one hole. The method may also include forming an oxide layer on the substrate, for example, on the three-dimensional structure, by anodizing the substrate in an acidic electrolyte solution.

Abstract: The present invention is related to a method for aligning and bonding a first element (1) and a second element (2), comprising: obtaining a first element (1) having at least one protrusion, the protrusion having a base portion (12) made of a first material and an upper portion (13) made of a second, deformable material, different from the first material; obtaining a second element (2) having a first main surface and second main surface (8) and at least one through-hole between the first and second main surface; placing the first and second element onto each other; receiving in the through-hole of the second element (2) the protrusion of the first element (1), the protrusion being arranged and constructed so as to extend from an opening of the through-hole in the first main surface to a position beyond an opening of the through-hole in the second main surface (8); deforming the deformable portion (13) of the protrusion, such that the deformed portion mechanically fixes the second element (2) on the first el

Abstract: A method for the fabrication of electrical interconnects in a substrate is disclosed. In one aspect, the method includes providing a substrate having a first main surface. The method may further include producing a ring structure in the substrate from the first main surface, which surrounds an inner pillar structure and has a bottom surface. The method may further include filling the ring structure with a dielectric material. The method may further include providing a conductive inner pillar structure, thereby forming an interconnect structure, which forms an electrical path from the bottom surface up until the first main surface. This conductive inner pillar structure can for example be provided by removing the inner pillar structure leaving a pillar vacancy and partially filling the vacancy with a conductive material. The dielectric material may be applied in liquid phase.

Abstract: Methods for protecting metal surfaces against oxidation are provided. The methods can comprise a plasma treatment, a sintering treatment or a combination of the plasma and sintering treatment. Also provided is a method for bonding a wire on a metal bond pad using the methods for protecting a metal surface.