Patents by Inventor Pierangelo Magni
Pierangelo Magni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9324639Abstract: An electronic device includes a chip and a support element which supports the chip. Leads are provided to be electrically coupled to at least one terminal of the chip. A coupling element is mounted to a free region of the support element that is not occupied by the chip. The coupling element includes a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain an electrical coupling.Type: GrantFiled: June 19, 2015Date of Patent: April 26, 2016Assignee: STMicroelectronics S.r.l.Inventors: Pierangelo Magni, Roberto Rossi
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Patent number: 9324627Abstract: An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate.Type: GrantFiled: April 22, 2014Date of Patent: April 26, 2016Assignee: STMicroelectronics S.R.L.Inventors: Pierangelo Magni, Giuseppe Gattavari, Mark Andrew Shaw
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Publication number: 20160005678Abstract: An electronic device includes a chip and a support element which supports the chip. Leads are provided to be electrically coupled to at least one terminal of the chip. A coupling element is mounted to a free region of the support element that is not occupied by the chip. The coupling element includes a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain an electrical coupling.Type: ApplicationFiled: June 19, 2015Publication date: January 7, 2016Applicant: STMicroelectronics S.r.l.Inventors: Pierangelo Magni, Roberto Rossi
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Publication number: 20140312484Abstract: An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate.Type: ApplicationFiled: April 22, 2014Publication date: October 23, 2014Applicant: STMicroelectronics S.r.l.Inventors: Pierangelo MAGNI, Giuseppe GATTAVARI, Mark Andrew SHAW
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Patent number: 8808641Abstract: In a microfluidic assembly, a microfluidic device is provided with a body in which at least a first inlet for loading a fluid for analysis, and a buried area in fluid communication with the first inlet are defined. An analysis chamber is in fluid communication with the buried area and an interface cover is coupled in a fluid-tight manner above the microfluidic device. The interface cover is provided with a sealing portion in correspondence to the analysis chamber, operable to assume a first configuration, in which it leaves the analysis chamber open, and a second configuration, in which it closes the analysis chamber in a fluid-tight manner.Type: GrantFiled: December 23, 2008Date of Patent: August 19, 2014Assignee: STMicroelectronics S.r.l.Inventors: Pierangelo Magni, Roberto Brioschi
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Patent number: 8736038Abstract: There is provided a lead frame and a packaging method. The lead frame comprises a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.Type: GrantFiled: September 13, 2012Date of Patent: May 27, 2014Assignees: STMicroelectronics S.r.l., STMicroelectronics (Shenzhen) Manufacturing Co., Ltd.Inventors: Hui Jun Xiong, Pierangelo Magni
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Publication number: 20130075885Abstract: There is provided a lead frame and a packaging method. The lead frame comprises a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.Type: ApplicationFiled: September 13, 2012Publication date: March 28, 2013Applicants: STMICROELECTRONICS (SHENZHEN) MANUFACTURING Co., Ltd., STMICROELECTRONICS S.R.I.Inventors: HuiJun Xiong, Pierangelo Magni
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Publication number: 20090215194Abstract: In a microfluidic assembly, a microfluidic device is provided with a body in which at least a first inlet for loading a fluid for analysis, and a buried area in fluid communication with the first inlet are defined. An analysis chamber is in fluid communication with the buried area and an interface cover is coupled in a fluid-tight manner above the microfluidic device. The interface cover is provided with a sealing portion in correspondence to the analysis chamber, operable to assume a first configuration, in which it leaves the analysis chamber open, and a second configuration, in which it closes the analysis chamber in a fluid-tight manner.Type: ApplicationFiled: December 23, 2008Publication date: August 27, 2009Applicant: STMICROELECTRONICS, S.R.LInventors: Pierangelo Magni, Roberto Brioschi
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Patent number: 7238014Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.Type: GrantFiled: October 8, 2004Date of Patent: July 3, 2007Assignee: STMicroelectronics S.r.l.Inventors: Pierangelo Magni, Andrea Cigada
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Patent number: 7061697Abstract: A method is described for fixing a lens of an optical group with respect to an optical sensor in an image acquisition device comprising the steps of housing the optical sensor in a housing, fixing a lower holder of the optical group to the housing, aligning an upper holder of the optical group, wherein the lens is placed, with the sensor so as to align a focusing point of the lens with respect to the sensor, welding the upper holder to the lower holder. The welding step may be performed by means of ultrasounds.Type: GrantFiled: July 19, 2004Date of Patent: June 13, 2006Assignees: STMicroelectronics SA, STMicroelectronics S.R.L.Inventors: Pierangelo Magni, Remi Brechignac, Chek Lim Kho, Kum Weng Loo
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Publication number: 20050085033Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.Type: ApplicationFiled: October 8, 2004Publication date: April 21, 2005Applicant: STMicroelectronics S.r.l.Inventors: Pierangelo Magni, Andrea Cigada
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Publication number: 20050046973Abstract: A method is described for fixing a lens of an optical group with respect to an optical sensor in an image acquisition device comprising the steps of housing the optical sensor in a housing, fixing a lower holder of the optical group to the housing, aligning an upper holder of the optical group, wherein the lens is placed, with the sensor so as to align a focusing point of the lens with respect to the sensor, welding the upper holder to the lower holder. The welding step may be performed by means of ultrasounds.Type: ApplicationFiled: July 19, 2004Publication date: March 3, 2005Inventors: Pierangelo Magni, Remi Brechignac, Chek Kho, Kum Weng Loo
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Patent number: 6842300Abstract: An image-detecting device including: a body housing a sensor; a first supporting element, rigidly coupled with the body and defining a seat; and an objective including at least one optical unit having an optical axis. The seat forms a guide portion engaging directly and slidably an alignment portion formed by said optical unit to keep the optical axis orthogonal to the sensor.Type: GrantFiled: June 13, 2002Date of Patent: January 11, 2005Assignee: STMicroelectronics S.r.l.Inventors: Pierangelo Magni, Francesco Sala, Eric Christison, Andrea Giovanni Cigada
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Patent number: 6811738Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.Type: GrantFiled: December 26, 2001Date of Patent: November 2, 2004Assignee: STMicroelectronics S.r.l.Inventors: Pierangelo Magni, Andrea Cigada
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Publication number: 20030107825Abstract: An image-detecting device including: a body housing a sensor; a first supporting element, rigidly coupled with the body and defining a seat; and an objective including at least one optical unit having an optical axis. The seat forms a guide portion engaging directly and slidably an alignment portion formed by said optical unit to keep the optical axis orthogonal to the sensor.Type: ApplicationFiled: June 13, 2002Publication date: June 12, 2003Applicants: STMicroelectronics S.r.I., STMicroelectronics LimitedInventors: Pierangelo Magni, Francesco Sala, Eric Christison, Andrea Giovanni Cigada
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Publication number: 20020093120Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.Type: ApplicationFiled: December 26, 2001Publication date: July 18, 2002Applicant: STMicroelectronics S.r.I.Inventors: Pierangelo Magni, Andrea Cigada
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Patent number: 6281566Abstract: A semiconductor electronic device comprises a chip of a semiconductor material, a set of metal conductors adjacent to the plate, a set of wire leads joining selected points on the chip to the metal conductors, and a supporting metal plate formed of three portions having a total surface area which is substantially less than the surface area of the chip, and forming a H-shaped supporting structure. All this, except the ends of the metal conductors, is encapsulated within a plastic material body.Type: GrantFiled: September 25, 1997Date of Patent: August 28, 2001Assignee: SGS-Thomson Microelectronics S.r.l.Inventor: Pierangelo Magni
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Patent number: 6002173Abstract: A structure is disclosed which comprises a metal plate, a chip of a semiconductor material attached to the plate, terminal leads, interconnection wires between the leads and the metallized regions of the chip, and a polymer body encapsulating all this with the exception of a surface of the plate and part of the leads. To achieve improved bond between the polymer and the metal, predetermined areas of the plate and the leads have a higher roughness than 1 (R.sub.a .gtoreq.1 .mu.m).Type: GrantFiled: December 21, 1992Date of Patent: December 14, 1999Assignee: SGS-Thomson Microelectronics S.r.l.Inventors: Paolo Casati, Pierangelo Magni, Giuseppe Marchisi
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Patent number: 5735449Abstract: A method and apparatus for forming electric connections between predetermined bonding pads of semiconductor electronic devices and respective electric contact leads formed on a frame holding the devices in a tidy arrangement is disclosed. The apparatus includes a supporting structure, a conveyor for advancing the frame along a longitudinal direction in a work plane on the supporting structure, a bonding head, and a high-precision X-Y table carrying the bonding head for accurately setting the bonding head in the work plane. The bonding apparatus further includes a carriage guided on the supporting structure for movement in a transverse direction to the longitudinal direction, the X-Y table being mounted on the carriage. The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows.Type: GrantFiled: April 4, 1997Date of Patent: April 7, 1998Assignee: SGS-Thomson Microelectronics S. r. l.Inventor: Pierangelo Magni
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Patent number: 5660316Abstract: A method and apparatus for forming electric connections between predetermined bonding pads of semiconductor electronic devices and respective electric contact leads formed on a frame holding the devices in a tidy arrangement is available. The apparatus includes a supporting structure, a mechanism for advancing the frame along a longitudinal direction in a work plane on the supporting structure, a bonding head, and a high-precision X-Y table carrying the bonding head for accurately setting the bonding head in the work plane. The bonding apparatus further includes a carriage guided on the supporting structure for movement in a transverse direction to the longitudinal direction, the X-Y table being mounted on the carriage, The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows.Type: GrantFiled: March 30, 1995Date of Patent: August 26, 1997Assignee: SGS-Thomson Microelectronics S.r.l.Inventor: Pierangelo Magni