Abstract: An integrated circuit (IC) comprising an enhanced passivation scheme for pad openings and trenches is provided. In some embodiments, an interlayer dielectric (ILD) layer covers a substrate and at least partially defines a trench. The trench extends through the ILD layer from a top of the ILD layer to the substrate. A conductive pad overlies the ILD layer. A first passivation layer overlies the ILD layer and the conductive pad, and further defines a pad opening overlying the conductive pad. A second passivation layer overlies the ILD layer, the conductive pad, and the first passivation layer, and further lines sidewalls of the first passivation layer in the pad opening and sidewalls of the ILD layer in the trench. Further, the second passivation layer has a low permeability for moisture or vapor relative to the ILD layer.

Abstract: An embodiment of an adaptive video encoder may include technology to determine headset-related information including at least one of focus-related information and motion-related information, and determine one or more video encode parameters based on the headset-related information. Other embodiments are disclosed and claimed.

Abstract: Disclosed are a stress-resistant, creep-resistant, high-temperature resistant and high-insulation sheath material for a maglev train cable, and a manufacturing method and use thereof. A multiple chemical crosslinking structure is constructed by blending a functional polyvinylsilicone grease with ultra-high molecular weight polyethylene (UHMWPE) and a ceramicized silicone rubber as a cable material matrix and using electron beam irradiation. In addition, organic/inorganic fillers in the matrix can form physical crosslinking points in the material. A physical-chemical dual crosslinking structure is constructed in the matrix, which can limit the motion and relaxation of molecular chains and improve the interaction between the insulation layer and sheath layer and refractory layers such as fillers and mica tapes to avoid the relative displacement during the laying and operation and improve the high-temperature resistance, creep resistance and stress relaxation resistance of a UHMWPE cable sheath material.

Abstract: In a method of manufacturing a semiconductor device, a fin structure including a stacked layer of first and second semiconductor layers and a hard mask layer over the stacked layer is formed. A sacrificial cladding layer is formed over at least sidewalls of the exposed hard mask layer and stacked layer. An etching is performed to remove lateral portions of the sacrificial cladding layer, thereby leaving the sacrificial cladding layer on sidewalls of the exposed hard mask layer and stacked layer. A first dielectric layer and a second dielectric layer made of a different material than the first dielectric layer are formed. The second dielectric layer is recessed, and a third dielectric layer made of a different material than the second dielectric layer is formed on the recessed second dielectric layer. During the etching operation, a protection layer is formed over the sacrificial cladding layer.

Abstract: A non-woven protective clothing against blood and viruses is composed from a non-woven fabric layer, which has two surfaces; and a moisture-permeable layer, which is a porous film that is laminated to one of the surfaces of the non-woven fabric layer; and an elastic pore filling layer, which is a hydrophilic polyurethane. The elastic pore filling layer is coated or printed onto the surface of the moisture-permeable layer, and the thickness of the elastic pore filling layer is thinner than that of the moisture-permeable layer. The synthetic blood permeability of the non-woven protective clothing against blood and viruses can resist a pressure of 2.0 psi for one minute, and the Phi-X174 bacteriophage penetrability thereof can resist a pressure of 2.0 psi for one minute.

Abstract: Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

Abstract: A device is provided. The device includes multiple transistors, a first sense circuit, and a precharge circuit. The transistors are coupled to a tracking bit line and configured to generate a first tracking signal. The first sense circuit is configured to generate a first sense tracking signal in response to the first tracking signal. The precharge circuit is configured to generate, in response to a rising edge and a falling edge of the first sense tracking signal, a precharge signal for precharging data lines.

Abstract: This disclosure relates to methods for the treatment of neoplastic disorders by administering Compound 1, or a pharmaceutically acceptably salt thereof, on its own and/or as part of a conjugate or composition, and inducing production of at least one neoantigen.

Abstract: The present disclosure discloses a method for isolating and purifying Lactobacillus rhamnosus ZFM216 bacteriocin, the method including the following steps: preparing L. rhamnosus ZFM216 fermentation supernatant; treating the fermentation supernatant with macroporous adsorption resin method to obtain a crude protein extract; isolating the crude protein extract by gel chromatography to obtain a preliminary purified protein solution; and then performing purification by reversed-phase high performance liquid chromatography (HPLC) to obtain an L. rhamnosus ZFM216 bacteriocin solution. The present disclosure further provides use of the L. rhamnosus bacteriocin in anti-Staphylococcus aureus.

Abstract: Artificial intelligence (AI)-based guidance for an ultrasound device to improve capture of echo image views comprises receiving a plurality of the echo images captured by a probe of the ultrasound device, the ultrasound device including a display and a user interface (UI) that displays the echo images to a user. One or more neural networks process the echo images to continuously attempt to automatically classify the echo images by view type and generates corresponding classification confidence scores. The view type of the echo images are simultaneously displayed in the UI along with the echo images. Feedback indications are displayed in the UI of the ultrasound device to the user, where the feedback indications include which directions to move the probe of the ultrasound device so the probe can be placed in a correct position to capture and successfully classify the echo images.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to manage network slices. An example apparatus includes interface circuitry to acquire network information, machine-readable instructions, and at least one processor circuit to be programmed by the machine-readable instructions to reserve first network slices to satisfy service level objectives (SLOs) corresponding to first nodes, reserve second network slices to satisfy SLOs corresponding to second nodes, and reconfigure the first network slices to accept network communications from the second nodes when the network communications from the second nodes exceed a performance metric threshold.

Abstract: The present invention discloses a child safety seat with reversible ISOFIX connectors. Each side of a seat body is equipped with a single ISOFIX connection assembly and can be flipped forward or backward relative to the seat body, and the direction of the eccentric notch is adjustable during the flipping process by a self-rotating linkage assembly. After a direction change, the ISOFIX connection assembly the eccentric notch can be adjusted to a safety-compliant angle and connected to the ISOFIX sockets of the car seat.

Abstract: A composite film includes a first thermoplastic elastomer film layer and a second thermoplastic elastomer film layer, wherein the first thermoplastic elastomer film layer includes a first styrenic block copolymer. The second thermoplastic elastomer film layer is disposed on the first thermoplastic elastomer film layer, wherein the second thermoplastic elastomer film layer includes a second styrenic block copolymer, diffusion particles dispersed in the second thermoplastic elastomer film layer, and a surface microstructure disposed on the surface of the second thermoplastic elastomer film layer.

Abstract: A fault detection method, includes the following steps. A target sequence is received, the target sequence includes several data. A first moving average operation is performed on the target sequence to establish a first moving average sequence. A second moving average operation is performed on the target sequence to establish a second moving average sequence. A difference operation between the first moving average sequence and the second moving average sequence is performed to obtain a difference sequence, the difference sequence includes several difference values. An upper limit value is set. When one of the difference values is greater than the upper limit value, the target sequence is determines as abnormal.

Abstract: A vehicle-mounted charging apparatus and a vehicle. The vehicle-mounted charging apparatus includes a power conversion circuit and a housing. The housing is configured to accommodate the power conversion circuit. The power conversion circuit is configured to convert an input power supply into at least one of a first direct current or a second direct current. A plurality of electrical interfaces is disposed on an electrical interface mounting surface in the housing. The plurality of electrical interfaces includes one input power interface, two first direct current output interfaces, and one second direct current output interface. The input power interface is configured to be connected to an input end of the power conversion circuit. The plurality of electrical interfaces is disposed on a same surface, so that the external interfaces are appropriately arranged and highly integrated. This facilitates a vehicle layout, improves assembly simplicity.

Abstract: A compact appliance includes a housing that has a planar bottom surface and sidewalls that define a cavity. A cooking assembly is operably coupled to the housing. The cooking assembly includes heat conductors that are proximate to the planar bottom surface of the housing. A heating plate is operably coupled to the heat conductors and define a portion of the planar bottom surface of the housing. A seal is disposed around and coupled to the heating plate. A tray is selectively disposed within the cavity defined by the housing and removably coupled to the heating plate. The tray includes a ceramic coating.

Abstract: A graphene nanowalls (GNW), a manufacturing method thereof, an electrode and a supercapacitor are provided. The manufacturing method of a graphene nanowalls includes: placing a substrate in a microwave plasma apparatus; introducing a hydrocarbon gas and inert gas; and forming a graphene nanowalls on the substrate. The microwave plasma apparatus provides microwave frequency of less than 1 GHz.

Abstract: A cabinet for receiving an energy storage apparatus includes a substantially cube-shaped frame and a plurality of sheet-shaped concrete structures attached to the frame. The sheet-shaped concrete structure includes an ultra-high performance concrete (UHPC).

Abstract: Methods, apparatuses, and systems related to a metal sense line contact are described. An example apparatus includes a sense line pillar comprising a barrier material over a semiconductor substrate. The sense line pillar further includes a liner material adjacent the barrier material. The sense line pillar further includes a first metal material over the barrier material. The sense line pillar further includes a second metal material over the first metal material. The sense line pillar further includes a cap material over the second metal material. The apparatus further cell contacts between a plurality of sense line pillars.

Abstract: A device includes two BSI image sensor elements and a third element. The third element is bonded in between the two BSI image sensor elements using element level stacking methods. Each of the BSI image sensor elements includes a substrate and a metal stack disposed over a first side of the substrate. The substrate of the BSI image sensor element includes a photodiode region for accumulating an image charge in response to radiation incident upon a second side of the substrate. The third element also includes a substrate and a metal stack disposed over a first side of the substrate. The metal stacks of the two BSI image sensor elements and the third element are electrically coupled.