Patents by Inventor Ping Hu

Ping Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11635943
    Abstract: Described herein are hardware acceleration of random number generation for machine learning and deep learning applications. An apparatus (700) includes a uniform random number generator (URNG) circuit (710) to generate uniform random numbers and an adder circuit (750) that is coupled to the URNG circuit (710). The adder circuit hardware (750) accelerates generation of Gaussian random numbers for machine learning.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: April 25, 2023
    Assignee: Intel Corporation
    Inventors: Yiwen Guo, Anbang Yao, Dongqi Cai, Libin Wang, Lin Xu, Ping Hu, Shandong Wang, Wenhua Cheng
  • Publication number: 20230093823
    Abstract: Methods, apparatus, systems, and articles of manufacture for modifying a machine learning model are disclosed. An example apparatus includes a supervised branch inserter to insert a supervised branch into a machine learning model at an identified location, a first cluster generator to generate a first cluster of the inserted supervised branch using a first clustering technique, a second cluster generator to generate a second cluster of the inserted supervised branch using a second clustering technique, the second clustering technique different from the first clustering technique, a cluster joiner to join the first cluster and the second cluster to form a clustering block, the clustering block appended to an end of the supervised branch, and a propagation strategy executor to execute a propagation training strategy to modify a parameter of the machine learning model.
    Type: Application
    Filed: December 18, 2019
    Publication date: March 30, 2023
    Inventors: Anbang Yao, Ping Hu, Yangyuxuan Kang, Yurong Chen
  • Publication number: 20230084008
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a staircase structure disposed over a substrate. The staircase structure includes a plurality of layer stacks, where each layer stack is made of a first material layer over a portion of a second material layer. The staircase structure further includes a plurality of landing pads, where each landing pad is disposed over another portion of the second material layer of a respective layer stack.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 16, 2023
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao, Yu Ru Huang, Si Ping Hu, Lan Yao, Li Hong Xiao, A Man Zheng, Kun Bao, Haohao Yang
  • Publication number: 20230083030
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a staircase structure disposed over a substrate. The staircase structure includes a plurality of layer stacks, where each layer stack is made of a first material layer over a portion of a second material layer. The staircase structure further includes a plurality of landing pads, where each landing pad is disposed over another portion of the second material layer of a respective layer stack.
    Type: Application
    Filed: November 10, 2022
    Publication date: March 16, 2023
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao, Yu Ru Huang, Si Ping Hu, Lan Yao, Li Hong Xiao, A Man Zheng, Kun Bao, Haohao Yang
  • Patent number: 11566259
    Abstract: A CC-NBS-LRR gene NLR1-V encoded by the enduring and broad-spectrum gene Pm21 which is resistant to powdery mildew in the wheat-Haynaldia villosa 6VS/6AL translocation line in Nannong 9918, and an expression vector and use thereof. The ORF sequence of the NLR1-V gene having an NLR domain is as shown in SEQ ID NO: 1, and the encoded amino acid sequence is as shown in SEQ ID NO: 2.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: January 31, 2023
    Assignee: NANJING AGRICULTURAL UNIVERSITY
    Inventors: Liping Xing, Aizhong Cao, Ping Hu, Jiaqian Liu, Weihao Zhou, Chaofan Cui, Xiu'e Wang, Ruiqi Zhang, Shouzhong Zhang, Peidu Chen
  • Patent number: 11551335
    Abstract: Methods and systems are disclosed using camera devices for deep channel and Convolutional Neural Network (CNN) images and formats. In one example, image values are captured by a color sensor array in an image capturing device or camera. The image values provide color channel data. The captured image values by the color sensor array are input to a CNN having at least one CNN layer. The CNN provides CNN channel data for each layer. The color channel data and CNN channel data is to form a deep channel image that stored in a memory. In another example, image values are captured by sensor array. The captured image values by the sensor array are input a CNN having a first CNN layer. An output is generated at the first CNN layer using the captured image values by the color sensor array. The output of the first CNN layer is stored as a feature map of the captured image.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: January 10, 2023
    Assignee: Intel Corporation
    Inventors: Lin Xu, Liu Yang, Anbang Yao, Dongqi Cai, Libin Wang, Ping Hu, Shandong Wang, Wenhua Cheng, Yiwen Guo, Yurong Chen
  • Patent number: 11537851
    Abstract: Methods and systems are disclosed using improved training and learning for deep neural networks. In one example, a deep neural network includes a plurality of layers, and each layer has a plurality of nodes. The nodes of each L layer in the plurality of layers are randomly connected to nodes of an L+1 layer. The nodes of each L+1 layer are connected to nodes in a subsequent L layer in a one-to-one manner. Parameters related to the nodes of each L layer are fixed. Parameters related to the nodes of each L+1 layers are updated. In another example, inputs for the input layer and labels for the output layer of a deep neural network are determined related to a first sample. A similarity between different pairs of inputs and labels is estimated using a Gaussian regression process.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: December 27, 2022
    Assignee: Intel Corporation
    Inventors: Yiwen Guo, Anbang Yao, Dongqi Cai, Libin Wang, Lin Xu, Ping Hu, Shandong Wang, Wenhua Cheng, Yurong Chen
  • Publication number: 20220383216
    Abstract: A system for verifying scenario objects is described. The system generates, based on a historical market data model, a scenario object that includes an adjustment to a current market data object. The system then verifies that the scenario object comprises a valid scenario object by verifying that the scenario object does not violate one or more arbitrage conditions when applied to the current market data object. Upon generating the valid scenario object, the system calculates an adjusted market data object based on the valid scenario object and the current market data object.
    Type: Application
    Filed: July 25, 2019
    Publication date: December 1, 2022
    Inventors: Vijaya Malkapuram, Pekka A. Kauranen, Ping Hu, Edward Haag, Ashu Joglekar
  • Publication number: 20220370590
    Abstract: The present invention relates to a multivalent HPV immunogenic composition for preventing human papillomavirus (HPV) related diseases or infections and uses thereof. Said multivalent HPV immunogenic composition comprises: HPV virus-like particles assembled from L1 proteins of HPV Types 6, 11, 16, 18, 31, 33, 45, 52, and 58; and one or more HPV virus-like particles assembled from L1 proteins of other pathogenic HPV types. In one embodiment, said one or more other pathogenic HPV types are selected from HPV Types 35, 39, 51, 56 and 59. In one embodiment, at least one of said HPV virus-like particles is a chimeric HPV virus-like particle, and said chimeric HPV virus-like particle comprises one or more chimeric HPV L1 proteins.
    Type: Application
    Filed: January 19, 2022
    Publication date: November 24, 2022
    Inventors: Liangzhi Xie, Chunxia Luo, Wei Zhang, Xiaoyan Suo, Lin Pang, Ping Hu
  • Patent number: 11462503
    Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first interconnect layer including first interconnects is formed above a first substrate. A first bonding layer including first bonding contacts is formed above the first interconnect layer, such that each first interconnect is in contact with a respective first bonding contact. A second interconnect layer including second interconnects is formed above a second substrate. A second bonding layer including second bonding contacts is formed above the second interconnect layer, such that at least one second bonding contact is in contact with a respective second interconnect, and at least another second bonding contact is separated from the second interconnects. The first and second substrates are bonded in a face-to-face manner, such that each first bonding contact is in contact with one second bonding contact at a bonding interface.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: October 4, 2022
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen, Zi Qun Hua
  • Publication number: 20220281925
    Abstract: The present invention relates to chimeric papilloma virus L1 proteins and polynucleotides encoding thereof, and also to HPV virus-like particles and the preparation methods thereof. Said chimeric papilloma virus L1 protein comprises an N-terminal fragment derived from L1 protein of the first papilloma virus type, said N-terminal fragment maintains the immunogenicity of the L1 protein of the corresponding type of HPV; and a C-terminal fragment derived from L1 protein of the second papilloma virus type, said L1 protein of the second papilloma virus type has a better expression level and a better solubility compared to the L1 proteins of other HPV types; wherein said chimeric papilloma virus L1 proteins have the immunogenicity of the L1 proteins of the corresponding HPV types. Said chimeric papilloma virus L proteins have better expression amount and solubility for mass production of vaccines.
    Type: Application
    Filed: January 19, 2022
    Publication date: September 8, 2022
    Inventors: Liangzhi Xie, Chunxia Luo, Wei Zhang, Xiaoyan Suo, Lin Pang, Ping Hu
  • Publication number: 20220270919
    Abstract: Embodiments of a hybrid-bonded semiconductor structure are disclosed. The semiconductor structure comprises a first conductive structure and a second conductive structure in a base dielectric layer. The base dielectric layer has a non-flat top surface. A first top surface of the first conductive structure is non-coplanar with a second top surface of the second conductive structure. The semiconductor structure further comprises an alternating dielectric layer stack comprising a plurality of dielectric layers sequentially disposed on the base dielectric layer, wherein at least two of the plurality of dielectric layers have non-uniform thickness. The semiconductor structure further comprises a first lead wire and a second lead wire formed in the alternating dielectric layer stack and electrically connected to the first conductive structure and the second conductive structure, respectively.
    Type: Application
    Filed: May 3, 2022
    Publication date: August 25, 2022
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Meng YAN, Jifeng ZHU, Si Ping HU
  • Publication number: 20220270370
    Abstract: A Video Semantic Segmentation System (VSSS) is disclosed that performs accurate and fast semantic segmentation of videos using a set of temporally distributed neural networks. The VSSS receives as input a video signal comprising a contiguous sequence of temporally-related video frames. The VSSS extracts features from the video frames in the contiguous sequence and based upon the extracted features, selects, from a set of labels, a label to be associated with each pixel of each video frame in the video signal. In certain embodiments, a set of multiple neural networks are used to extract the features to be used for video segmentation and the extraction of features is distributed among the multiple neural networks in the set. A strong feature representation representing the entirety of the features is produced for each video frame in the sequence of video frames by aggregating the output features extracted by the multiple neural networks.
    Type: Application
    Filed: May 3, 2022
    Publication date: August 25, 2022
    Inventors: Federico Perazzi, Zhe Lin, Ping Hu, Oliver Wang, Fabian David Caba Heilbron
  • Patent number: 11419912
    Abstract: The present invention relates to compositions containing plant materials or extracts with inhibitory effect on a 5-HT3a and/or NK-1 receptor for preventing or treating idiopathic vomiting.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: August 23, 2022
    Assignee: Mars, Incorporated
    Inventors: Jean Soon Park, Ping Hu, Yakang Lin, Lori Ann Reinsalu
  • Publication number: 20220230268
    Abstract: Described herein are advanced artificial intelligence agents for modeling physical interactions. In one embodiment, an apparatus to provide an active artificial intelligence (AI) agent includes at least one database to store physical interaction data and compute cluster coupled to the at least one database. The compute cluster automatically obtains physical interaction data from a data collection module without manual interaction, stores the physical interaction data in the at least one database, and automatically trains diverse sets of machine learning program units to simulate physical interactions with each individual program unit having a different model based on the applied physical interaction data.
    Type: Application
    Filed: November 2, 2021
    Publication date: July 21, 2022
    Inventors: Anbang YAO, Dongqi CAI, Libin WANG, Lin XU, Ping HU, Shandong WANG, Wenhua CHENG, Yiwen GUO, Liu YANG, Yuqing HOU, Zhou SU
  • Publication number: 20220222492
    Abstract: Methods and systems for budgeted and simplified training of deep neural networks (DNNs) are disclosed. In one example, a trainer is to train a DNN using a plurality of training sub-images derived from a down-sampled training image. A tester is to test the trained DNN using a plurality of testing sub-images derived from a down-sampled testing image. In another example, in a recurrent deep Q-network (RDQN) having a local attention mechanism located between a convolutional neural network (CNN) and a long-short time memory (LSTM), a plurality of feature maps are generated by the CNN from an input image. Hard-attention is applied by the local attention mechanism to the generated plurality of feature maps by selecting a subset of the generated feature maps. Soft attention is applied by the local attention mechanism to the selected subset of generated feature maps by providing weights to the selected subset of generated feature maps in obtaining weighted feature maps.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 14, 2022
    Inventors: Yiwen GUO, Yuqing Hou, Anbang Yao, Dongqi Cai, Lin Xu, Ping Hu, Shandong Wang, Wenhua Cheng, Yurong Chen, Libin Wang
  • Publication number: 20220216099
    Abstract: Embodiments of methods for forming a hybrid-bonded semiconductor structure are disclosed. The method include disposing first second, third, and fourth dielectric layers, forming first and second openings by etching the fourth dielectric layer using a first etching selectivity, etching the third and fourth dielectric layers in the first and second openings respectively using a second etching selectivity, etching the second and third dielectric layers in the first and second openings using the first etching selectivity, etching the first dielectric layer in the first opening and the second dielectric layer in the second opening using the second etching selectivity, etching the first dielectric layer in the first and second openings using the first etching selectivity, and forming conductive material in the first and second openings.
    Type: Application
    Filed: March 24, 2022
    Publication date: July 7, 2022
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Meng YAN, Jifeng ZHU, Si Ping HU
  • Publication number: 20220207005
    Abstract: An object management system (OMS) receives a plurality of objects to be stored. The OMS identifies a subset of objects associated with a same time period and a same namespace from the plurality of objects and generates a batch object comprising the subset of objects. The OMS issues a write request to store the batch object in an object storage system (OSS) and stores, for each object in the subset of objects, a data structure comprising an identifier of the batch object and a position of the object within the batch object. Upon receiving a read request for an object, the OMS determines, based on the data structure, whether the object is stored in the OSS and issues a read request to the OSS based on the identifier of the batch object and the position of the object within the batch, if the objects is stored in the OSS.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Inventors: Anup Chenthamarakshan, Adam Faulkner, Ping Hu, Alexander Sosa
  • Publication number: 20220208677
    Abstract: Embodiments of methods and structures for forming a 3D integrated wiring structure are disclosed. The method can include forming an insulating layer on a front side of a first substrate; forming a semiconductor layer on a front side of the insulating layer; patterning the semiconductor layer to expose at least a portion of a surface of the insulating layer; forming a plurality of semiconductor structures over the front side of the first substrate, wherein the semiconductor structures include a plurality of conductive contacts and a first conductive layer; joining a second substrate with the semiconductor structures; performing a thinning process on a backside of the first substrate to expose the insulating layer and one end of the plurality of conductive contacts; and forming a conductive wiring layer on the exposed insulating layer.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 30, 2022
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jifeng ZHU, Jun CHEN, Si Ping HU, Zhenyu LU
  • Patent number: 11372317
    Abstract: A camera supporting device includes a supporting frame, an outer casing, a camera holding structure, and a linkage mechanism. The outer casing is rotatably connected to the supporting frame. The camera holding structure is rotatably connected to the supporting frame independently of the outer casing. The linkage mechanism incudes a driving part and a driven part kinematically connected to the driving part. The driving part is fixedly connected to the camera holding structure. The driven part is fixedly connected to the outer casing. An image-capturing device can be fixed on the camera holding structure. Through the camera holding structure driving the outer casing through the linkage mechanism, the outer casing can provide a wider angle range available for the image-capturing device to capturing exterior images.
    Type: Grant
    Filed: September 13, 2020
    Date of Patent: June 28, 2022
    Assignee: VIVOTEK INC.
    Inventors: Shao-Tzu Hsu, Ming-Wei Wang, Chang-Ping Hu, Hsiao-Lung Liang