Patents by Inventor Ping Hu

Ping Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190325203
    Abstract: An apparatus for dynamic emotion recognition in unconstrained scenarios is described herein. The apparatus comprises a controller to pre-process image data and a phase-convolution mechanism to build lower levels of a CNN such that the filters form pairs in phase. The apparatus also comprises a phase-residual mechanism configured to build middle layers of the CNN via plurality of residual functions and an inception-residual mechanism to build top layers of the CNN by introducing multi-scale feature extraction. Further, the apparatus comprises a fully connected mechanism to classify extracted features.
    Type: Application
    Filed: January 20, 2017
    Publication date: October 24, 2019
    Applicant: INTEL CORPORATION
    Inventors: Anbang Yao, Dongqi Cai, Ping Hu, Shandong Wang, Yurong Chen
  • Patent number: 10441623
    Abstract: The present invention relates to compositions containing plant materials or extracts with inhibitory effect on a 5-HT3a and/or NK-1 receptor for preventing or treating idiopathic vomiting.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: October 15, 2019
    Assignee: Mars, Incorporated
    Inventors: Jean Soon Park, Ping Hu, Yakang Lin, Lori Ann Reinsalu
  • Patent number: 10406096
    Abstract: The present invention relates to a skin care composition comprising an extract of Bursera simaruba seeds and a cosmetically acceptable topical carrier. Such composition is useful for improving skin barrier function and moisturization as well as improving signs of skin aging.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: September 10, 2019
    Assignee: Johnson & Johnson Consumer Inc.
    Inventors: Suhyoun Chon, Ya-Ping Hu, Khalid Mahmood, Apostolos Pappas, Ramine Parsa, Kurt A. Reynertson, Michael D. Southall
  • Patent number: 10370522
    Abstract: The invention provides a polyphenylene sulfide resin composition which comprises polyphenylene sulfide resin and a deformed cross-section glass fiber, wherein the chlorine content of the polyphenylene sulfide resin composition is equal to or lower than 1,000 ppm. The obtained polyphenylene sulfide resin composition is excellent in flowability, toughness and rigidity. The invention further provides a molding prepared from the polyphenylene sulfide resin composition and a manufacturing process for the polyphenylene sulfide resin composition. The polyphenylene sulfide resin composition is particularly suitable for products for forming frames of a portable computer, a mobile phone and a portable electronic device.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: August 6, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Kai Peng, Xianwen Tang, Qiang Liu, Fen Ouyang, Shunji Kono, Masashi Matsuda, Ping Hu, Ying Wai Julian Chan
  • Patent number: 10287549
    Abstract: Provided is a muscle stem cell in vitro culture method. A muscle stem cell is cultivated in vitro by using a cell culture medium of a cell factor added with a blood cell or a conditioned medium of the blood cell. Also provided is a culture medium used in the muscle stem cell in vitro culture method and an application thereof.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: May 14, 2019
    Assignee: Shanghai Institutes for Biological Sciences, Chinese Academy of Sciences
    Inventors: Ping Hu, Xin Fu, Jun Xiao
  • Publication number: 20190096810
    Abstract: Embodiments of semiconductor structures including word line contact structures for three-dimensional memory devices and fabrication methods for forming word line contact structures are disclosed. The semiconductor structures include a staircase structure having a plurality of steps, and each step includes a conductive layer disposed over a dielectric layer. The semiconductor structures further include a barrier layer disposed over a portion of the conductive layer of each step. The semiconductor structures also include an etch-stop layer disposed on the barrier layer and an insulating layer disposed on the etch-stop layer. The semiconductor structures also include a plurality of conductive structures formed in the insulating layer and each conductive structure is formed on the conductive layer of each step.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 28, 2019
    Applicant: Yangtze Technologies Co., Ltd.
    Inventors: Jifeng ZHU, Zhenyu LU, Jun CHEN, Si Ping HU, Xiaowang DAI, Lan YAO, Li Hong XIAO, A Man ZHENG, Kun BAO, Haohao YANG
  • Publication number: 20190088535
    Abstract: Embodiments of hybrid-bonded semiconductor structures and methods for forming a hybrid-bonded semiconductor structure are disclosed. The method can include providing a substrate and forming a base dielectric layer on the substrate. The method also includes forming first and second conductive structures in the base dielectric layer and disposing an alternating dielectric layer stack. Disposing alternating dielectric layer stack includes disposing a first dielectric layer on the base dielectric layer and the first and second conductive structures and sequentially disposing second, third, and fourth dielectric layers. The method further includes planarizing the disposed alternating dielectric layer stack and etching the alternating dielectric layer stack to form first and second openings using preset etching rates for each of the first, second, third, and fourth dielectric layers. The etching continues until at least portions of the first and second conductive structures are exposed.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 21, 2019
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Meng Yan, Jifeng Zhu, Si Ping Hu
  • Publication number: 20190081070
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a staircase structure disposed over a substrate. The staircase structure includes a plurality of layer stacks, where each layer stack is made of a first material layer over a portion of a second material layer. The staircase structure further includes a plurality of landing pads, where each landing pad is disposed over another portion of the second material layer of a respective layer stack.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 14, 2019
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Zhenyu LU, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao, Yu Ru Huang, Si Ping Hu, Lan Yao, Li Hong Xiao, A Man Zheng, Kun Bao, Haohao Yang
  • Publication number: 20190067106
    Abstract: Embodiments of methods and structures for forming a 3D integrated wiring structure are disclosed. The method can include forming a dielectric layer in a contact hole region at a front side of a first substrate; forming a semiconductor structure at the front side of the first substrate and the semiconductor structure having a first conductive contact, forming a recess at a backside of the first substrate to expose at least a portion of the dielectric layer; and forming a second conductive layer above the exposed dielectric layer to connect the first conductive contact. The 3D integrated wiring structure can include a first substrate having a contact hole region; a dielectric layer disposed in the contact hole region; a semiconductor structure formed at the front side of the first substrate, having a first conductive contact; a recess formed at the backside of the first substrate to expose at least a portion of the dielectric layer; and a second conductive layer above the exposed dielectric layer.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 28, 2019
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jifeng ZHU, Jun CHEN, Si Ping HU, Zhenyu LU
  • Publication number: 20190067105
    Abstract: Embodiments of methods and structures for forming a 3D integrated wiring structure are disclosed. The method can include forming a dielectric layer in a first substrate; forming a semiconductor structure having a first conductive contact over a front side of the first substrate; and forming a second conductive contact at a backside of the first substrate, wherein the second conductive contact extends through a backside of the dielectric layer and connects to a second end of the first conductive contact. The 3D integrated wiring structure can include a first substrate; a dielectric layer in the first substrate; a semiconductor structure over the front side of the first substrate, having a first conductive contact; and a second conductive contact at the backside of the first substrate, and the second conductive contact extends through a backside of the dielectric layer and connects to the second end of the first conductive contact.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 28, 2019
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jifeng ZHU, Jun CHEN, Si Ping HU, Zhenyu LU
  • Publication number: 20190067196
    Abstract: Embodiments of methods and structures for forming a 3D integrated wiring structure are disclosed. The method can include forming an insulating layer on a front side of a first substrate; forming a semiconductor layer on a front side of the insulating layer; patterning the semiconductor layer to expose at least a portion of a surface of the insulating layer; forming a plurality of semiconductor structures over the front side of the first substrate, wherein the semiconductor structures include a plurality of conductive contacts and a first conductive layer; joining a second substrate with the semiconductor structures; performing a thinning process on a backside of the first substrate to expose the insulating layer and one end of the plurality of conductive contacts; and forming a conductive wiring layer on the exposed insulating layer.
    Type: Application
    Filed: July 26, 2018
    Publication date: February 28, 2019
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jifeng ZHU, Jun CHEN, Si Ping HU, Zhenyu LU
  • Publication number: 20180342461
    Abstract: A sensing system including a substrate, at least one explicit device, at least one inner operation device, a plurality of conductors, and a plurality of conductive traces is provided. The substrate has a first surface and a second surface opposite to the first surface, and has a plurality of vias communicating the first surface and the second surface. The explicit device is disposed on the first surface. The explicit device includes a display, a sensor, or a combination thereof. The inner operation device is totally disposed on the second surface. The inner operation device includes a signal processor, a driver, or a combination thereof. The conductors are disposed in the vias, respectively, and connect the at least one explicit device with the at least one inner operation device. The conductive traces are disposed on at least one of the first surface and the second surface.
    Type: Application
    Filed: September 15, 2017
    Publication date: November 29, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Ting Liu, Shih-Ming Lin, Je-Ping Hu, Jung-Shiuan Liou
  • Patent number: 10130578
    Abstract: Low pH compositions for topical administration to skin are provided. They comprise a buffering agent having a pKa of about 2.8 to about 4.2 and a cosmetically acceptable active ingredient having a pKa within about 1 unit of the pKa of the buffering agent. The composition has a pH of about 3.3 to 4 and a buffer capacity of at least about 0.15. A method of increasing the topical delivery of a cosmetically acceptable active ingredient having a pKa of about 2.8 to about 4 is also provided.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: November 20, 2018
    Assignee: Johnson & Johnson Consumer Inc.
    Inventors: Anne-Sophie Brillouet, Marisa DeVita Dufort, Ali Fassih, Devin L. Garcia, Ya-Ping Hu, Wen-Hwa Ting Li, Ramine Parsa, Jyotsna Paturi, Dianne Rossetti, Ying Sun, Janet Wangari-Talbot, Robert Wayne Yates
  • Patent number: 10133496
    Abstract: The disclosed techniques may employ components referred to herein as atoms for computing and maintaining of states. Unlike traditional actors, atoms may be capable of binding to other atoms to form a bound combination of atoms, referred to herein as a molecule. In some examples, while bound to other atoms, an atom may operate in a manner that is different from traditional actors. For example, in some cases, atoms that are bound to one another may be prohibited from concurrently performing different operations on their own separate states. Additionally, bound atoms may be operable to collectively (e.g., synchronously) perform shared operations on their associated states. Furthermore, a shared operation performed on the states of bound atoms may be performed atomically. Also, in some examples, bound atoms may be capable of communicating synchronously with one another and of synchronously accessing each other's states.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: November 20, 2018
    Assignee: Amazon Technologies, Inc.
    Inventors: Juan Pablo Ferreyra, Brian David Fisher, Adam Julio Villalobos, Yu Ping Hu
  • Patent number: 10086288
    Abstract: Techniques for forking and merging of electronically presented content items, such as MMO and other video games, are described herein. In particular, a first content item session may be forked to generate a second (forked) content item session. The first and forked content item sessions may then continue to execute and evolve in separate directions from one another. In some examples, a user of the forked content item session may serve as an administrator of the forked content item session and may receive compensation in exchange for serving as an administrator. Additionally, one or more forked or other separate content item sessions may be merged together to form a merged content item session. In some examples, conflicts between merged content item sessions may be identified and resolved based, at least in part, on input from administrators.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: October 2, 2018
    Assignee: Amazon Technologies, Inc.
    Inventors: Francis Xavier Surjo-Subagio, Brian David Fisher, David Edward Maldonado, Patrick Gilmore, Christopher Thomas Larson, Yu Ping Hu
  • Patent number: 10084135
    Abstract: An illumination device includes a substrate, a light emitting structure, a sealant, and a laminating board is provided. The light emitting structure includes a first electrode layer, a light emitting layer and a second electrode layer stacked on the substrate sequentially. The sealant covers the light emitting structure. The laminating board is attached to the substrate. The sealant is located between the laminating board and the substrate. The laminating board includes a carrier body, a metal layer and a plurality of pads. The metal layer is exposed at a first surface of the carrier body, is in contact with the sealant and shields an area of the light emitting layer of the light emitting structure. The pads are exposed at the first surface of the carrier body and electrically connected to the first electrode layer and the second electrode layer. The metal layer is electrically isolated from the pads.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: September 25, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Hsuan-Yu Lin, Hsin-Chu Chen, Wen-Hong Liu, Chao-Feng Sung, Chun-Ting Liu, Je-Ping Hu, Wen-Yung Yeh
  • Patent number: 10072293
    Abstract: Methods and systems for determining functional relationships between a skin-active agent and a skin condition of interest, and methods and systems for identifying cosmetic agents effective for treatment of dandruff, as well as the use of agents identified by such methods and systems for the preparation of cosmetic compositions, personal care products, or both are provided. Methods for developing in vitro models of skin disease and models for specific skin diseases are also provided.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: September 11, 2018
    Assignee: The Procter and Gamble Company
    Inventors: Kevin John Mills, Robert Lloyd Binder, Robert Scott Youngquist, Jun Xu, Ping Hu, Makio Tamura
  • Publication number: 20180253196
    Abstract: Provided is an application providing method of an electronic device, the application providing method including: obtaining manipulation information of a user with respect to an application provided by the electronic device; obtaining feeling information of the user; modifying a user interface of the application based on the manipulation information and the feeling information of the user; and providing the application including the modified user interface.
    Type: Application
    Filed: September 7, 2016
    Publication date: September 6, 2018
    Inventors: Ping HU, Gengyu MA, Jae-hyun KIM, Young-su MOON
  • Publication number: 20180236023
    Abstract: The present invention relates to compositions containing plant materials or extracts with inhibitory effect on a 5-HT3a and/or NK-1 receptor for preventing or treating idiopathic vomiting.
    Type: Application
    Filed: April 20, 2018
    Publication date: August 23, 2018
    Applicant: Mars, Incorporated
    Inventors: Jean Soon Park, Ping Hu, Yakang Lin, Lori Ann Reinsalu
  • Publication number: 20180156794
    Abstract: Disclosed are a protein molecular marker Dkk-3 protein associated with age-related muscle atrophy and the use thereof in the diagnosis of age-related muscle atrophy. The expression level of the Dkk-3 protein in amyotrophic cells is significantly higher than that in normal myocytes or tissues, and thus the Dkk-3 protein can be used as an effective marker for the detection of age-related muscle atrophy.
    Type: Application
    Filed: April 28, 2016
    Publication date: June 7, 2018
    Inventors: Ping HU, Jie YIN