Patents by Inventor Ping Huang

Ping Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11152262
    Abstract: A method includes etching a gate structure to form a trench extending into the gate structure, wherein sidewalls of the trench comprise a metal oxide material, applying a sidewall treatment process to the sidewalls of the trench, wherein the metal oxide material has been removed as a result of applying the sidewall treatment process and filling the trench with a first dielectric material to form a dielectric region, wherein the dielectric region is in contact with the sidewall of the gate structure.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: October 19, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yi Lee, Ting-Gang Chen, Chieh-Ping Wang, Hong-Hsien Ke, Chia-Hui Lin, Tai-Chun Huang
  • Patent number: 11151597
    Abstract: The present disclosure provides a method, computer system and computer program product for determining interruption points based on emotion values in a content. According to the method, emotion values of one or more emotion catalogs at one or more time points of the content to be interrupted can be determined, and one or more interruption points can be determined based on the determined emotion values.
    Type: Grant
    Filed: January 5, 2020
    Date of Patent: October 19, 2021
    Assignee: International Business Machines Corporation
    Inventors: Jen Ping Cheng, Chao Yuan Huang, Yen Lin Li, Lin Chung Liang, Po Chun Lin
  • Patent number: 11151724
    Abstract: An automatic detecting method and an automatic detecting apparatus using the same are provided. The automatic detecting apparatus includes an inputting unit, a dividing unit, a contouring unit, a range analyzing unit, a boundary analyzing unit, an edge detecting unit, an expanding unit and an overlapping unit. The dividing unit is used for dividing an overlooking image into four clusters via a clustering algorithm. The contouring unit is used for obtaining a contour. The range analyzing unit is used for obtaining a detecting range. The boundary analyzing unit is used for obtaining a circular boundary in the detecting range. The edge detecting unit is used for obtaining a plurality of edges in the circular boundary. The expanding unit is used for expanding the edges to obtain a plurality of expanded edges. The overlapping unit is used for overlapping the expanded edges and the contour to obtain a defect pattern.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 19, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Tzu-Ping Kao, Ching-Hsing Hsieh, Chia-Chi Chang, Ju-Te Chen, Chen-Hui Huang, Cheng-Hsien Chen
  • Patent number: 11145666
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a staircase structure disposed over a substrate. The staircase structure includes a plurality of layer stacks, where each layer stack is made of a first material layer over a portion of a second material layer. The staircase structure further includes a plurality of landing pads, where each landing pad is disposed over another portion of the second material layer of a respective layer stack.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: October 12, 2021
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao, Yu Ru Huang, Si Ping Hu, Lan Yao, Li Hong Xiao, A Man Zheng, Kun Bao, Haohao Yang
  • Patent number: 11141262
    Abstract: A bone implant includes at least one spiral and at least one pillar. The spiral surrounds an accommodating space. The pillar is disposed in the accommodating space and connected to the spiral. The pillar has at least one notch.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 12, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Pei-I Tsai, Hsin-Hsin Shen, Kuo-Yi Yang, Chih-Chieh Huang, Shih-Ping Lin, De-Yau Lin
  • Patent number: 11142836
    Abstract: A method for manufacturing catalyst material is provided, which includes putting an M? target and an M? target into a nitrogen-containing atmosphere, in which M? is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, and M? is Nb, Ta, or a combination thereof. Powers are provided to the M? target and the M? target, respectively. Providing ions to bombard the M? target and the M? target to sputtering deposit M?aM?bN2 on a substrate, wherein 0.7?a?1.7, 0.3?b?1.3, and a+b=2, wherein M?aM?bN2 is a cubic crystal system.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: October 12, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuo-Hsin Lin, Li-Duan Tsai, Wen-Hsuan Chao, Yu-Ming Lin, Pin-Hsin Yang, Hsiao-Chun Huang, Chiu-Ping Huang, Jiunn-Nan Lin
  • Publication number: 20210313181
    Abstract: A gate stack can be etched to form a trench extending through the gate stack, the trench removing a portion of the gate stack to separate the gate stack into a first gate stack portion and a second gate stack portion. A dielectric material is deposited in the trench to form a dielectric region, the dielectric region having an air gap in the dielectric material. The air gap may extend upward from beneath the gate stack to an area interposed between the end of the first gate stack portion and the end of the second gate stack portion. Contacts to the first gate stack portion and contacts to the second gate stack portion may be formed which are electrically isolated from each other by the dielectric material and air gap formed therein.
    Type: Application
    Filed: April 1, 2020
    Publication date: October 7, 2021
    Inventors: Ting-Gang Chen, Wan-Hsien Lin, Chieh-Ping Wang, Tai-Chun Huang, Chi On Chui
  • Patent number: 11135004
    Abstract: An ablation device including a first electrode, at least one second electrode and a guiding sleeve is provided. The guiding sleeve is sleeved outside the first electrode and the second electrode, so as to fold the second electrode. The guiding sleeve is adapted to move along an axial direction of the first electrode, so as to adjust a length of the first electrode exposed by the guiding sleeve and enable the second electrode to be released and expand in a radial direction of the first electrode.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: October 5, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Chi-Ying Lu, Jo-Ping Lee, Hui-Hsin Lu, Ja-Der Liang, Kai-Wen Huang, Zong-Yi Hsiao
  • Patent number: 11139177
    Abstract: A method of fabricating a semiconductor package structure is provided. The method includes applying a plurality of first adhesive portions onto a carrier; applying a second adhesive portion onto the carrier; disposing a plurality of micro pins respectively in the first adhesive portions, such that each of the micro pins has a first portion embedded in a corresponding one of the first adhesive portions and a second portion protruding from said corresponding one of the first adhesive portions; bonding a die to the second adhesive portion; forming a molding compound surrounding the micro pins and the die; and removing the carrier from the molding compound after forming the molding compound.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Ling Hwang, Bor-Ping Jang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang
  • Publication number: 20210305678
    Abstract: A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.
    Type: Application
    Filed: January 15, 2021
    Publication date: September 30, 2021
    Inventors: Po-Hsiang Huang, Fong-Yuan Chang, Tsui-Ping Wang, Yi-Shin Chu
  • Publication number: 20210305316
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, forming a magnetic tunneling junction (MTJ) on the MRAM region, forming a metal interconnection on the MTJ, forming a dielectric layer on the metal interconnection, patterning the dielectric layer to form openings, and forming the blocking layer on the patterned dielectric layer and the metal interconnection and into the openings.
    Type: Application
    Filed: April 23, 2020
    Publication date: September 30, 2021
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20210300873
    Abstract: The invention provides compositions containing a stable crystalline form of brequinar and methods of making such composition. The invention also provides methods of using such compositions to treat a condition in a subject.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 30, 2021
    Inventors: Abdolsamad Tadayon, Ping Huang, Chaoyi Deng, Jinsuo Yang, Siyi Jiang, Qingqing Lu, Lin Cui, Mo Jia, Xianjun You, David P. Hesson
  • Publication number: 20210293765
    Abstract: Detection reagent is formed by reacting a catalyst and xanthydrol. The catalyst includes an active component loaded on a support, wherein the active component includes Pt, Ru, Rh, or a combination thereof, and the support includes carbon material, silica, alumina, or calcium carbonate. The detection reagent can be used to detect the primary amide compound.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 23, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jie-Bi HU, Chin-Ping HUANG, Meng-Tzu LAI, Hsiao-Mei WU, Pei-Hua YEH, Tzu-Chia LAI, Jhih-Yun LIN
  • Publication number: 20210292280
    Abstract: The invention provides compositions containing a stable crystalline form of brequinar and methods of making such composition. The invention also provides methods of using such compositions to treat a condition in a subject.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 23, 2021
    Inventors: Abdolsamad Tadayon, Ping Huang, Chaoyi Deng, Jinsuo Yang, Qingqing Lu, Lin Cui, Mo Jia, Xianjun You, David P. Hesson, Siyi Jiang
  • Patent number: 11127757
    Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a 3D memory device includes a memory stack, a plurality of channel structures, and a source structure. The memory stack is over a substrate and includes interleaved a plurality of conductor layers and a plurality of insulating layers. The plurality of channel structures extend vertically in the memory stack. The source structure extend in the memory stack. The source structure includes a plurality of source contacts each in a respective insulating structure, and two adjacent ones of the plurality of source contacts are conductively connected to one another.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: September 21, 2021
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Wenxiang Xu, Wei Xu, Pan Huang, Ping Yan, Zongliang Huo, Wenbin Zhou, Ji Xia
  • Patent number: 11124472
    Abstract: The present invention discloses a novel 3-aryl-2-propen-1-one series derivative and the synthesis processes thereof. Besides, the present invention also discloses the series derivative as a pharmaceutical composition and their use for promoting myocardial regeneration.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: September 21, 2021
    Assignee: GENHEALTH PHARMA CO., LTD.
    Inventors: Lain-Tze Lee, Hui-Ping Tsai, Shu-Fen Huang, Yi-Wen Lin, Pi-Tsan Huang, Ying-Ying Wu, Mei-Hui Chen, Li-Jie Hsu
  • Patent number: 11127708
    Abstract: Provided are a package structure and a method of manufacturing the same. The method includes the following processes. A die is provided. An encapsulant is formed laterally aside the die. A first dielectric layer is formed on the encapsulant and the die. A first redistribution layer is formed to penetrate through the first dielectric layer to connect to the die, the first redistribution layer includes a first via embedded in the first dielectric layer and a first trace on the first dielectric layer and connected to the first via. The first via and the first trace of the first redistribution layer are formed separately.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: September 21, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Kai Liu, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
  • Patent number: 11129082
    Abstract: A method of route construction of an unmanned aerial vehicle (UAV) network includes: obtaining transmission information of the UAV network; determining a relay set from the UAV network based on the transmission information; wherein, the relay set includes at least one UAV; determining environment state parameters according to the transmission information and the information of the relay set; inputting the environment state parameters into a Deep Q-Learning network (DQN) to obtain an accumulated reward corresponding to each UAV; and selecting a UAV with the largest accumulated reward as a target UAV. This disclosure also discloses a UAV and computer readable storage medium that can be used to construct routes for a UAV network.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: September 21, 2021
    Assignee: Beijing University of Posts and Telecommunications
    Inventors: Wenjun Xu, Chunlei Huang, Zhi Zhang, Shaosheng Li, Ping Zhang, Jiaru Lin
  • Publication number: 20210282646
    Abstract: The invention relates to a medical data measurement system. The medical data measurement system comprises a sensing module and an intelligent module. The sensing module is used to monitor a change of a data. The intelligent module receives the data of the sensing module, and comprises an identification module and a processing module. The identification module is used to identify and determine to drive the processing module to obtain a physiological value from the data. The sensing module can be an automatic forehead temperature measurement. Through the above, automatically measuring, tracking, and locating a measurement of a medical data can be achieved.
    Type: Application
    Filed: March 12, 2021
    Publication date: September 16, 2021
    Inventors: Chao-Wang Chen, Li-Ping Yang, Yeong-Dar Chen, Yi-Hsin Huang
  • Patent number: 11122033
    Abstract: A method and system of authenticating a user are provided. A request for a resource is received by a server, from a user device. A predefined number is received from the user device. A first number and a second number are created. The first number is sent to the user device. A first discrete logarithm is determined based on a challenge code and the first number and sent to the user device. A first pass code is calculated via a second discrete logarithm based on the first discrete logarithm, the predefined number, and the first number. A second pass code based on the second discrete logarithm, is received from the user device. The first pass code is compared to the second pass code. Upon determining that the first pass code is identical to the second pass code, the user device is allowed access a resource associated with the computing device.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: September 14, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Yi-Chun Chen, Wen-Ping Chi, Chao Yuan Huang, Ting-Yi Wang