Abstract: A method of forming an IC including a power semiconductor device includes providing a substrate having an epi layer thereon with at least one transistor formed therein covered by a pre-metal dielectric (PMD) layer. Contact openings are etched from through the PMD into the epi layer to form a sinker trench extending to a first node of the device. A metal fill material is deposited to cover a sidewall and bottom of the sinker trench but not completely fill the sinker trench. A dielectric filler layer is deposited over the metal fill material to fill the sinker trench. An overburden region of the dielectric filler layer is removed stopping on a surface of the metal fill material in the overburden region to form a sinker contact. A patterned interconnect metal is formed providing a connection between the interconnect metal and metal fill material on the sidewall of the sinker trench.

Abstract: A door for a refrigerator includes a door housing, which is provided with a thermal insulation material therein, where the thermal insulation material is combined with the door housing. The door housing has a concave portion recessed backwards from a front surface of the door, where one end of the concave portion is provided with a ramp that extends forwards. A detachable member is provided and is isolated from the thermal insulation material and is connected to the door housing. Accordingly, at least one part of the ramp is formed by the detachable member.

Abstract: A method of forming an IC including a power semiconductor device includes providing a substrate having an epi layer thereon with at least one transistor formed therein covered by a pre-metal dielectric (PMD) layer. Contact openings are etched from through the PMD into the epi layer to form a sinker trench extending to a first node of the device. A metal fill material is deposited to cover a sidewall and bottom of the sinker trench but not completely fill the sinker trench. A dielectric filler layer is deposited over the metal fill material to fill the sinker trench. An overburden region of the dielectric filler layer is removed stopping on a surface of the metal fill material in the overburden region to form a sinker contact. A patterned interconnect metal is formed providing a connection between the interconnect metal and metal fill material on the sidewall of the sinker trench.

Abstract: A method of forming an IC including a power semiconductor device includes providing a substrate having an epi layer thereon with at least one transistor formed therein covered by a pre-metal dielectric (PMD) layer. Contact openings are etched from through the PMD into the epi layer to form a sinker trench extending to a first node of the device. A metal fill material is deposited to cover a sidewall and bottom of the sinker trench but not completely fill the sinker trench. A dielectric filler layer is deposited over the metal fill material to fill the sinker trench. An overburden region of the dielectric filler layer is removed stopping on a surface of the metal fill material in the overburden region to form a sinker contact. A patterned interconnect metal is formed providing a connection between the interconnect metal and metal fill material on the sidewall of the sinker trench.

Abstract: A permanent magnet motor and a home appliance including the permanent magnet motor are provided. The permanent magnet motor includes a stator and a rotor rotatable relative to the stator. The rotor includes a rotary shaft, a rotor core fixed to the rotary shaft, a commutator fixed to the rotary shaft and adjacent the rotor core, and a rotor winding wound around poles of the rotor core and electrically connected with the commutator. The stator includes a cylindrical housing, a permanent magnet mounted to an inner surface of the housing, and brushes in sliding contact with the commutator. A ratio of an outer diameter of the rotor core to an outer diameter of the housing is 60% to 85%, and a wire diameter of the rotor winding is 0.12 mm to 0.23 mm. The present invention can provide higher output power without increasing sizes of the motor.

Abstract: A refrigerator includes a door having a handle groove, a grip portion located in front of the handle groove, and a front panel located in front of the grip portion. The grip portion is close to a rear surface of the front panel or is in contact with the rear surface of the front panel. The door includes at least a metal reinforcement member disposed in the grip portion.

Abstract: A portable communication device includes a processor, a communication unit to communicate with a server, and a locating unit to determine a location of the communication device. The processor is operable to: determine whether one application belongs to a restricted category when a input unit receives a user input to start the application; obtain a list associated with the location from the storage unit, if the application belongs to a restricted category; and start the application if a name of the application is included in the list, or otherwise ignore the user input.

Abstract: A transverse acoustic wave resonator includes a base, a resonator component, a number of driving electrodes fixed to the base and a number of fixing portions connecting the base and the resonator component. The resonator component is suspended above a top surface of the base and is perpendicular to the base. The driving electrodes are coupling to side surfaces of the resonator component. The resonator component is formed in a shape of an essential regular polygon. The driving electrodes and the resonator component jointly form an electromechanical coupling system for converting capacitance into electrostatic force. Besides, a capacitive-type transverse extension acoustic wave silicon oscillator includes the transverse acoustic wave resonator and a method of fabricating the transverse acoustic wave resonator are also disclosed.

Abstract: A transverse acoustic wave resonator includes a base, a resonator component, a number of driving electrodes fixed to the base and a number of fixing portions connecting the base and the resonator component. The resonator component is suspended above a top surface of the base and is perpendicular to the base. The driving electrodes are coupling to side surfaces of the resonator component. The resonator component is formed in a shape of an essential regular polygon. The driving electrodes and the resonator component jointly form an electromechanical coupling system for converting capacitance into electrostatic force. Besides, a capacitive-type transverse extension acoustic wave silicon oscillator includes the transverse acoustic wave resonator and a method of fabricating the transverse acoustic wave resonator are also disclosed.

Abstract: A vacuum cleaner has a brush roll which has a housing. A motor is disposed within the housing and has a pulley mounted on a shaft of the motor. A roller is disposed within the housing and has a drive wheel. A belt couples the pulley to the drive wheel, so that the motor can drive the roller. The roller has bristles for sweeping a surface to be cleaned.