Patents by Inventor Ping Yan
Ping Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250122990Abstract: A lighting apparatus includes an Edison cap, a light housing, a light source plate and a lens module. The light housing includes a back cover. The Edison cap is attached to the back cover. Multiple LED module are mounted on the light source plate. A lens module is disposed above the light source plate. The lens plate includes multiple lens unit corresponding to the multiple LED modules on the light source plate.Type: ApplicationFiled: December 20, 2024Publication date: April 17, 2025Inventors: Ping Yan, Zhangjun Chen, Linhua Wang, Peng Li, Jinglong Chen
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Patent number: 12214999Abstract: The present application describes an intelligent hoisting method for a bridge deck crane system. The method involves determining the splicing heights at two key positions of the segment to be installed by measuring the alignment height of an already installed segment. The segment is hoisted, and the real-time heights at both positions are monitored. If one position reaches the splicing height while the other does not, the lifting point is adjusted until both positions align with their respective splicing heights. This method eliminates the need for reference marks or docking joints on the segment to be installed, thereby avoiding issues related to their precision and installation accuracy. Additionally, it simplifies the splicing operation by removing the need for pre-processing the segment, reducing the overall complexity of the process.Type: GrantFiled: September 14, 2024Date of Patent: February 4, 2025Assignee: POLY CHANGDA ENGINEERING CO., LTD.Inventors: Yuxian Wu, He Jin, Guocheng Rong, Shengquan Yan, Yanbiao Cai, Ping Yan, Duo Zou, Kunxing Li, Zuqiang Chen
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Publication number: 20250035297Abstract: A lighting apparatus includes a back cover, an annular structure and a light module. The annular structure has surrounding wall. The surrounding wall defines a top opening. The back cover conceals the top opening. The annular structure has a bottom rim extended outwardly from a bottom border of the surrounding wall. The annular structure and the back cover are fixed as a unit to conceal the installation opening. The annular structure and the back cover are made of a fireproof material. The back cover and the annular structure defines a container space. The light module is stored within the container space. The surface rim conceals the installation opening. The bottom ring is between the surface rim and an edge border of the installation opening.Type: ApplicationFiled: July 25, 2024Publication date: January 30, 2025Inventors: Shenggan Wang, Huitang Zhang, Yongzhe Dong, Ping Yan, Yange Su, Linhua Wang
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Patent number: 12209715Abstract: A lighting apparatus includes a light source, a bottom housing, a driver module and an Edison cap. The bottom housing has a bottom cover and lateral wall. A front side of the bottom cover and an interior surface of the lateral wall together define a container space. The light source is placed in the container space. The driver module is disposed on a back side of the bottom cover. The back side is opposite to the front side of the bottom cover. The Edison cap disposed on the back side of bottom cover. The Edison cap routes an external power to the driver module for generating a driving current to the light source.Type: GrantFiled: October 5, 2023Date of Patent: January 28, 2025Assignee: LEEDARSON LIGHTING CO., LTD.Inventors: Zhangjun Chen, Ping Yan, Linhua Wang, Peng Li, Jinglong Chen
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Publication number: 20250012423Abstract: A lighting apparatus includes a light source plate, multiple LED chips, a driver module and multiple lens units. Multiple LED chips are mounted on the light source plate. The driver module is surrounded by the multiple LED chips. Each lens unit has an interior space for enclosing one corresponding LED chip. A bottom ratio between a horizontal dimension of the LED chip and a bottom area of the interior space is between 60% to 80%.Type: ApplicationFiled: July 3, 2023Publication date: January 9, 2025Inventors: Peng Li, Zhihua Wang, Ping Yan, Linhua Wang
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Publication number: 20240431010Abstract: A lighting apparatus includes a light source module, a driver and a processor. The light source module includes multiple light zones. Different light zones have different LED module combinations. The driver is coupled to an external power source to generating driving currents to the light source module. The processor receives a control command for adjusting colors of the multiple light zones separately by sending control signals to the driver. The control signals indicate duty ratios of the multiple LED modules of the multiple light zones to adjust the colors of the multiple light zones.Type: ApplicationFiled: March 21, 2024Publication date: December 26, 2024Inventors: Ping Yan, Zhiwei Su, Jinglong Chen, Zhihua Wang, Huitang Zhang, Linhua Wang, Zhenhong Zhu, Huiyong Huang
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Publication number: 20240418345Abstract: A lighting apparatus includes a first light source, a second light source, a light source plate and a separating wall. The light source plate has a first area and a second area on a front side of the light source plate. The first light source is placed on the first area of the light source plate. The second light source is placed on the second area of the light source plate. The separating wall is placed above the front side of the light source plate for separating the first area and the second area and for defining a first light spanning area of the first light source and a second light spanning of the second light source.Type: ApplicationFiled: June 17, 2024Publication date: December 19, 2024Inventors: Chenjun Wu, Ping Yan, Jinglong Chen, Zhenhong Zhu
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Publication number: 20240374882Abstract: A device and methods for producing microneedles includes a microneedle female mold, a vacuum chamber, a filling mechanism and an evacuation mechanism. The vacuum chamber includes a feeding cavity, a filling cavity and a discharging cavity, which are independent of one another. The feeding cavity receives the microneedle female mold therein in non-negative pressure state, and the evacuation mechanism evacuates the feeding cavity that has received the microneedle female mold therein. The filling cavity receives, in negative pressure state, the microneedle female mold transported from the feeding cavity in negative pressure state. The discharging cavity receives, in negative pressure state, the microneedle female mold transported from the filling cavity in negative pressure state and to undergo vacuum destruction after the microneedle female mold is received therein. The device and methods more efficiently produces microneedles in large batches and ensuring formation quality of the produced microneedles.Type: ApplicationFiled: July 30, 2021Publication date: November 14, 2024Inventors: Binwen CHEN, Ping YAN, Yuan HUANG, Long LIU, Qiuyu QU
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Publication number: 20240360440Abstract: The present invention provides a bos grunniens Lnc4047 and applications thereof, and belongs to the technical field of genetic engineering. The nucleotide sequence of the bos grunniens Lnc4047 is shown in SEQ ID No. 1. The regulation effect of Lnc4047 on myoblast proliferation and myoblast differentiation of bos grunniens is discovered in the present invention for the first time, that is, Lnc4047 inhibits myoblast proliferation, but promotes myoblast differentiation to a certain extent. This provides an important basis for understanding the muscle development mechanism of bos grunniens, and lays a theoretical foundation for rapidly developing a new high-quality breed of bos grunniens and improving its meat quality.Type: ApplicationFiled: April 27, 2023Publication date: October 31, 2024Inventors: Xiaoming Ma, Ping Yan, Chunnian Liang, Xian Guo, Tong Wang
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Publication number: 20240227248Abstract: The present invention provides a manufacturing device and a manufacturing method for molds. The manufacturing device includes a molding assembly including a mold table and a male mold. The mold table has an upper surface defining a depression thereon, and the male mold is configured to be disposed on a bottom surface of the depression. A height of the male mold is smaller than a depth of the depression. This manufacturing device can utilize a transfer molding method to manufacture molds in batches with higher mold production efficiency.Type: ApplicationFiled: July 29, 2021Publication date: July 11, 2024Inventors: Yuan HUANG, Ping YAN, Long LIU, Binwen CHEN, Qiuyu QU
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Patent number: 12035523Abstract: Embodiments of three-dimensional (3D) memory devices and fabricating methods thereof are disclosed. The method includes: forming an alternating dielectric stack on a substrate; forming a structure strengthen plug in an upper portion of the alternating dielectric stack, wherein the structure strengthen plug has a narrow support body and two enlarged connecting portions; forming a gate line silt in the alternating dielectric stack to expose a sidewall of one enlarged connecting portion of the structure strengthen plug; and forming a gate line slit structure in the gate line slit including an enlarged end portion connected to the one enlarged connecting portion of the structure strengthen plug.Type: GrantFiled: November 22, 2021Date of Patent: July 9, 2024Assignee: Yangtze Memory Technologies Co., Ltd.Inventors: Wenxiang Xu, Haohao Yang, Pan Huang, Ping Yan, Zongliang Huo, Wenbin Zhou, Wei Xu
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Publication number: 20240207534Abstract: The present application provides a needle insertion assistant and a medical device including the needle insertion assistant. The needle insertion assistant includes: a housing assembly defining a first inner lumen axially extending therethrough; a pusher assembly disposed within the first inner lumen and including an inner core and an energy storage element, the inner core configured to be axially movable, the energy storage element disposed between the inner core and the housing assembly; and a drive assembly. The needle insertion assistant is configured such that the drive assembly is configured to drive the inner core to move from distal to proximal to cause the energy storage element to store elastic potential energy. The drive assembly is further configured to cause the energy storage element to release the stored elastic potential energy to drive the inner core to move from proximal to distal.Type: ApplicationFiled: July 29, 2021Publication date: June 27, 2024Inventors: Ping YAN, Binwen CHEN, Qiuyu QU, Long LIU, Yuan HUANG
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Publication number: 20240142174Abstract: A storage rack and a drying device including the storage rack. The storage rack includes a frame and a support beam assembly including a connector seat, a first connector and a support beam. The connector seat is connected to the frame, and the support beam is connected to the connector seat by the first connector. The support beam is connected to the frame by the first connector and the connector seat rather than by direct welding which may cause deformation. It is ensured that the support beam can provide desirable levelness for a shelf panel to be supported thereon. In this way, good levelness of the shelf panel can be achieved at a reduced thickness thereof, resulting in a reduction in economic cost. Moreover, for a detachable shelf panel, its placement and removal can be facilitated.Type: ApplicationFiled: July 29, 2021Publication date: May 2, 2024Inventors: Binwen CHEN, Ping YAN, Qiuyu QU, Long LIU, Yuan HUANG
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Patent number: 11963356Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a 3D memory device includes a stack structure including a memory block including a plurality of memory cells. The 3D memory device also includes a first top select structure and a bottom select structure in the memory block and aligned with each other vertically; and a second top select structure in the memory block is separated from the first top select structure by at least one of the plurality of memory cells. The first top select structure, the bottom select structure, and the second top select structure each includes an insulating material.Type: GrantFiled: December 20, 2021Date of Patent: April 16, 2024Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Zongliang Huo, Haohao Yang, Wei Xu, Ping Yan, Pan Huang, Wenbin Zhou
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Publication number: 20240038684Abstract: A semiconductor structure including a substrate and protection structures is provided. The substrate includes a die region. The die region includes corner regions. The protection structures are located in the corner region. Each of the protection structures has a square top-view pattern. The square top-view patterns located in the same corner region have various sizes.Type: ApplicationFiled: August 16, 2022Publication date: February 1, 2024Applicant: United Microelectronics Corp.Inventors: Ming-Hua Tsai, Hao Ping Yan, Chin-Chia Kuo, Wei Hsuan Chang
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Patent number: 11859785Abstract: A lighting apparatus includes a driver, an elongated housing, an extending connector, a light source and an extension module. The driver converts an external power source to a driving current. The elongated housing has a lighting area, an extension area and a light opening. The extending connector has a holder and an electrode connecting to the driver. The holder is placed in the extending area of the elongated housing. The light source is attached to the lighting area for generating a first light escaping from the light opening. The extension module is attached to the holder of the extending connector to electrically connect to the driver via the electrode.Type: GrantFiled: November 25, 2022Date of Patent: January 2, 2024Assignee: XIAMEN LEEDARSON LIGHTING CO.,LTDInventors: Wenjin Peng, Chunteng Chen, Ping Yan
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Publication number: 20230404863Abstract: A microneedle patch and a preparation method therefor are disclosed. The microneedle patch includes a base and a number of needles arranged on a surface of the base. The needles are dissolvable pointed bodies and contain a composition with cosmetic effects. The composition includes astaxanthin, hydrophilically modified resveratrol, collagen and hyaluromic acid. The method includes the steps of: pouring an aqueous solution of the composition into a mold; vacuumizing the mold; removing water therefrom; and demoulding the mold, thereby obtaining the microneedle patch. The present invention provides a variety of advantages including high safety, high stability, good absorption into the skin and obvious cosmetic effects.Type: ApplicationFiled: June 24, 2021Publication date: December 21, 2023Inventors: Bing LI, Qinghui JIANG, Nan ZHOU, Ping YAN
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Patent number: 11785772Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a 3D memory device includes a memory stack having interleaved a plurality of conductor layers and a plurality of insulating layers, a plurality of channel structures extending in the memory stack, and a source structure extending in the memory stack. The source structure includes a plurality of source contacts each in a respective insulating structure. Two adjacent source contacts are conductively connected to one another by a connection layer, the connection layer includes a pair of first portions being over the two adjacent ones of the plurality of source contacts and a second portion between the pair of first portions. A support structure is between the two adjacent source contacts. The support structure includes a cut structure over interleaved a plurality of conductor portions and a plurality of insulating portions.Type: GrantFiled: November 16, 2021Date of Patent: October 10, 2023Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Wenxiang Xu, Wei Xu, Pan Huang, Ping Yan, Zongliang Huo, Wenbin Zhou, Ji Xia
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Patent number: 11765897Abstract: Embodiments of structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, a method for forming a 3D memory device includes forming a bottom select structure extending along a vertical direction through a bottom conductor layer over a substrate and along a horizontal direction to divide the bottom conductor layer into a pair of bottom select conductor layers, forming a plurality of conductor layers and a plurality of insulating layers interleaved on the pair of bottom select conductor layers and the bottom select structure, and forming a plurality of channel structures extending along the vertical direction through the pair of bottom select conductor layers, the plurality of conductor layers, and the plurality of insulating layers and into the substrate.Type: GrantFiled: November 21, 2020Date of Patent: September 19, 2023Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Zongliang Huo, Haohao Yang, Wei Xu, Ping Yan, Pan Huang, Wenbin Zhou
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Patent number: D1035576Type: GrantFiled: November 16, 2022Date of Patent: July 16, 2024Inventor: Ping Yan