Patents by Inventor Ping Yeh

Ping Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12349180
    Abstract: An apparatus for an S-BS includes processing circuitry configured to decode configuration signaling from a plurality of S-UEs. The configuration signaling indicates an interference level at each of the plurality of S-UEs from transmissions of an M-BS. An S-UE is selected based on a comparison of the interference level at each S-UE with an interference threshold of each S-UE. Control signaling is encoded for transmission to the selected S-UE via a small cell access (S-AC) communication link. The control signaling is transmitted during the reception of downlink data from the M-BS via a primary backhaul communication link.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: July 1, 2025
    Assignee: Intel Corporation
    Inventors: Jingwen Bai, Shu-ping Yeh, Yang-Seok Choi, Francesc Guim Bernat, Kshitij Arun Doshi, Ned M. Smith, Christian Maciocco
  • Patent number: 12342223
    Abstract: The present disclosure provides a resilient (radio) access network ((R)AN) slicing framework encompassing a resource planning engine and distributed dynamic slice-aware scheduling modules at one or more network access nodes, edge compute nodes, or cloud computing service. The resilient (R)AN slicing framework includes resource planning and slice-aware scheduling, as well as signaling exchanges for provisioning resilient (R)AN slicing. The intelligent (R)AN slicing framework can realize resource isolation in a more efficient and agile manner than existing network slicing technologies. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 25, 2021
    Date of Patent: June 24, 2025
    Assignee: Intel Corporation
    Inventors: Shu-ping Yeh, Jingwen Bai
  • Publication number: 20250185822
    Abstract: The present application discloses a carrycot cover, wherein the carrycot cover comprises an upright sheet and a cover sheet connected together, and before connection, a virtual auxiliary line perpendicular to the longitudinal axis of the upright sheet extends along the connecting side of the upright sheet, before connection, the size of the connecting side of the upright sheet is X centimeters inward relative to the auxiliary line from the outer end to the opposite side, where X is greater than or equal to zero, before connection, the size of the connecting side of the cover sheet is Y centimeters inward from the center point of the connecting side of the cover sheet along the longitudinal axis of the cover sheet towards the opposite side of the connection side of the cover sheet, where Y is greater than zero, and Y?X is greater than or equal to 2 centimeters.
    Type: Application
    Filed: December 6, 2024
    Publication date: June 12, 2025
    Inventors: I Ping YEH, Yu-Hsuan CHENG
  • Patent number: 12323319
    Abstract: The present disclosure is related to multi-access traffic management in multi-access computing environments. A reliability enhancement engine (REE) operated by a multi-access multipath traffic manager identifies traffic flows that have high reliability requirements (“reliability flows”) and performs admission control for the reliability flows. The REE determines a coding rate (e.g., a redundancy factor) and traffic distribution strategies for the identified reliability flows. The REE applies cross-access network coding (NC) on the reliability flows, and handles multi-access acknowledgements and traffic pacing, which may involve multiplexing traffic of the reliability flows with non-high-reliability traffic. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: June 3, 2025
    Assignee: Intel Corporation
    Inventors: Shu-ping Yeh, Wei Mao, Hosein Nikopour, Shilpa Talwar, Murali Narasimha, Jingwen Bai
  • Publication number: 20250174533
    Abstract: A semiconductor package structure includes a package substrate. The package substrate includes a first core structure, a plurality of first dielectric layers, a plurality of first metal layers, a plurality of second dielectric layers, and a plurality of second metal layers. The first core structure has a first surface and a second surface opposite the first surface. The first dielectric layers and the first metal layers are alternatingly stacked on the first surface of the first core structure. The second dielectric layers and the second metal layers are alternatingly stacked on the second surface of the first core structure. A number of second dielectric layers is less than a number of first dielectric layers.
    Type: Application
    Filed: June 7, 2024
    Publication date: May 29, 2025
    Inventors: Yih-Ting SHEN, Tai-Yu CHEN, Ping-Yeh LIN, Yu-Jin LI, Chun-Yi CHANG, Chi-Yuan CHEN, Sang-Mao CHIU
  • Publication number: 20250160678
    Abstract: Embodiments herein relate to systems and methods for detecting cannabinoid use and associated time frames of use. In an embodiment, a system for detecting cannabinoids in breath is included having a sensor device and a measurement circuit. The system can be configured to take measurements at a first time and at a second time and compare a pattern of the first time with a pattern of the second time and determine a time window of cannabinoid use based on the comparison. In an embodiment, a system for detecting cannabinoids in breath is included having a sensor device and a measurement circuit. The system can be configured to take measurements, match a pattern based on the measurements against a set of predetermined patterns, and determine a time window of cannabinoid use based on a match found amongst the set of predetermined patterns. Other embodiments are also included herein.
    Type: Application
    Filed: November 22, 2024
    Publication date: May 22, 2025
    Inventors: Gregory J. Sherwood, Raia Colette Finc, Gregory Kermit Peterson, Yung-Ping Yeh, Randall Lee Schiestl
  • Publication number: 20250132236
    Abstract: A package substrate and a fabricating method thereof are provided, in which a core board body is provided, a first organic conductive layer and a second metal layer are sequentially formed on a first metal layer of the core board body, and portions of the first organic conductive layer and the first metal layer are removed respectively according to a pattern of the second metal layer, such that the second metal layer, or the second metal layer, the first organic conductive layer and the first metal layer are served as a first circuit layer. Therefore, the design of the organic conductive layer can facilitate the control of the side etching amount of the metal circuit during etching, enabling the production of circuit layer with fine line width/fine line pitch.
    Type: Application
    Filed: March 6, 2024
    Publication date: April 24, 2025
    Inventors: Pao-Hung TSENG, Yu-Cheng PAI, Yuan-Ping YEH
  • Patent number: 12202899
    Abstract: An anti-PD-L1 antibody, or an antigen-binding fragment thereof, comprising: a heavy chain variable region comprising the three CDRs with the sequences of SEQ ID NOs: 2-4, 6-8, 10-12, 14-16, or 18-20; and/or a light chain variable region comprising the three CDRs with the sequences of SEQ ID NOs: 22-24, 26-28, 30-32, 34-36, or 38-40, wherein the antibody is a chimeric, humanized, composite, or human antibody.
    Type: Grant
    Filed: July 14, 2019
    Date of Patent: January 21, 2025
    Assignee: Development Center for Biotechnology
    Inventors: Cheng-Chou Yu, Shih-Rang Yang, Tsung-Han Hsieh, Mei-Chi Chan, Shu-Ping Yeh, Chuan-Lung Hsu, Ling-Yueh Hu, Chih-Lun Hsiao
  • Patent number: 12192820
    Abstract: The present disclosure is related to multi-access traffic management in edge computing environments, and in particular, artificial intelligence (AI) and/or machine learning (ML) techniques for multi-access traffic management. A scalable AI/ML architecture for multi-access traffic management is provided. Reinforcement learning (RL) and/or Deep RL (DRL) approaches that learn policies and/or parameters for traffic management and/or for distributing multi-access traffic through interacting with the environment are also provided. Deep contextual bandit RL techniques for intelligent traffic management for edge networks are also provided. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: January 7, 2025
    Assignee: Intel Corporation
    Inventors: Shu-ping Yeh, Jingwen Bai, Shilpa Talwar
  • Patent number: 12184554
    Abstract: The present disclosure is related to Multi-Access Management Services (MAMS), which is a programmable framework that provides mechanisms for the flexible selection of network paths in a multi-access (MX) communication environment, based on an application's needs. Generic Multi-Access (GMA) functions are also integrated into the MAMS framework. The present disclosure discusses Per-Packet Prioritization (PPP), intra-flow classification, and Active Queue Management (AQM) techniques for MAMS/GMA systems. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: December 31, 2024
    Assignee: Intel Corporation
    Inventors: Jing Zhu, Menglei Zhang, Shu-ping Yeh, Shilpa Talwar, Juan Fang
  • Publication number: 20240332149
    Abstract: An electronic package and a substrate structure thereof are provided, in which a circuit layer and a filling layer are formed on a substrate body in the substrate structure, where the circuit layer has a plurality of conductive traces separated from each other, so that the filling layer is filled between the plurality of conductive traces, and a portion of a surface of the circuit layer and a surface of the filling layer are covered with an insulating protective layer. Therefore, the insulating protective layer is carried by the filling layer, so that the insulating protective layer can be thin, thereby preventing the phenomenon of copper migration from occurring to the substrate structure in subsequent processes.
    Type: Application
    Filed: July 13, 2023
    Publication date: October 3, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yuan-Chang NI, Yu-Cheng PAI, Yuan-Ping YEH, Chan-Yu YEH, Meng-Jou HE
  • Patent number: 12107728
    Abstract: Embodiments of a virtualized radio-access network (RAN) node configured to implement functions including an O-RAN Distributed Unit (DU), an O-RAN Radio Unit (RU), an O-RAN Central Unit-Control Plane (CU-CP), and an O-RAN Central Unit-User Plane (CU-UP), are described herein. In some embodiments, a reliability enhancement strategy is determined according to measurement reports collected from user equipment (UEs), the DU and the CU-UP.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: October 1, 2024
    Assignee: Intel Corporation
    Inventors: Shu-ping Yeh, Jaemin Han, Wei Mao, Jingwen Bai, Murali Narasimha
  • Patent number: 12091454
    Abstract: A humanized anti-neurotensin receptor 1 (NTSR1) antibody or an antigen-binding fragment thereof. Also, a method for treating, prophylactic treating and/or preventing diseases and/or disorders caused by or related to NTSR1 activity and/or signaling, and a method or kit for detecting NTSR1 in a sample.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: September 17, 2024
    Assignees: DEVELOPMENT CENTER FOR BIOTECHNOLOGY, NATIONAL HEALTH RESEARCH INSTITUTES
    Inventors: Cheng-Chou Yu, Shu-Ping Yeh, Chao-Yang Huang, Szu-Liang Lai, Shih-Liang Hsiao, Mei-Ling Hou, Tzung-Jie Yang, Wei-Ting Sun, Liang-Yu Hsia, Andrew Yueh, Chiung-Tong Chen, Ren-Huang Wu, Pei-Shan Wu, Han-Shu Hu, Tzu-Chin Wu, Jia-Ni Tian
  • Publication number: 20240305533
    Abstract: The present disclosure provides a resilient (radio) access network ((R)AN) slicing framework encompassing a resource planning engine and distributed dynamic slice-aware scheduling modules at one or more network access nodes, edge compute nodes, or cloud computing service. The resilient (R)AN slicing framework includes resource planning and slice-aware scheduling, as well as signaling exchanges for provisioning resilient (R)AN slicing. The intelligent (R)AN slicing framework can realize resource isolation in a more efficient and agile manner than existing network slicing technologies.
    Type: Application
    Filed: June 30, 2022
    Publication date: September 12, 2024
    Inventors: Jingwen BAI, Shu-ping YEH, Shilpa TALWAR
  • Patent number: 12081412
    Abstract: An apparatus and system to provide a federated learning scheme between a RAN and connected UEs are described. A gNB-DU, gNB-CU, or LMF acts as a central server that selects an AI/ML model, trains the AI/ML model, and transmits the AI/ML model to UEs. The UEs act as local nodes that each send a model request to the central server, receive the AI/ML model in response to the request, trains the AI/ML model locally with data, and report updated parameters to the central server. The central server aggregates parameters from the local nodes and updates the AI/ML model.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: September 3, 2024
    Assignee: Intel Corporation
    Inventors: Ziyi Li, Alexander Sirotkin, Youn Hyoung Heo, Shu-ping Yeh, Yi Guo
  • Publication number: 20240282689
    Abstract: An electronic package, a packaging substrate and a fabricating method are provided, in which a conductive bump pad is formed on an electrical contact pad of the packaging substrate, so that when an electronic element is bonded to the packaging substrate via a solder material in a flip-chip process, the conductive bump pad can guide the flow of the solder material. Therefore, the problem of empty soldering caused by the solder material not effectively contacting with the electrical contact pad can be avoided.
    Type: Application
    Filed: May 30, 2023
    Publication date: August 22, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chan-Yu YEH, Yu-Cheng PAI, Yuan-Ping YEH, Yuan-Chang NI, Meng-Jou HE
  • Publication number: 20240267792
    Abstract: The present disclosure is related to Multi-Access Management Services (MAMS), which is a programmable framework that provides mechanisms for the flexible selection of network paths in a multi-access (MX) communication environment, based on an application's needs. Generic Multi-Access (GMA) functions are also integrated into the MAMS framework. The present disclosure discusses dynamic traffic splitting and one-way delay measurement techniques. Other implementations may be disclosed and/or claimed.
    Type: Application
    Filed: June 30, 2022
    Publication date: August 8, 2024
    Inventors: Jing ZHU, Menglei ZHANG, Shu-ping YEH
  • Publication number: 20240238432
    Abstract: A method for modifying glycoproteins is provided. The present disclosure also provides a method for producing glycoprotein-payload conjugates, the conjugates produced thereby, and the use thereof.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 18, 2024
    Inventors: Shih-Hsien CHUANG, Yu-Wei LAI, Cheng-Chou YU, Shu-Ping YEH, Jin-Yu WANG, Shih-Chong TSAI, Wei-Ting SUN, Chin-Yi Huang
  • Publication number: 20240218062
    Abstract: A humanized anti-neurotensin receptor 1 (NTSR1) antibody or an antigen-binding fragment thereof. Also, a method for treating, prophylactic treating and/or preventing diseases and/or disorders caused by or related to NTSR1 activity and/or signaling, and a method or kit for detecting NTSR1 in a sample.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 4, 2024
    Applicants: DEVELOPMENT CENTER FOR BIOTECHNOLOGY, NATIONAL HEALTH RESEARCH INSTITUTES
    Inventors: CHENG-CHOU YU, SHU-PING YEH, CHAO-YANG HUANG, SZU-LIANG LAI, SHIH-LIANG HSIAO, MEI-LING HOU, TZUNG-JIE YANG, WEI-TING SUN, LIANG-YU HSIA, ANDREW YUEH, CHIUNG-TONG CHEN, REN-HUANG WU, PEI-SHAN WU, HAN-SHU HU, TZU-CHIN WU, JIA-NI TIAN
  • Publication number: 20240209095
    Abstract: The present disclosure relates to an anti-PD-L1 antibody or an antigen-binding fragment thereof, comprising: a heavy chain variable region sequence comprising the three CDRs with the sequences of SEQ ID NOs: 2 to 4, or 6 to 8; and a light chain variable region sequence comprising the three CDRs with the sequences of SEQ ID NOs: 10 to 12, or 14 to 16. The present disclosure also relates to a pharmaceutical composition and a method for detecting expression of PD-L1 in a sample.
    Type: Application
    Filed: November 29, 2023
    Publication date: June 27, 2024
    Applicant: DEVELOPMENT CENTER FOR BIOTECHNOLOGY
    Inventors: SHU-PING YEH, CHENG-CHOU YU, YU-HSUN LO, JIN-YU WANG, MEI-CHI CHAN, CHAO-YANG HUANG, SZU-LIANG LAI