Abstract: Disclosed is a chip with a power divider/combiner, a module incorporating the chip and associated methods. The divider/combiner comprises first and second metal layers on opposite sides of a substrate. Interconnects extend through the substrate and comprise: a first interconnect, second interconnects annularly arranged about the first interconnect and third interconnects annularly arranged about the second interconnects. Each interconnect comprises one or more through silicon vias lined/filled with a conductor. For a power divider, an opening in the first metal layer at the first interconnect comprises an input port for receiving power and openings in the first or second metal layer at the second interconnects comprise output ports for applying power to other devices. For a power combiner, openings in the first or second metal layer at the second interconnects comprise the input ports and an opening in the first metal layer at the first interconnect comprises an output port.

Abstract: A single pole double throw (SPDT) semiconductor switch includes a series connection of a first transmitter-side transistor and a first reception-side transistor between a transmitter node and a reception node. Each of the two first transistors is provided with a gate-side variable impedance circuit, which provides a variable impedance connection between a complementary pair of gate control signals. Further, the body of each first transistor can be connected to a body bias control signal through a body-side variable impedance circuit. In addition, the transmitter node is connected to electrical ground through a second transmitter-side transistor, and the reception node is connected to electrical ground through a second reception-side transistor. Each of the second transistors can have a body bias that is tied to the body bias control signals for the first transistors so that switched-off transistors provide enhanced electrical isolation.

Abstract: A low phase variation attenuator uses a combined attenuation path and a phase network to significantly reduce a phase error between a reference signal and an attenuated signal without degrading the insertion loss. A grounded parallel connection of a resistor and a capacitor is employed in series with an attenuation transistor, which is connected to a middle of a two resistor voltage divider. The two resistor voltage divider includes two resistors of equal resistance that are connected in a series connection. The two resistor voltage divider is connected in a parallel connection with a reference transistor, which functions as a main switch for the transmission or attenuation of a radio frequency (RF) signal.

Abstract: A voltage controlled oscillator (VCO), IC and CMOS IC including the VCO. The VCO includes an LC tank circuit, a pair of cross-coupled devices connected to the tank circuit and driving a pair of buffers. Each of the pair of cross-coupled devices includes a field effect transistor (FET) with an independently controllable body, e.g., the surface layer of a Silicon on Insulator (SOI) chip or the surface well of a multi-well chip. Diodes in the multi-well structure are biased off in each device.

Abstract: A single pole double throw (SPDT) semiconductor switch includes a series connection of a first transmitter-side transistor and a first reception-side transistor between a transmitter node and a reception node. Each of the two first transistors is provided with a gate-side variable impedance circuit, which provides a variable impedance connection between a complementary pair of gate control signals. Further, the body of each first transistor can be connected to a body bias control signal through a body-side variable impedance circuit. In addition, the transmitter node is connected to electrical ground through a second transmitter-side transistor, and the reception node is connected to electrical ground through a second reception-side transistor. Each of the second transistors can have a body bias that is tied to the body bias control signals for the first transistors so that switched-off transistors provide enhanced electrical isolation.