Abstract: A light emitting display unit includes a redistribution layer (RDL) and multiple light emitting elements. The RDL includes multiple electrode patterns, multiple pad patterns, an insulating layer and multiple conductive through holes. A first gap and a second gap are respectively formed between two adjacent electrode patterns and between corresponding two adjacent pad patterns. A third length of the overlapping area of an orthographic projection of the first gap on the pad patterns and the pad patterns in a first direction is less than or equal to a second length of the second gap in the first direction. The micro light emitting elements are disposed on the RDL and electrically connected with the electrode patterns.

Abstract: A sensing device is provided. The sensing device includes a processing circuit and a multi-sensor integrated single chip. The multi-sensor integrated single chip includes a substrate and a temperature sensor, a pressure sensor, and an environmental sensor disposed on the substrate. The temperature sensor senses temperature. The pressure sensor senses pressure. The environmental sensor senses an environmental state. The processing circuit obtains a first sensed temperature value from the temperature sensor when the environmental sensor does not operate, and it obtains a second sensed temperature value from the temperature sensor when the environmental sensor operates. The processing circuit obtains a sensed pressure value from the pressure sensor. The processing circuit obtains at least one temperature calibration reference of the pressure sensor according to the first and second sensed temperature values and calibrates the sensed pressure value according to the temperature calibration reference.

Abstract: The micro light-emitting diode (LED) display matrix module of the disclosure includes a multilayer circuit layer, multiple micro LEDs, and an insulating flat layer. The multilayer circuit layer includes a top circuit layer and a bottom circuit layer. The bottom circuit layer includes multiple pads. The micro LEDs are disposed on the top circuit layer of the multilayer circuit layer and define multiple light-emitting units. Each of the light-emitting units includes three of the micro LEDs that are separated from each other. The light-emitting units are arranged in a matrix of m columns and n rows to define multiple pixel regions, and quantity of the pads is equal to 3m+n. An orthographic projection of each of the micro LEDs on the bottom circuit layer completely overlaps the corresponding pad. The insulating flat layer covers the top circuit layer of the multilayer circuit layer and the micro LEDs.

Abstract: A light-emitting display unit including first to third metal layers, first to second insulation layers and micro light-emitting devices is provided. The first metal layer has conductive patterns. The second metal layer has transfer patterns. The third metal layer has pad patterns. The second metal layer is located between the first metal layer and the third metal layer. A distribution density of the first metal layer is less than that of the second metal layer, and greater than that of the third metal layer. The first insulation layer is disposed between the first metal layer and the second metal layer. The second insulation layer is disposed between the second metal layer and the third metal layer. The micro light-emitting devices are disposed on one side of the first metal layer away from the second metal layer, and electrically bonded to the conductive patterns. A display apparatus adopting the light-emitting display unit is also provided.

Abstract: A micro light emitting diode (micro LED) display and a controller thereof are provided. The micro LED display includes a circuit board, a plurality of micro LED devices, and the controller. The micro LED devices are disposed on a first surface of the circuit board. The micro LED devices respectively have a plurality of pixel arrays. The controller is carried by the circuit board and is configured to transmit a plurality of control signals to respectively control display statuses of the pixel arrays of the micro LED devices.

Abstract: A light-emitting unit includes a multilayer circuit structure, a plurality of display pixels, and at least one compensation pixel. The multilayer circuit structure includes a top circuit layer and a bottom circuit layer. The display pixels are arranged into an N×M pixel array along a first direction and a second direction. Each of the display pixels includes a plurality of sub-pixels. The sub-pixels are disposed on the top circuit layer of the multilayer circuit structure. The compensation pixel is disposed on the top circuit layer of the multilayer circuit structure and electrically bonded to the multilayer circuit structure. The compensation pixel is located between the display pixels. The number of the compensation pixel is less than the number of the display pixels. Extension lines in the first direction and the second direction do not pass through the compensation pixel. A display apparatus is also provided.

Abstract: A display apparatus includes a first circuit board and a plurality of first light emitting display units. The first circuit board has a first surface and a first board edge connected to the first surface. The first light emitting display units are disposed on the first surface. Each of the first light emitting display units has a plurality of first pixel areas and includes a first driving circuit layer electrically bonded to the first circuit board and a plurality of first light emitting devices. The first light emitting devices are disposed on one side of the first driving circuit layer away from the first circuit board and are electrically bonded to the first driving circuit layer. At least one of the first light emitting display units has a first side edge parallel to the first board edge. The first board edge is drawn back from the first side edge.

Abstract: A display panel includes a first substrate, a plurality of first color micro light emitting diodes (LEDs), a plurality of second color LEDs and a shading layer. The first substrate has a plurality of pixel zones arranged in an array form. Each of the first color LEDs has a first light emitting surface facing to a display direction. Each of the second color LEDs has a second light emitting surface facing to the display direction. Each of the pixel zones is provided with one of the first color micro LEDs and one of the second color LEDs. The shading layer is disposed in the pixel zones. The shading layer overlaps part of the first light emitting surface and part of the second light emitting surface in the display direction.

Abstract: A sensing device is provided. The sensing device includes a processing circuit and a multi-sensor integrated single chip. The multi-sensor integrated single chip includes a substrate and a temperature sensor, a pressure sensor, and an environmental sensor disposed on the substrate. The temperature sensor senses temperature. The pressure sensor senses pressure. The environmental sensor senses an environmental state. The processing circuit obtains a first sensed temperature value from the temperature sensor when the environmental sensor does not operate, and it obtains a second sensed temperature value from the temperature sensor when the environmental sensor operates. The processing circuit obtains a sensed pressure value from the pressure sensor. The processing circuit obtains at least one temperature calibration reference of the pressure sensor according to the first and second sensed temperature values and calibrates the sensed pressure value according to the temperature calibration reference.

Abstract: The micro light-emitting diode (LED) display matrix module of the disclosure includes a multilayer circuit layer, multiple micro LEDs, and an insulating flat layer. The multilayer circuit layer includes a top circuit layer and a bottom circuit layer. The bottom circuit layer includes multiple pads. The micro LEDs are disposed on the top circuit layer of the multilayer circuit layer and define multiple light-emitting units. Each of the light-emitting units includes three of the micro LEDs that are separated from each other. The light-emitting units are arranged in a matrix of m columns and n rows to define multiple pixel regions, and quantity of the pads is equal to 3m+n. An orthographic projection of each of the micro LEDs on the bottom circuit layer completely overlaps the corresponding pad. The insulating flat layer covers the top circuit layer of the multilayer circuit layer and the micro LEDs.

Abstract: A micro light emitting diode (micro LED) display and a controller thereof are provided. The micro LED display includes a circuit board, a plurality of micro LED devices, and the controller. The micro LED devices are disposed on a first surface of the circuit board. The micro LED devices respectively have a plurality of pixel arrays. The controller is carried by the circuit board and is configured to transmit a plurality of control signals to respectively control display statuses of the pixel arrays of the micro LED devices.

Abstract: A display apparatus includes a first circuit board and a plurality of first light emitting display units. The first circuit board has a first surface and a first board edge connected to the first surface. The first light emitting display units are disposed on the first surface. Each of the first light emitting display units has a plurality of first pixel areas and includes a first driving circuit layer electrically bonded to the first circuit board and a plurality of first light emitting devices. The first light emitting devices are disposed on one side of the first driving circuit layer away from the first circuit board and are electrically bonded to the first driving circuit layer. At least one of the first light emitting display units has a first side edge parallel to the first board edge. The first board edge is drawn back from the first side edge.

Abstract: A light-emitting display unit including first to third metal layers, first to second insulation layers and micro light-emitting devices is provided. The first metal layer has conductive patterns. The second metal layer has transfer patterns. The third metal layer has pad patterns. The second metal layer is located between the first metal layer and the third metal layer. A distribution density of the first metal layer is less than that of the second metal layer, and greater than that of the third metal layer. The first insulation layer is disposed between the first metal layer and the second metal layer. The second insulation layer is disposed between the second metal layer and the third metal layer. The micro light-emitting devices are disposed on one side of the first metal layer away from the second metal layer, and electrically bonded to the conductive patterns. A display apparatus adopting the light-emitting display unit is also provided.

Abstract: A gas sensing device is adapted to detect a concentration of a target gas. The gas sensing device comprises a dielectric layer, a reference sensing portion, a target sensing portion, and a controller. The dielectric layer is disposed on a surface. The reference sensing portion and the target sensing portion are respectively disposed on a supporting side of the dielectric layer, with said supporting side facing away from the surface. The reference sensing portion includes a first conductive layer and a first sensing layer with low sensitivity to the target gas. The target sensing portion includes a second conductive layer and a second sensing layer with high sensitivity to the target gas. The controller obtains the immittance values of the first conductive layer and the second conductive layer, and calculates a concentration value of the target gas according to the immittance values and a correlation function.

Abstract: A light emitting module including a circuit carrier and a plurality of light emitting devices is provided. The circuit carrier includes a first circuit layer, a second circuit layer, a dielectric layer and a plurality of conductive vias. The first circuit layer and the second circuit layer are located at two opposite sides of the dielectric layer. The conductive vias pass through the dielectric layer and two opposite end portions of each of the conductive vias are respectively connected to the first circuit layer and the second circuit layer. The light emitting devices are electrically bonded to the first circuit layer. Moreover, the light emitting devices are disposed in a device disposing area of the circuit carrier and the conductive vias are arranged outside the device disposing area. A display device is also provided.

Abstract: A gas sensing device is adapted to detect a concentration of a target gas. The gas sensing device comprises a dielectric layer, a reference sensing portion, a target sensing portion, and a controller. The dielectric layer is disposed on a surface. The reference sensing portion and the target sensing portion are respectively disposed on a supporting side of the dielectric layer, with said supporting side facing away from the surface. The reference sensing portion includes a first conductive layer and a first sensing layer with low sensitivity to the target gas. The target sensing portion includes a second conductive layer and a second sensing layer with high sensitivity to the target gas. The controller obtains the immittance values of the first conductive layer and the second conductive layer, and calculates a concentration value of the target gas according to the immittance values and a correlation function.

Abstract: A display panel includes a first substrate, a plurality of first color micro light emitting diodes (LEDs), a plurality of second color LEDs and a shading layer. The first substrate has a plurality of pixel zones arranged in an array form. Each of the first color LEDs has a first light emitting surface facing to a display direction. Each of the second color LEDs has a second light emitting surface facing to the display direction. Each of the pixel zones is provided with one of the first color micro LEDs and one of the second color LEDs. The shading layer is disposed in the pixel zones. The shading layer overlaps part of the first light emitting surface and part of the second light emitting surface in the display direction.

Abstract: A method for manufacturing a wavelength converting film is provided. A release film is provided. At a least one coating process is performed to form at least one wavelength converting layer on the release film, wherein a first contact surface of the at least one wavelength converting layer and the release film has a first roughness. An adhesive layer is formed on a surface of the wavelength converting layer farthest from the release film, wherein a second contact surface of the adhesive layer and the wavelength converting layer has a second roughness. The second roughness is greater than the first roughness.

Abstract: A micro light-emitting diode display device is disclosed in the present disclosure. The micro light-emitting diode display device includes a substrate and a plurality of display units. The substrate has a supporting surface. The plurality of display units is disposed on the substrate, with each of the plurality of display units including a plurality of micro light-emitting diodes, wherein a gap existing between any two of the plurality of display units next to each other has a varying width.

Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.