Abstract: Conductive adhesive films can include a binding material having a first set of conductive particles therewithin. The binding material can be electrically non-conductive and can flow between and bond external electronic components during a bonding process. The first set of conductive particles can each have cores formed of a first material, such as polymer, and coatings surrounding the cores, the coatings formed of a second material that is electrically conductive, such as nickel. The binding material can also include a second set of smaller conductive particles formed of a third material that is electrically conductive, such as copper, which can have coatings formed of a fourth material that is electrically conductive, such as silver. The first set of conductive particles can each be sphere shaped, and the second set of conductive particles can each be flake shaped. The conductive particles can form electrical paths between the external electronic components.

Abstract: A sensor includes a patterned compliant layer positioned between two substrates. Each substrate can include one or more conductive electrodes, with each electrode of one substrate paired with a respective electrode of the other substrate. Each pair of conductive electrodes forms a capacitor. Several methods are disclosed that can be used to produce the patterned compliant layer.

Abstract: A force sensor includes compliant material that is configured to stay within a maximum uncompressed dimension in a first direction when compressed in a second direction. The first direction may be perpendicular to the second direction. The compliant material may stay within the maximum uncompressed dimension when compressed by expanding into one or more gaps defined in the compliant material. Such gaps may be defined on an external surface of the compliant material and/or internal to the compliant material. The gaps may be formed using a variety of different processes during or after formation of the compliant material.

Abstract: In some embodiments, a haptic actuator includes piezoelectric material and a pattern of voltage electrodes coupled to a surface of the piezoelectric material. The voltage electrodes are individually controllable to supply voltage to different portions of the piezoelectric material. Different sections of the piezoelectric material are operable to deflect, producing haptic output at those locations, in response to the application of the voltage. Differing voltages may be provided to one or more of the voltage electrodes to affect the location of the deflection, and thus the haptic output. In various embodiments, a haptic output system incorporates a sealed haptic element. The sealed haptic element includes a piezoelectric component that is coupled to one or more flexes and is sealed and/or enclosed by the flex(es) and an encapsulation or sealing material.

Abstract: An electronic device configured to provide localized haptic feedback to a user on one or more regions or sections of a surface of the electronic device. A support structure is positioned below the surface, and one or more haptic actuators are coupled to the support structure. In some examples, the support structure is shaped or configured to amplify a response to a haptic actuator. When a haptic actuator is actuated, the support structure deflects, which causes the surface to bend or deflect at a location that substantially corresponds to the location of the activated haptic actuator. In some examples, prior to providing haptic feedback, at least one haptic actuator is electrically pre-stressed to place the haptic actuator(s) in a pre-stressed state. When haptic feedback is to be provided, at least one haptic actuator transitions from the pre-stressed state to a haptic output state to produce one or more deflections in the surface.

Abstract: An electronic device with a force sensing device is disclosed. The electronic device comprises a user input surface defining an exterior surface of the electronic device, a first capacitive sensing element, and a second capacitive sensing element capacitively coupled to the first capacitive sensing element. The electronic device also comprises a first spacing layer between the first and second capacitive sensing elements, and a second spacing layer between the first and second capacitive sensing elements. The first and second spacing layers have different compositions. The electronic device also comprises sensing circuitry coupled to the first and second capacitive sensing elements configured to determine an amount of applied force on the user input surface. The first spacing layer is configured to collapse if the applied force is below a force threshold, and the second spacing layer is configured to collapse if the applied force is above the force threshold.

Abstract: A method of fabricating a semiconductor device comprises forming a dielectric layer above a substrate, the dielectric layer including a fixed dielectric portion and a proof mass portion, forming a source region and a drain region in the substrate, forming a gate electrode in the proof mass portion, and releasing the proof mass portion, such that the proof mass portion is movable with respect to the fixed dielectric portion and the gate electrode is movable with the proof mass portion relative to the source region and the drain region.

Abstract: In one embodiment, a portable temperature sensing system includes a portable housing configured to be carried by a user, a microelectrical mechanical system (MEMS) thermal sensor assembly supported by the housing and including an array of thermal sensor elements, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, determine an average sensed temperature based upon the signals, and render data associated with the determined average sensed temperature.

Abstract: A vehicle abnormal sound identification system includes a database and at least one vehicle sound processing system. The database stores a vehicle sound comparison file having abnormal sound data and normal sound data of different parts of a vehicle under different conditions. Each processing system includes a plurality of sound sensors, a vehicle computer and a storage device disposed in the vehicle. The plurality of sound sensors receives sound generated from different parts of the car. The vehicle computer processes the sound collected by the plurality of sound sensors to generate a plurality of sound character data, and uploads the sound character data to the database. The database updates the comparison file according to the sound character data.

Abstract: A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.

Abstract: A multi-band spectrum division device is provided, comprising: a first parabolic reflection mirror, planar multi-mirrors, an optical grating and a second parabolic mirror. The first parabolic mirror is configured to reduce the divergent angle of incident optical beam, and to generate a collimated optical beam. The planar multi-mirrors are configured to adjust the incident angles of collimated beam on the grating surface. The grating is configured to disperse the incident signals with multi-wavelengths. The second parabolic mirror is configured to focus the multi-wavelength signals on its focal plane. Besides, each of the planar multi-mirrors has different location and angle in this device.

Abstract: A sensor module can include a sensor that is configured to detect any given input or environmental conditions, such as, for example, touch or force inputs. The sensor module can be included in an electronic device. Methods for producing the sensor module are disclosed.

Abstract: A sensor includes a patterned compliant layer positioned between two substrates. Each substrate can include one or more conductive electrodes, with each electrode of one substrate paired with a respective electrode of the other substrate. Each pair of conductive electrodes forms a capacitor. Several methods are disclosed that can be used to produce the patterned compliant layer.

Abstract: An electronic device such as a device with a display may have a force sensor. The force sensor may include capacitive electrodes separated by a deformable layer such as a layer of an elastomeric polymer. The display or other layers in the electronic device may deform inwardly under applied force from a finger of a user or other external object. As the deformed layers contact the deformable layer, the deformable layer is compressed and the spacing between the capacitive electrodes of the force sensor decreases. This causes a measurable rise in the capacitance signal and therefore the force signal output of the force sensor. To prevent the deformable layer from sticking to the inner surface of the display layers, air flow promotion structures may be interposed between the deformable layer and the inner surface of the display. The air flow promotion structures may include spacer pads with anti-stick surfaces.

Abstract: The present invention provides a measurement system of real-time spatially-resolved spectrum and time-resolved spectrum and a measurement module thereof. The measurement system includes an excitation light and a measurement module. The excitation light excites a fluorescent sample and the measurement module receives and analyzes fluorescence emitted by the fluorescent sample. The measurement module includes a single-photon linear scanner and a linear CCD spectrometer. The single-photon linear scanner selectively intercepts a light beam component of a multi-wavelength light beam that has a predetermined wavelength to generate a single-wavelength time-resolved signal, wherein the multi-wavelength light beam is generated by splitting the fluorescence. The linear CCD spectrometer receives the multi-wavelength light beam and generates a spatially-resolved full-spectrum fluorescence signal.

Abstract: Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.

Abstract: A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.

Abstract: A sensor device includes a first CMOS chip and a second CMOS chip with a first moving-gate transducer formed in the first CMOS chip for implementing a first 3-axis inertial sensor and a second moving-gate transducer formed in the second CMOS chip for implementing a second 3-axis inertial sensor. An ASIC for evaluating the outputs of the first 3-axis inertial sensor and the second 3-axis inertial sensor is distributed between the first CMOS chip and the second CMOS chip.

Abstract: A force sensor includes compliant material that is configured to stay within a maximum uncompressed dimension in a first direction when compressed in a second direction. The first direction may be perpendicular to the second direction. The compliant material may stay within the maximum uncompressed dimension when compressed by expanding into one or more gaps defined in the compliant material. Such gaps may be defined on an external surface of the compliant material and/or internal to the compliant material. The gaps may be formed using a variety of different processes during or after formation of the compliant material.

Abstract: A method of fabricating a semiconductor device comprises forming a dielectric layer above a substrate, the dielectric layer including a fixed dielectric portion and a proof mass portion, forming a source region and a drain region in the substrate, forming a gate electrode in the proof mass portion, and releasing the proof mass portion, such that the proof mass portion is movable with respect to the fixed dielectric portion and the gate electrode is movable with the proof mass portion relative to the source region and the drain region.