Abstract: A semiconductor device includes a substrate, a first dielectric layer located above the substrate, a moving-gate transducer, and a proof mass. The moving-gate transducer is at least partially formed within the substrate and is at least partially formed within the first dielectric layer. The proof mass includes a portion of the first dielectric layer and a portion of a silicon layer. The silicon layer is located above the first dielectric layer.

Abstract: In one embodiment, a method of deforming a MEMS structure includes providing a base layer, providing a first piezoelectric slab operably connected to a surface of the base layer, determining a desired deformation of the base layer, applying a first potential to a first electrode operably connected to the first piezoelectric slab, applying a second potential to a second electrode operably connected to the first piezoelectric slab, and deforming the base layer with the first piezoelectric slab using the applied first potential and the applied second potential based upon the determined desired deformation.

Abstract: Embodiments of an implantable device for delivering a therapeutic agent to a patient include a reservoir configured to contain a liquid comprising the therapeutic agent, and a cannula in fluid communication with the reservoir. When a predetermined cracking pressure is reached, a valve opens and allows the liquid to flow through the cannula.

Abstract: An implanted parylene tube shunt relieves intra-ocular pressure. The device is implanted with an open end in the anterior chamber of the eye, allowing excess fluid to be drained through the tube out of the eye. In one embodiment, only a first end of the tube implanted into the anterior chamber of the eye is open. Intra-ocular pressure (IOP) is then monitored, for example utilizing an implanted sensor. When IOP exceeds a critical valve, a practitioner intervenes, puncturing with a laser a thinned region of the tube lying outside the eye, thereby initiating drainage of fluid and relieving pressure. In accordance with alternative embodiments, the both ends of the tube are open, and the tube includes a one-way valve configured to permit drainage where IOP exceeds the critical value. The tube may include projecting barbs to anchor the tube in the eye without the need for sutures.

Abstract: A semiconductor device includes a substrate, suspension structures extending from the upper surface of the substrate, and an absorber stack attached to the substrate by the suspension structures. The suspension structures suspend the absorber stack over the substrate such that a gap is defined between the absorber stack and the substrate. The absorber stack includes a plurality of metallization layers interleaved with a plurality of insulating layers. At least one of the metallization layers has a thickness of approximately 10 nm or less.

Abstract: A detecting system and method suitably used on a production line are disclosed, where a sensing device is arranged on a fixed position of a conveying belt, an image acquiring device and a bar code reading device are vertically arranged above the conveying belt, respectively, a computing device calculates a picture acquiring time of the acquired picture comprising a detection printed circuit board (PCB) acquired by the image acquiring device, and the computing device calculates a position to be moved by the bar code reading device to control the bar code reading device to move and read the production serial number of the detection PCB, whereby a corresponding detection drafting is queried according to a production serial number and optically detecting the detection PCB according to the detection drafting. By means of the above technical means, the detection PCB may be detected on the production line, and thus promoting the production efficiency and detection efficiency of the detection PCB.

Abstract: A detecting system and method suitably used on a production line are disclosed, where a sensing device is arranged on a fixed position of a conveying belt, an image acquiring device and a bar code reading device are vertically arranged above the conveying belt, respectively, a computing device calculates a picture acquiring time of the acquired picture comprising a detection printed circuit board (PCB) acquired by the image acquiring device, and the computing device calculates a position to be moved by the bar code reading device to control the bar code reading device to move and read the production serial number of the detection PCB, whereby a corresponding detection drafting is queried according to a production serial number and optically detecting the detection PCB according to the detection drafting. By means of the above technical means, the detection PCB may be detected on the production line, and thus promoting the production efficiency and detection efficiency of the detection PCB.

Abstract: The present invention discloses a method for manufacturing a wafer level chip scale package device with one or more pre-solder layers, and a wafer level chip scale package device made thereby. The device includes: a chip including at least one bonding pad; a UBM layer disposed on the bonding pad; at least one pre-solder layer disposed on the UBM layer; and a bump melted and combined with the pre-solder layer. The device may include two pre-solder layers.

Abstract: An implantable polymer-based pressure sensor featuring an electrical LC-tank resonant circuit for passive wireless sensing without power consumption on the implanted site. The sensor is microfabricated with parylene to create a flexible coil substrate that can be folded for smaller physical form factor during implantation, and can be stretched back without damage for enhanced inductive sensor-reader coil coupling. Data received from the sensor can be enhanced to provide improved pressure measurements at increased distances.

Abstract: In one embodiment, a portable temperature sensing system includes a portable housing configured to be carried by a user, a microelectrical mechanical system (MEMS) thermal sensor assembly supported by the housing and including an array of thermal sensor elements, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, determine an average sensed temperature based upon the signals, and render data associated with the determined average sensed temperature.

Abstract: Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.

Abstract: In one embodiment, a method of opening a passageway to a cavity includes providing a donor portion, forming a heating element adjacent to the donor portion, forming a first sacrificial slab abutting the donor portion, wherein the donor portion and the sacrificial slab are a shrinkable pair, forming a first cavity, a portion of the first cavity bounded by the first sacrificial slab, generating heat with the heating element, forming a first reduced volume slab from the first sacrificial slab using the generated heat and the donor portion, and forming a passageway to the first cavity by forming the first reduced volume slab.

Abstract: A semiconductor device includes a substrate, a first dielectric layer located above the substrate, a moving-gate transducer, and a proof mass. The moving-gate transducer is at least partially formed within the substrate and is at least partially formed within the first dielectric layer. The proof mass includes a portion of the first dielectric layer and a portion of a silicon layer. The silicon layer is located above the first dielectric layer.

Abstract: A sensor device includes a first CMOS chip and a second CMOS chip with a first moving-gate transducer formed in the first CMOS chip for implementing a first 3-axis inertial sensor and a second moving-gate transducer formed in the second CMOS chip for implementing a second 3-axis inertial sensor. An ASIC for evaluating the outputs of the first 3-axis inertial sensor and the second 3-axis inertial sensor is distributed between the first CMOS chip and the second CMOS chip.

Abstract: A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.

Abstract: Systems and methods for monitoring analytes in real time using integrated chromatography systems and devices. Integrated microfluidic liquid chromatography devices and systems include multiple separation columns integrated into a single substrate. Using such a device, parallel analysis of multiple samples can be performed simultaneously and/or sequential analysis of a single sample can be performed simultaneously on a single chip or substrate. The devices and systems are well suited for use in high pressure liquid chromatography (HPLC) applications. HPLC chips and devices including embedded parylene channels can be fabricated using a single mask process.

Abstract: A semiconductor device includes a substrate, suspension structures extending from the upper surface of the substrate, and an absorber stack attached to the substrate by the suspension structures. The suspension structures suspend the absorber stack over the substrate such that a gap is defined between the absorber stack and the substrate. The absorber stack includes a plurality of metallization layers interleaved with a plurality of insulating layers. At least one of the metallization layers has a thickness of approximately 10 nm or less.

Abstract: Systems and methods for monitoring analytes in real time using integrated chromatography systems and devices. Integrated microfluidic liquid chromatography devices and systems include multiple separation columns integrated into a single substrate. Using such a device, parallel analysis of multiple samples can be performed simultaneously and/or sequential analysis of a single sample can be performed simultaneously on a single chip or substrate. The devices and systems are well suited for use in high pressure liquid chromatography (HPLC) applications. HPLC chips and devices including embedded parylene channels can be fabricated using a single mask process.

Abstract: An implanted parylene tube shunt relieves intra-ocular pressure. The device is implanted with an open end in the anterior chamber of the eye, allowing excess fluid to be drained through the tube out of the eye. In one embodiment, only a first end of the tube implanted into the anterior chamber of the eye is open. Intra-ocular pressure (IOP) is then monitored, for example utilizing an implanted sensor. When IOP exceeds a critical valve, a practitioner intervenes, puncturing with a laser a thinned region of the tube lying outside the eye, thereby initiating drainage of fluid and relieving pressure. In accordance with alternative embodiments, the both ends of the tube are open, and the tube includes a one-way valve configured to permit drainage where IOP exceeds the critical value. The tube may include projecting barbs to anchor the tube in the eye without the need for sutures.

Abstract: A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.