Abstract: A fabricating method and structure form a wafer level module with a solid adhesive film. A first solid adhesive film includes a first release film and a second release film that respectively cover a first surface and a second surface of the first solid adhesive film. Openings are patterned through the first solid adhesive film. After removing parts of the first release film to expose the first surface of the first solid adhesive film, the exposed first surface of the first solid adhesive film is aligned and adhered to a first substrate.

Abstract: A wireless communication device includes a power source, a control unit, a main unit, a conversion unit, a switch unit and an output unit. The control unit is configured for generating a control signal according to predetermined properties for an electric acupuncture and outputting an on signal. The main unit is configured for implementing communication functions of the wireless communication device. The conversion unit is configured for modulating a voltage from the power source according to the control signal to generate a series of electric pulses, the electric pulses ranging from 100 to 180 volts with a frequency at 0 to 20 hertz. The switch unit is configured for receiving the on signal and the electric pulses and outputting the electric pulses according to the on signal. The output unit is configured for receiving the electric pulses and applying the electric pulses to a user.