Abstract: The present invention discloses a multi-dimensional vibration grinding cavity body. By adjusting amplitudes (power) and frequencies of the multi-dimensional ultrasonic vibration source, such that the multi-directional macroscopic flow is formed in the cavity body while keeping the vibration medium to have the original characteristics to improve the performance of grinding of slurry.

Abstract: A character-tracking system is provided. The system includes a plurality of cameras, a first computing server, a second computing server, and a third computing server. The cameras are configured to capture scene images of a scene with different shooting ranges. The first computing server performs body tracking on a body region in the scene image to generate character data. The third computation server obtains a body region block from each scene image according to the character data for facial recognition to obtain user identity. The first computing server further performs person re-identification on different body regions to link the body regions with its person tag belonging to the same user. The first computing server further represents the linked body regions and their person tags with a corresponding user identity.

Abstract: A character-tracking system is provided. The system includes a plurality of cameras, a first computing server, a second computing server, and a third computing server. The cameras are configured to capture scene images of a scene with different shooting ranges. The first computing server performs body tracking on a body region in the scene image to generate character data. The third computation server obtains a body region block from each scene image according to the character data for facial recognition to obtain user identity. The first computing server further performs person re-identification on different body regions to link the body regions with its person tag belonging to the same user. The first computing server further represents the linked body regions and their person tags with a corresponding user identity.

Abstract: An additive manufacturing apparatus includes a main system and a cleaning transportation system separated from the main system. The main system includes an additive manufacturing module. The additive manufacturing module includes an additive manufacturing chamber. The additive manufacturing chamber includes a powder discharging openings and a vibration unit. The powder discharging openings are formed at a lower portion of the additive manufacturing chamber, and the powders in the additive manufacturing chamber are discharged down via gravitation. The vibrational unit is for vibrating the powders so as to accelerate downward powder discharging via vibration of the vibrational unit. The present application solves the conventional problems of excessive consumed energy, large required installation and operational space, inconvenience of powder removing and swirled raised powder haze in the environment.

Abstract: A powder recycling system includes a supply tank, a continuous loss-in-weight module, a pneumatic module, a transfer channel, a recycle module, and a refilling tank. The supply tank accommodates recycling powder. The continuous loss-in-weight module includes a storage tank receiving the recycling powder from the supply tank and a rotary output pipe connected to the storage tank to output the recycling powder. The continuous loss-in-weight module controls the mass flow rate of the output of the recycling powder according to the weight change of the storage tank. The pneumatic module enables the recycling powder to float and move in the transfer channel. The recycle module is connected to the transfer channel to receive the recycling powder, sieves the recycling powder, provides virgin powder, and mixes the virgin powder with the recycling powder. The refilling tank is connected to the recycle module to receive the recycling powder and the virgin powder.

Abstract: The curved flow channel with built-in lattice structure provided by the present application is configured with the lattice structure disposed at the outer inside wall of the curved section away from a center of curvature of the curved section. Through geometry and distribution design of the lattice structure, flow rate and flow direction of fluid impacting the lattice structure can be altered, which achieves the purpose of flow rate redistribution in the curved flow channel and produces a downstream flow field with uniform distribution.

Abstract: The curved flow channel with built-in lattice structure provided by the present application is configured with the lattice structure disposed at the outer inside wall of the curved section away from a center of curvature of the curved section. Through geometry and distribution design of the lattice structure, flow rate and flow direction of fluid impacting the lattice structure can be altered, which achieves the purpose of flow rate redistribution in the curved flow channel and produces a downstream flow field with uniform distribution.

Abstract: The present application provides not only a heating device for additive manufacturing but also a heating module and a manufacturing apparatus utilizing the heating device. The heating device utilizes a rotational reflective cover to modulate a heating direction of a heating source, which expands an area correspondingly irradiated by the heating source and enhances uniformity of heating. Besides, the heating modules can be coupled and controlled by a controlling subsystem so as to respectively irradiate different areas with ranges at least partially intersecting each other, which also improves heating uniformity for heating a large area.

Abstract: A powder recycling system includes a supply tank, a continuous loss-in-weight module, a pneumatic module, a transfer channel, a recycle module, and a refilling tank. The supply tank accommodates recycling powder. The continuous loss-in-weight module includes a storage tank receiving the recycling powder from the supply tank and a rotary output pipe connected to the storage tank to output the recycling powder. The continuous loss-in-weight module controls the mass flow rate of the output of the recycling powder according to the weight change of the storage tank. The pneumatic module enables the recycling powder to float and move in the transfer channel. The recycle module is connected to the transfer channel to receive the recycling powder, sieves the recycling powder, provides virgin powder, and mixes the virgin powder with the recycling powder. The refilling tank is connected to the recycle module to receive the recycling powder and the virgin powder.

Abstract: The present application discloses an additive manufacturing chamber, an additive manufacturing module and an additive manufacturing apparatus therewith. Powder discharging openings are formed at a lower portion of the additive manufacturing chamber, and the powders in the additive manufacturing chamber are discharged down via gravitation. The present application further includes a vibrational unit for vibrating the powders so as to accelerate downward powder discharging via vibration of the vibrational unit. The additive manufacturing apparatus can include a main system and a cleaning transportation system separated from the main system. The present application solves the conventional problems of excessive consumed energy, large required installation and operational space, inconvenience of powder removing and swirled raised powder haze in the environment.

Abstract: A method of manufacturing chip package includes providing a semiconductor substrate having at least a photo diode and an interconnection layer. The interconnection layer is disposed on an upper surface of the semiconductor substrate and above the photo diode and electrically connected to the photo diode. At least a redistribution circuit is formed on the interconnection layer. The redistribution circuit is electrically connected to the interconnection layer. A packaging layer is formed on the redistribution circuit. Subsequently, a carrier substrate is attached to the packaging layer. A color filter is formed on a lower surface of the semiconductor substrate. A micro-lens module is formed under the color filter. The carrier substrate is removed.

Abstract: A chip package including a substrate is provided. The substrate includes a front surface, a back surface, and a side surface. A redistribution layer is disposed on the back surface and is electrically connected to a sensing or device region in the substrate. A protection layer covers the redistribution layer and extends onto the side surface. A cover plate is disposed on the front surface and laterally protrudes from the protection layer on the side surface. The cover plate includes a first surface facing the front surface and a second surface facing away from the front surface. A bottom portion of the cover plate broadens from the first surface towards the second surface. A method of forming the chip package is also provided.

Abstract: A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, having a bottom covering the seed layer, is formed in the opening. A barrier layer covering at least one top portion of the copper layer is formed on the copper layer. An oxidation potential of the barrier layer is greater than that of the copper layer. The patterned photoresist layer is removed to perform an etching process, wherein the copper layer and a portion of the seed layer exposed are etched to form a wiring layer. An immersion process is performed to form an anti-oxidation layer comprehensively on exposed surfaces of the barrier layer and the wiring layer.

Abstract: A method of manufacturing chip package includes providing a semiconductor substrate having at least a photo diode and an interconnection layer. The interconnection layer is disposed on an upper surface of the semiconductor substrate and above the photo diode and electrically connected to the photo diode. At least a redistribution circuit is formed on the interconnection layer. The redistribution circuit is electrically connected to the interconnection layer. A packaging layer is formed on the redistribution circuit. Subsequently, a carrier substrate is attached to the packaging layer. A colour filter is formed on a lower surface of the semiconductor substrate. A micro-lens module is formed under the colour filter. The carrier substrate is removed.

Abstract: Embodiments of the present invention provide a chip package including: a semiconductor substrate having a first surface and a second surface; a device region formed in the semiconductor substrate; a dielectric layer disposed on the first surface; and a conducting pad structure disposed in the dielectric layer and electrically connected to the device region; a cover substrate disposed between the chip and the cover substrate, wherein the spacer layer, a cavity is created an surrounded by the chip and the cover substrate on the device region, and the spacer layer is in direct contact with the chip without any adhesion glue disposed between the chip and the spacer layer.

Abstract: A liquid crystal display (LCD) overdriving method, an LCD overdriving device and an LCD are disclosed. The LCD overdriving method improves displaying quality and a response speed of the LCD comprising the following steps of: receiving by a scaling controller, a previous frame image grayscale value stored into a frame buffer of the scaling controller; receiving a next frame image grayscale value by the scaling controller and sending the previous frame image grayscale value and the next frame image grayscale value to a time schedule controller so that the time schedule controller looks up a lookup table and outputs an overdriving grayscale value. The present disclosure can effectively save the cost by eliminating the need of providing an additional frame buffer in the time schedule controller. Furthermore, as image grayscale values of only two pixels need to be stored in the time schedule controller, it can save more memory spaces.

Abstract: An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.

Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a light shielding layer disposed on the second surface of the substrate and directly contacting with the conducting layer, wherein the light shielding layer has a light shielding rate of more than about 80% and has at least an opening exposing the conducting layer; and a conducting bump disposed in the opening of the light shielding layer to electrically contact with the conducting layer, wherein all together the light shielding layer and the conducting bump substantially and completely cover the second surface of the substrate.

Abstract: A tangent angle circuit is connected to a plurality of scan line driving circuits and comprises: a charging module integrated on a control board to receive input of a direct current (DC) driving voltage and output a cut-in voltage to charge the scan line driving circuits; and a plurality of discharging modules integrated on the scan line driving circuits respectively to control the corresponding scan line driving circuits to discharge. In the present invention, by distributing the discharging modules on each of the scan line driving circuits respectively, the burden of load discharged charges on the discharging modules is reduced to avoid occurrence of an overhigh temperature; and the discharging modules are spatially separated, which is further favorable for reducing the temperature, releasing the space of the control board and reducing the area of the control board.

Abstract: A method of fabricating a semiconductor stacked package is provided. A singulation process is performed on a wafer and a substrate, on which the wafer is stacked. A portion of the wafer on a cutting region is removed, to form a stress concentrated region on an edge of a chip of the wafer. The wafer and the substrate are then cut, and a stress is forced to be concentrated on the edge of the chip of the wafer. As a result, the edge of the chip is warpaged. Therefore, the stress is prevented from extending to the inside of the chip. A semiconductor stacked package is also provided.