Abstract: A micro LED display device includes: a substrate; a plurality of micro light-emitting diodes disposed on the substrate; and a reflective layer and a black layer sequentially stacked on the substrate. The reflective layer and the black layer cover a surface of the substrate, wherein a top surface of the plurality of micro light-emitting diodes is exposed through the reflective layer and the black layer. A plurality of reflective banks and a plurality of black banks are sequentially disposed on the black layer and exposing the plurality of micro light-emitting diodes; and a color-conversion material covers the top surface of at least one of the plurality of micro light-emitting diodes. The color-conversion material is laterally disposed between the plurality of reflective banks. The reflective layer, the black layer, the plurality of reflective banks, and the plurality of black banks overlap each other in a display direction.

Abstract: A method includes providing a substrate, forming a patterned hard mask layer over the substrate, etching the patterned hard mask layer to form a hole that penetrates the patterned hard mask layer, forming a barrier portion in the hole, removing the patterned hard mask layer, and forming a gate structure over the substrate. Formation of the gate structure includes forming a dielectric body portion on the substrate. The barrier portion that is thicker than the dielectric body portion adjoins one end of the dielectric body portion. The dielectric body portion and the barrier portion are collectively referred to as a gate dielectric layer. Formation of the gate structure further includes forming a gate electrode on the gate dielectric layer and forming gate spacers on opposite sidewalls of the gate electrode. During formation of the gate spacers, a portion of the barrier portion is removed to form a recessed corner.

Abstract: A micro LED display device includes: a substrate; a plurality of micro light-emitting diodes disposed on the substrate; and a reflective layer and a black layer sequentially stacked on the substrate. The reflective layer and the black layer cover a surface of the substrate, wherein a top surface of the plurality of micro light-emitting diodes is exposed through the reflective layer and the black layer. A plurality of reflective banks and a plurality of black banks are sequentially disposed on the black layer and exposing the plurality of micro light-emitting diodes; and a color-conversion material covers the top surface of at least one of the plurality of micro light-emitting diodes. The color-conversion material is laterally disposed between the plurality of reflective banks. The reflective layer, the black layer, the plurality of reflective banks, and the plurality of black banks overlap each other in a display direction.

Abstract: A micro light-emitting diode (LED) display panel including a substrate, a first micro LED, a first light-shielding wall, a second micro LED, and a second light-shielding wall is provided. The substrate includes a plurality of pixel regions arranged in an array. The first micro LED is disposed on one of the pixel regions of the substrate. The first light-shielding wall is disposed on the substrate and located beside the first micro LED. The second micro LED is disposed on the one of the pixel regions of the substrate and located beside the first micro LED. The second light-shielding wall is disposed on the substrate and located beside the second micro LED. A light wavelength of the first micro LED is different from a light wavelength of the second micro LED. A height of the first light-shielding wall is smaller than a height of the second light-shielding wall.

Abstract: A micro light-emitting diode display panel includes a substrate, at least one light-emitting element, a reflective layer and a light-absorbing layer. The at least one light-emitting element is disposed on the substrate to define at least one pixel, and each light-emitting element includes micro light-emitting diodes. The reflective layer is disposed on the substrate and located between the micro light-emitting diodes. The reflective layer has cavities surrounding the micro light-emitting diodes, such that a thickness of a portion of the reflective layer close to any one of the micro light-emitting diodes is greater than a thickness of a portion of the reflective layer away from the corresponding micro light-emitting diode. The light-absorbing layer is at least disposed in the cavities of the reflective layer.

Abstract: A micro-light-emitting diode chip includes an epitaxial structure, an electrode, a transparent structure, and a reflection layer. The epitaxial structure has a light exit surface, a back surface opposite to the light exit surface, and a sidewall surface. The sidewall surface is connected to the light exit surface and the back surface. The electrode is electrically coupled to the epitaxial structure. The transparent structure has an inner surface and an outer surface opposite to the inner surface. The inner surface is connected to the sidewall surface. A distance between the outer surface and the inner surface on a plane where the back surface is located is less than a distance between the outer surface and the inner surface on a plane where the light exit surface is located. The reflection layer is in direct contact with the outer surface. A micro-light-emitting diode display is also provided.

Abstract: Compute engine circuitry configured to represent a spin network mapping of a graph representing a combinatorial optimization problem includes a plurality of ring oscillator cells, each of which includes a ring oscillator having an oscillator output, at least one coupling block, and a read block. Each coupling block connects the ring oscillator of the cell to the ring oscillator of one of a plurality of neighboring cells to form a coupled ring oscillator. The read block generates a state output for each coupled ring oscillator that indicates whether the coupled ring oscillator is in one of a same-phase state, in which the connected ring oscillators oscillate in phase with each other, and an opposite-phase state, in which the connected ring oscillators oscillate in an opposite phase from each other. A controller is configured to output a total energy of the mapping based on the state outputs.

Abstract: A display panel includes a pixel unit. The pixel unit includes a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light-emitting element, a first light source element, and a first color conversion structure. A light emitted by the first light-emitting element has a first color. The first color conversion structure is disposed on the first light source element and adapted to convert a light emitted by the first light source element into a light of the first color. The second sub-pixel includes a second light-emitting element. A light emitted by the second light-emitting element has a second color different from the first color.

Abstract: Disclosed herein is a chip package and method for fabricating the same are provided that includes a redistribution layer (RDL) with a plurality of loop and void structures. The chip package includes an integrated circuit (IC) die, and a package substrate. The RDL is disposed between the IC die and the package substrate. The RDL has RDL circuitry that connects the IC die to the package substrate. The RDL circuitry includes a first coil formed in a first metal layer and a second coil formed in a second metal layer. A first end of the second coil is coupled to a second end of the first coil by a first via. A second end of the second coil is the IC die.

Abstract: A micro light-emitting diode display panel including first and second substrates, micro light-emitting diodes, a wavelength conversion layer, a light-shielding pattern layer, a light filter layer, and an air gap is provided. The micro light-emitting diodes are disposed on the first substrate and respectively located in a plurality of sub-pixel areas. The micro light-emitting diodes are adapted to emit a light beam. The wavelength conversion layer is overlapped with at least a portion of the micro light-emitting diodes. The light beam is used to excite the wavelength conversion layer to emit a converted light beam. The light filter layer is disposed between the wavelength conversion layer and the second substrate and overlapped with the micro light-emitting diodes. The air gap is disposed between any two adjacent ones of any one of the micro light-emitting diodes, the second substrate, the wavelength conversion layer, and the light filter layer.

Abstract: A micro light-emitting diode display device includes a display substrate, multiple pixels, and at least one color conversion layer. The pixels are disposed on the display substrate. Each of the pixels includes multiple sub-pixels. Each of the sub-pixels includes at least one micro light-emitting diode. The at least one color conversion layer is disposed on the pixels. The at least one color conversion layer is continuously disposed on at least a part of sub-pixels of different pixels along a same direction.

Abstract: Various noise isolation structures and methods for fabricating the same are presented. In one example, a substrate for chip package is provided. The substrate includes a core region, top build-up layers and bottom build-up layers. The top build-up layers are formed on a first side of the core region and the bottom build-up layers are formed on a second side of the core region that is opposite the first side. Routing circuitry formed in the bottom build-up layers is coupled to routing circuitry formed in the top build-up layers by vias formed through the core region. A void is formed in the bottom build-up layers. The void is configured as a noise isolation structure. The void has a sectional area that is different in at least two different distances from the core region.

Abstract: A micro LED display device includes: a substrate; a plurality of micro light-emitting diodes disposed on the substrate; and a reflective layer and a black layer sequentially stacked on the substrate. The reflective layer and the black layer cover a surface of the substrate, wherein a top surface of the plurality of micro light-emitting diodes is exposed through the reflective layer and the black layer. A plurality of reflective banks and a plurality of black banks are sequentially disposed on the black layer and exposing the plurality of micro light-emitting diodes; and a color-conversion material covers the top surface of at least one of the plurality of micro light-emitting diodes. The color-conversion material is laterally disposed between the plurality of reflective banks. The reflective layer, the black layer, the plurality of reflective banks, and the plurality of black banks overlap each other in a display direction.

Abstract: An exposure apparatus including a micro light emitting diode display unit and a first projection optical system is provided. The micro light emitting diode display unit has a plurality of micro light emitting diodes. The micro light emitting diode display unit is adapted to individually control light emission signals of the micro light emitting diodes and forming a predetermined pattern. The first projection optical system is disposed on a light emitting path of the micro light emitting diode display unit. The first projection optical system is configured to form an exposure pattern on a photosensitive material layer at once by applying the predetermined pattern.

Abstract: A micro LED display device is provided. The micro LED display device includes a substrate having a display region, a plurality of micro LED structures disposed inside the display region and arranged in an array, and a plurality of light-converting structures disposed on some micro LED structures. The micro LED display device also includes a positioning frame disposed outside the display region and an isolation frame surrounding the positioning frame. The water vapor transmission rate of the isolation frame is lower than the water vapor transmission rate of the positioning frame. The micro LED display device further includes a cover plate disposed on the substrate and connected to the substrate by the positioning frame and the isolation frame.

Abstract: A micro LED display device includes an epitaxial structure layer, a connection layer, a light conversion layer and a transparent layer. The epitaxial structure layer includes a plurality of micro LEDs disposed apart from each other. The connection layer is disposed at one side of the epitaxial structure layer away from the micro LEDs. The light conversion layer is fixed on the epitaxial structure layer through the connection layer and includes a plurality of light conversion portions. Each of the light conversion portions corresponds to one of the micro LEDs. The transparent layer is disposed at one side of the light conversion layer away from the epitaxial structure layer. The ratio of the thickness of the transparent layer to the width of each light conversion portion is between 0.1 and 40. A manufacturing method of the micro LED display device is also provided.

Abstract: A micro light-emitting diode display panel including first and second substrates, micro light-emitting diodes, a wavelength conversion layer, a light-shielding pattern layer, a light filter layer, and an air gap is provided. The micro light-emitting diodes are disposed on the first substrate and respectively located in a plurality of sub-pixel areas. The micro light-emitting diodes are adapted to emit a light beam. The wavelength conversion layer is overlapped with at least a portion of the micro light-emitting diodes. The light beam is used to excite the wavelength conversion layer to emit a converted light beam. The light filter layer is disposed between the wavelength conversion layer and the second substrate and overlapped with the micro light-emitting diodes. The air gap is disposed between any two adjacent ones of any one of the micro light-emitting diodes, the second substrate, the wavelength conversion layer, and the light filter layer.

Abstract: A micro LED display device is provided. The micro LED display device includes a substrate. The micro LED display device also includes a first micro LED disposed on the substrate. The micro LED display device further includes at least one first refraction structure disposed on and corresponding to the first micro LED. Moreover, the micro LED display device includes a second micro LED disposed on the substrate and adjacent to the first micro LED. The micro LED display device also includes at least one second refraction structure disposed on and corresponding to the second micro LED.

Abstract: A micro light-emitting diode display panel includes a substrate, at least one light-emitting element, a reflective layer and a light-absorbing layer. The at least one light-emitting element is disposed on the substrate to define at least one pixel, and each light-emitting element includes micro light-emitting diodes. The reflective layer is disposed on the substrate and located between the micro light-emitting diodes. The reflective layer has cavities surrounding the micro light-emitting diodes, such that a thickness of a portion of the reflective layer close to any one of the micro light-emitting diodes is greater than a thickness of a portion of the reflective layer away from the corresponding micro light-emitting diode. The light-absorbing layer is at least disposed in the cavities of the reflective layer.

Abstract: A micro-light-emitting diode chip includes an epitaxial structure, an electrode, a transparent structure, and a reflection layer. The epitaxial structure has a light exit surface, a back surface opposite to the light exit surface, and a sidewall surface. The sidewall surface is connected to the light exit surface and the back surface. The electrode is electrically coupled to the epitaxial structure. The transparent structure has an inner surface and an outer surface opposite to the inner surface. The inner surface is connected to the sidewall surface. A distance between the outer surface and the inner surface on a plane where the back surface is located is less than a distance between the outer surface and the inner surface on a plane where the light exit surface is located. The reflection layer is in direct contact with the outer surface. A micro-light-emitting diode display is also provided.