Abstract: A thermoelectric cooler (TEC) is positioned to move heat away from a hot spot on a semiconductor chip and toward a dielectric substrate. This approach to thermal management is particularly effective when used in conjunction with a buried rail and back side power delivery. The TEC may be in a layer that contains solder connections be between two device layers an IC package. Alternatively, the TEC may be in a metal interconnect structure over the semiconductor substrate such as in a passivation stack at the top of the metal interconnect structure. TECs at either of these locations may be formed by wafer-level processing.

Abstract: A semiconductor structure can include a first substrate having a frontside and a backside opposite the frontside. The semiconductor structure can include devices on the frontside. The semiconductor structure can include first interconnect structures on the frontside and coupled to the devices. The semiconductor structure can include a heat distribution layer on the frontside and electrically isolated from the first interconnect structures, where the heat distribution layer includes a thermally conductive material. The semiconductor structure can include a second substrate coupled to the first substrate on the frontside. The semiconductor structure can include second interconnect structures on the backside and coupled to the devices.

Abstract: Described herein is a graphics processor comprising first circuitry configured to execute a decoded instruction and second circuitry configured to second circuitry configured to decode an instruction into the decoded instruction. The second circuitry is configured to determine a number of registers within a register file that are available to a thread of the processing resource and decode the instruction based on that number of registers.

Abstract: A wireless device includes a satellite receiver to receive data from multiple satellites. The wireless device also includes processing circuitry and memory. The memory stores one or more neural network models. The processing circuitry is operative to identify a neural network model that has been trained to adapt to a region in which the wireless device operates, classify satellite raw measurements from each satellite at a given time into a corresponding quality level using the neural network model, and identify satellite raw measurements with a quality level higher than a threshold. The location of the wireless device is calculated using the identified satellite raw measurements.

Abstract: A semiconductor device includes an isolation structure in a substrate. The semiconductor device further includes a gate structure over a first region of the substrate, wherein the isolation structure surrounds the first region, the gate structure comprising a first section and a second section. The semiconductor device further includes a conductive field plate over the substrate, the conductive field plate extending between the first section and the second section and overlapping an edge of the first region, wherein the conductive field plate comprises a dielectric layer having a variable thickness. The semiconductor device further includes a first well in the substrate, wherein the first well overlaps the edge of the first region, and the first well extends underneath the isolation structure, and the conductive field plate extends beyond an outer-most edge of the first well.

Abstract: A knife rack includes a box body having a bottom, a plurality of peripheral walls surrounding the bottom, an accommodating space surrounded by the peripheral walls and the bottom and an opening provided where the accommodating space communicates with the outside, a top cover covering the opening and provided with a plurality of long slotted holes, and a plurality of round balls set within the accommodating space of the box body and used as a support structure for supporting knifes. The point-like contact between the round balls and the blades of stored knives can greatly reduce the contact area between the round balls and the blades, and the gaps between the round balls are conducive to air circulation.

Abstract: The present application provides a learning method for plug-in depth including steps of: (a) utilizing a robot arm to take an electronic component with a plurality of pins; (b) utilizing a first visual device to identify a pin distance; (c) utilizing a second visual device to identify a hole distance; (d) inserting the plurality of pins into the corresponding plurality of holes with a predetermined depth according to the pin distance and the hole distance; (e) determining whether the plurality of pins are inserted into the plurality of holes, performing step (f) when the determination result is satisfied, and performing step (g) when the determination result is not satisfied; (f) recording the predetermined depth and performing the step (a) again; (g) calibrating the predetermined depth and performing the step (a) again; and (h) completing the learning of the plug-in depth after the step (f) is performed multiple times successively.

Abstract: A semiconductor device includes an isolation structure in a substrate; and a gate structure over an active region of the substrate. The isolation structure surrounds the active region. The gate structure includes a first section parallel to a second section. The semiconductor device further includes a conductive field plate extending between the first section and the second section and overlapping an edge of the active region. A portion of the conductive field plate extends beyond the edge of the active region, The conductive field plate includes a dielectric layer having a first portion and a second portion, and the first portion is thicker than the second portion. The semiconductor device includes a first well overlapping the edge of the active region. The first well extends underneath the isolation structure. The conductive field plate extends beyond an outer-most edge of the first well.

Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, and a switch circuit. The feeding radiation element has a feeding point. The second radiation element is coupled through the first radiation element to the feeding radiation element. The third radiation element is coupled to the second radiation element. The fourth radiation element is coupled to the second radiation element. The fourth radiation element and the third radiation element extend in different directions. The fifth radiation element has a tuning point, and is coupled to the feeding radiation element. The feeding radiation element is disposed between the first radiation element and the fifth radiation element. The switch circuit selectively couples the tuning point to a ground voltage.

Abstract: An automatic pick-and-place system is provided, including a feeding device, a visual pattern formed on a fixed part of the feeding device, a manipulator, and a processing unit. An electronic component can be held between the fixed part and a gripping part of the feeding device. A visual module on the manipulator captures an image of the visual pattern, and the processing unit calculates the coordinate value of the electronic component. Thus, the manipulator can move to the target position and pick up the electronic element according to the coordinate value.

Abstract: A knife rack includes a box body having a bottom, a plurality of peripheral walls surrounding the bottom, an accommodating space surrounded by the peripheral walls and the bottom and an opening provided where the accommodating space communicates with the outside, a top cover covering the opening and provided with a plurality of long slotted holes, and a plurality of round balls set within the accommodating space of the box body and used as a support structure for supporting knifes. The point-like contact between the round balls and the blades of stored knives can greatly reduce the contact area between the round balls and the blades, and the gaps between the round balls are conducive to air circulation.

Abstract: A radio frequency (RF) communication assembly includes an RF communication circuit and a compensator apparatus. The compensator apparatus receives an input including an I-component of a pre-compensated signal, a Q-component of the pre-compensated signal, and encoded operating conditions of the RF communication circuit. The RF communication circuit includes RF circuit components causing signal impairments. The compensator apparatus perform neural network computing on the input, and the RF communication assembly generates a compensated output signal that compensates for at least a portion of the signal impairments.

Abstract: A non-oriented electrical steel sheet with characteristics of high permeability, high magnetic flux, and low iron loss and a manufacturing method thereof are provided. The non-oriented electrical steel sheet includes an electrical steel, wherein the electrical steel includes the following compositions of: an amount of 0.005 wt. % or less of carbon, an amount of 0.005 wt. % or less of nitrogen, an amount of 0.005 wt. % or less of sulfur, an amount of 0.05 wt. % or less of phosphorus, an amount of 1.0 to 2.5 wt. % of silicon, an amount of 0.1 to 0.8 wt. % of aluminum, an amount of 0.1 to 0.8 wt. % of manganese, an amount of 0.01 to 0.10 wt. % of antimony and the balance of iron and other unavoidable impurities, wherein the electrical steel meets the following relationship: 20?10*silicon content+11*aluminum content+6*manganese content?30.

Abstract: An antenna module including a substrate, a main antenna and a parasitic antenna is provided. The substrate has a ground. The main antenna is disposed on the substrate. The main antenna includes a first irradiating portion, a feeding portion and a first grounding portion, and the first grounding portion is connected to the ground. The parasitic antenna is disposed on the substrate. The parasitic antenna includes a second irradiating portion and a second grounding portion, and the second grounding portion is connected to the ground. An extending direction of the first irradiating portion and an extending direction of at least a part of the second irradiating portion are perpendicular to each other.

Abstract: A device includes a first buried layer over a substrate, a second buried layer over the first buried layer, a first well over the first buried layer and the second buried layer, a first high voltage well, a second high voltage well and a third high voltage well extending through the first well, wherein the second high voltage well is between the first high voltage well and the third high voltage well, a first drain/source region in the first high voltage well, a first gate electrode over the first well, a second drain/source region in the second high voltage well and a first isolation region in the second high voltage well, and between the second drain/source region and the first gate electrode, wherein a bottom of the first isolation region is lower than a bottom of the second drain/source region.