Abstract: A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

Abstract: A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

Abstract: An optimizing method and a computing apparatus for a deep learning network and a computer-readable storage medium are provided. In the method, a value distribution is obtained from a pre-trained model. One or more breaking points in a range of the value distribution are determined. Quantization is performed on a part of values of a parameter type in a first section among multiple sections using a first quantization parameter and the other part of values of the parameter type in a second section among the sections using a second quantization parameter. The value distribution is a statistical distribution of values of the parameter type in the deep learning network. The range is divided into the sections by one or more breaking points. The first quantization parameter is different from the second quantization parameter. Accordingly, accuracy drop can be reduced.

Abstract: A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.

Abstract: A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

Abstract: A vehicle risk analysis system, includes: a historical database, storing the sensing data and accident records acquired from multiple sampled vehicles into big data; a learning unit, connected to the historical database for analyzing the relationship between accident records and driving scenarios, to generate a risk classification model, which can further predict the risk of accidents for a vehicle in-use; and a risk profiling unit, receiving the risk classification model from the learning unit and acquiring the sensing data from the vehicle in-use, to generate a risk profile for the vehicle in-use under different driving modes. The risk profile reports the expected risks of accidents under different driving modes by using the occurrence rates for different driving scenarios and the expected losses of money caused by accidents, wherein each of the driving scenarios can be determined by a combination of the sensing data.

Abstract: A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

Abstract: A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.

Abstract: A multi-target vital sign detection system includes a transmitter, a receiver and a processor. The transmitter is configured to transmit a millimeter wave signal to a detection area, and the receiver is configured to receive a reflecting millimeter wave signal reflected by a plurality of targets in the detection area. The processor is configured to: generate signal strength versus distance data by analyzing the received reflecting millimeter wave signal; perform an extreme value reserving process to generate signal extreme value versus distance data; perform a peak search algorithm to obtain a peak list including a plurality of peak values and a plurality of corresponding peak distances; generate a distance array including a plurality of distance variables; and perform a vital sign detection algorithm to generate multiple sets of vital sign data.

Abstract: A multi-target vital sign detection system includes a transmitter, a receiver and a processor. The transmitter is configured to transmit a millimeter wave signal to a detection area, and the receiver is configured to receive a reflecting millimeter wave signal reflected by a plurality of targets in the detection area. The processor is configured to: generate signal strength versus distance data by analyzing the received reflecting millimeter wave signal; perform an extreme value reserving process to generate signal extreme value versus distance data; perform a peak search algorithm to obtain a peak list including a plurality of peak values and a plurality of corresponding peak distances; generate a distance array including a plurality of distance variables; and perform a vital sign detection algorithm to generate multiple sets of vital sign data.

Abstract: An anti-reflection structure includes a substrate including a planar portion, a protrusion portion disposed over the planar portion, and a coating layer, wherein the protrusion portion is integrated with the planar portion, and the coating layer conformably covers the planar portion and the protrusion portion.

Abstract: A light-emitting element comprises: a first semiconductor stack having a first conductivity type; an active layer formed on the first semiconductor stack; a second semiconductor stack having a second conductivity type formed on the active layer; and a first current-spreading layer having the first conductivity type interposed in the second semiconductor stack.

Abstract: A light-emitting element comprises: a first semiconductor stack having a first conductivity type; an active layer formed on the first semiconductor stack; a second semiconductor stack having a second conductivity type formed on the active layer; and a first current-spreading layer having the first conductivity type interposed in the second semiconductor stack.

Abstract: An anti-reflection structure includes a substrate including a planar portion, a protrusion portion disposed over the planar portion, and a coating layer, wherein the protrusion portion is integrated with the planar portion, and the coating layer conformably covers the planar portion and the protrusion portion.

Abstract: A luminous photo frame includes an outer frame assembly having a light transmittable section, a reflector plate arranged in the outer frame assembly, a light guide plate arranged between the reflector plate and the light transmittable section, a light emission element opposing an edge of the light guide plate, a brightness enhancement film arranged between the light guide plate and the light transmittable section, and a light-transmitting surface panel mounted to the outer frame assembly to be adjacent to the light transmittable section. To use, a traditional photo is first deposited at one side of the light-transmitting surface panel and the light emission element is activated to emit light, which is guided and spread by the light guide plate and reflected by the reflector plate for projecting toward the light transmittable section to pass through the brightness enhancement film and transmit through the light transmittable section and the traditional photo.

Abstract: A method for testing a TSV comprises charging a through-silicon-via under test to a first predetermined voltage level charging a capacitance device to a second predetermined voltage level; performing charge-sharing between the through-silicon-via and the capacitance device; and determining that the through-silicon-via under test is not faulty if the voltage level of the through-silicon-via after the charge-sharing step is within a predetermined range.

Abstract: A method for testing a TSV comprises charging a through-silicon-via under test to a first predetermined voltage level charging a capacitance device to a second predetermined voltage level; performing charge-sharing between the through-silicon-via and the capacitance device; and determining that the through-silicon-via under test is not faulty if the voltage level of the through-silicon-via after the charge-sharing step is within a predetermined range.

Abstract: The method and circuit for testing a TSV of the present invention exploit the electronic property of the TSV under test. The TSV under test is first reset to a first state, and is then sensed at only one end to determine whether the TSV under test follows the behavior of a normal TSV, wherein the reset and sense steps are performed at only one end of the TSV under test. If the TSV under test does not follow the behavior of a normal TSV, the TSV under test is determined faulty.

Abstract: A three-phase power supply with a three-phase three-level DC/DC converter includes a full-bridge thyristor converter with three-set four in-series power switch elements, a three-phase isolated transformer, a full-bridge rectifier, a rectifying circuit, and a low-pass filtering circuit. The three-phase power supply is used to deliver power energy from the AC input voltage to the load. The power switch elements, which separated to each other at 120-degree phase differences, are controlled through a phase shift scheme. Therefore, the three-level circuit structure is provided to reduce withstanding voltage of the power switch elements, further the zero-voltage switching (ZVS) is achieved by the isolated transformer and the power switch elements to increase the efficiency of the DC/DC converter.

Abstract: Disclosed herein is a method for preparing a coumarin compound of formula (F), in which R1, R2, and R3 are independently H, C1˜C7 alkoxy, C1˜C7 alkyl, phenoxy, benzyloxy, or a halogen atom; R4 is an alkyl group; and Ar is an optionally substituted aryl group, the method including: treating a chromene compound having the following formula (E) with an acid in the presence of water. A chromene compound of formula (E) and a method for preparing the chromene compound of formula (E) are also disclosed.