Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.

Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle, a clamping member, and a first sealing ring. The spin base has a through hole and a flange. The spindle extends through the through hole. The clamping member covers the through hole and is connected to the spindle. The clamping member includes a mounting part. The first sealing ring is disposed under the clamping member. A top surface of the first sealing ring and a top surface of the flange are in contact with a bottom surface of the mounting part.

Abstract: A thermal management method is applicable to a wireless communication apparatus. The wireless communication apparatus includes at least a wireless communication module, a heat source set, a thermally conductive assembly, a heat-dissipating fin assembly, and a cooling fan. The thermally conductive assembly is connected to the wireless communication module and the heat source set. The heat-dissipating fin assembly is connected to the thermally conductive assembly and arranged corresponding to the heat source set or the wireless communication module. The cooling fan normally operates at a first rotational speed for cooling to the heat-dissipating fin assembly. Upon the raising of a temperature value of the wireless communication apparatus, the method is to raise the first rotational speed to a second rotational speed, switch down the power consumption of the heat source set, and execute an event trigger, so as to maintain the temperature value within a proper temperature range.

Abstract: The invention provides a textile comprising a supporting mechanism disposed on a surface of a fabric, having a printed layer and a layered elastic support; the elastic support is made of thermoplastic elastomer, and is connected with the printed layer; and a plurality of air-permeable elements disposed in the supporting mechanism. The textile of the invention can be made into wearables for a human body, and the supporting mechanism is capable of supporting human motor organs. The invention also provides a supportive thermoprinting material, a printed layer and a thermoplastic elastomer material layer are disposed on a surface of a substrate, and the printed layer and the thermoplastic elastomer material layer of the thermoprinting material are combined on a fabric to form the textile of the invention.

Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.

Abstract: A display stand holder with slide rail structure includes a stand body, a pivot member, a display assembly module, and one or more constant-force springs. The stand body has a top end. The pivot member has a first end and a second end. The first end is provided with a pivot portion. The pivot portion is pivotally connected to the top end of the stand body, and the second end is away from the top end with respect to the first end. The display assembly module is disposed at the second end of the pivot member. The display module includes a slide rail assembly. The slide rail assembly includes a guide member and a slide member, and the slide member is slidably assembled on the guide member. The constant-force spring is connected between the guide member and the slide member.

Abstract: A display stand holder includes a stand member, a base, a pivot member, and a latch device. The stand member is configured to be disposed on a planar surface. The lower end of the stand member is configured to be disposed on the planar surface. The base is slidably disposed in the stand member. The pivot member includes a mounting plate and at least one pivot plate. The pivot plate is pivotally connected to the base. The latch device includes a stop pin and an actuator. The stop pin is normally embedded into the limiting notch to limit a range of rotation of the pivot member relative to the base. The actuator is configured to push the stop pin to escape from the limiting notch, allowing the pivot member to further rotate to cause the mounting plate to be parallel to the planar surface.

Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.

Abstract: An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.

Abstract: The invention provides a filament, which is a fine filament cut and formed from a thermoplastic membrane material, and is made by thermal stretching and thermal shaping. Through the invention, the filament formed by cutting can have excellent physical properties including: high strength, high elastic recovery rate, low stretch elasticity, low elongation rate, improved environmental tolerance, and increased service life, so that the filament formed by cutting has a wider application range and can be directly used in textiles. The invention is capable of producing filaments thinner than those obtained by cutting method alone. In addition, when a surface of the filament is coated with a functional coating layer, the filament of the invention will not lose the function of the coating layer.

Abstract: A display stand holder includes a stand member, a base, a pivot member, and a latch device. The stand member is configured to be disposed on a planar surface. The lower end of the stand member is configured to be disposed on the planar surface. The base is slidably disposed in the stand member. The pivot member includes a mounting plate and at least one pivot plate. The pivot plate is pivotally connected to the base. The latch device includes a stop pin and an actuator. The stop pin is normally embedded into the limiting notch to limit a range of rotation of the pivot member relative to the base. The actuator is configured to push the stop pin to escape from the limiting notch, allowing the pivot member to further rotate to cause the mounting plate to be parallel to the planar surface.

Abstract: A fabric includes an inner textile layer, an outer textile layer, and a middle textile layer. The inner textile layer includes a plurality of microfiber yarns and a plurality of elastic fiber yarns. The outer textile layer includes a plurality of composite yams. The middle textile layer is between the inner textile layer and the outer textile layer and has a plurality of wave-like polyester fiber yarns. Further, the outer textile layer includes a first weaving region and a second weaving region. The content of the composite yarns in the first weaving region is greater than the content of the composite yarns in the second weaving region.

Abstract: A thermal management method is applicable to a wireless communication apparatus. The wireless communication apparatus includes at least a wireless communication module, a heat source set, a thermally conductive assembly, a heat-dissipating fin assembly, and a cooling fan. The thermally conductive assembly is connected to the wireless communication module and the heat source set. The heat-dissipating fin assembly is connected to the thermally conductive assembly and arranged corresponding to the heat source set or the wireless communication module. The cooling fan normally operates at a first rotational speed for cooling to the heat-dissipating fin assembly. Upon the raising of a temperature value of the wireless communication apparatus, the method is to raise the first rotational speed to a second rotational speed, switch down the power consumption of the heat source set, and execute an event trigger, so as to maintain the temperature value within a proper temperature range.

Abstract: A stacked computer system includes a main machine module and expansion modules detachably stacked with each other. Each of the expansion modules is electrically connected to the main machine module. Each of the main machine module and the expansion modules includes a first connector located at an upper position and a second connector located at a lower position. In any two of the main machine module and the expansion modules adjacent to each other, the first connector of a lower one is connected to the second connector of the other one. Each of the first connector and the second connector includes at least two of a data transmission control interface, a power supply interface, a display signal transmission interface and a detection interface.

Abstract: The present invention provides a morphology determining method of corneal topography, including: a parameter obtaining step, based on an original contour line of a cornea of a target subject as the reference, obtaining a relative displacement of each observation point of a contour line of the pressed cornea changed with time from the beginning of pressing the cornea by an external pressure to a predetermined time after the pressing is finished; a conversion step, performing a mathematical function conversion of the above relative displacement with respect to a spatial contour at each observation time point, so as to respectively obtain one or more order vibrational modes representing the contour line of the time points; and a determining step, respectively comparing the one or more order vibrational modes of the cornea of the target subject with a corresponding order vibrational mode of at least one reference cornea, and determining a morphology of the corneal topography of the cornea of the target subject.

Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle, a clamping member, and a first sealing ring. The spin base has a through hole and a flange. The spindle extends through the through hole. The clamping member covers the through hole and is connected to the spindle. The clamping member includes a mounting part. The first sealing ring is disposed under the clamping member. A top surface of the first sealing ring and a top surface of the flange are in contact with a bottom surface of the mounting part.

Abstract: A laminated glass article includes a glass core layer having a core modulus Ecore and a glass cladding layer adjacent to the core layer and having a cladding modulus Eclad. Eclad can be at least 5 GPa less than Ecore. A modulus ratio Ecore/Eclad can be at least 1.08. The cladding layer can have a compressive stress resulting from a coefficient of thermal expansion (CTE) contrast between the core layer and the cladding layer and/or subjecting the laminated glass article to an ion exchange treatment to form an ion exchanged region at an outer surface of the cladding layer.

Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base having a through hole. The semiconductor wafer cleaning apparatus further includes a spindle extending through the through hole. The semiconductor wafer cleaning apparatus also includes a clamping member. The clamping member covers the through hole and connected to the spindle. A gap that communicates with the through hole is formed between the spin base and the clamping member. In addition, the semiconductor wafer cleaning apparatus includes a sealing ring. The sealing ring is positioned adjacent to the gap and located farther away from the spindle than the gap.

Abstract: A strengthened article (and methods for making it) is provided that includes a glass, glass-ceramic or ceramic, having a plurality of primary surfaces, side edges, and a thickness. The article also includes a compressive stress region extending from one of the primary surfaces to a first selected depth in the article; a central region extending from a boundary located at a depth of 200 ?m from the primary surfaces and the edges to the centroid of the article; and an outer region extending between the primary surfaces and edges to the boundary. Further, the maximum principal stress within the outer region is no more than two times the maximum principal stress within the central region. The primary surfaces and side edges may define a plurality of corners, and the corners may be defined by a chamfer, a fillet, or a curved shape.

Abstract: A substrate having inner and outer major surfaces, a plurality of edge surfaces, and a plurality of corner surfaces; and at least one of: (i) a coating applied over a limited area of the outer major surface of the substrate to produce a composite structure, (ii) an intermediate layer applied to the inner major surface of the substrate, and (iii) an elongate discontinuity disposed at one or more corners of the substrate, each of which operates to reduce catastrophic failures in the substrate resulting from a dynamic sharp impact to the outer major surface of the substrate.