Abstract: An apparatus and method for at least one of detecting and preventing burning of a PCB is disclosed. The method includes configuring a first comb array defined by a plurality of first fingers at a first potential; configuring a second comb array defined by a plurality of second fingers at a second potential different from the first potential; interlacing the plurality of first fingers defining the first comb array with the plurality of second fingers defining the second comb array embedded in a substrate; disposing the substrate with the PCB; and detecting a rise in leakage current between the first and second comb arrays indicative of a breakdown of the substrate.

Abstract: A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. The metal base and the solder are cooled and the metal base experiences tensile stresses and the solder experiences compressive stresses to form a concavity in a thermal face of the base. The thermal face is then planed. Over time, the tensile stresses and the compressive stresses reduce such that the thermal face becomes convex.

Abstract: A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

Abstract: A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.

Abstract: An apparatus and method for at least one of detecting and preventing burning of a PCB is disclosed. The method comprises configuring a first comb array defined by a plurality of first fingers at a first potential; configuring a second comb array defined by a plurality of second fingers at a second potential different from the first potential; interlacing the plurality of first fingers defining the first comb array with the plurality of second fingers defining the second comb array embedded in a substrate; disposing the substrate with the PCB; and detecting a rise in leakage current between the first and second comb arrays indicative of a breakdown of the substrate.

Abstract: A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate, an electronic device electrically connected to the substrate, and an elastomer barrier. The barrier includes a cutout configured to sealably affix to chip edges defining the electronic device. The cutout provides fluid communication to a back surface of the electronic device exposed through the cutout while the barrier seals the substrate from such fluid communication.

Abstract: A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil material and is disposed relative to the fin core so as to envelope the fin core and a heat sink base, wherein the heat sink base is disposed so as to be in thermal communication with the plurality of heat sink fins.

Abstract: A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. The metal base and the solder are cooled and the metal base experiences tensile stresses and the solder experiences compressive stresses to form a concavity in a thermal face of the base. The thermal face is then planed. Over time, the tensile stresses and the compressive stresses reduce such that the thermal face becomes convex.

Abstract: An electronic module, substrate assembly, and fabrication method, the assembly providing thermal conduction between an electronic device to be cooled and an aqueous coolant, while maintaining physical separation between the coolant and electronic device. The assembly includes a substrate, one or more electronic devices to be cooled, and a multilayer, impermeable barrier. The multilayer barrier includes a first layer, providing mechanical support for a second layer. The second, thinner layer provides an impermeable barrier, and a high effective thermal conductivity path between an electronic device and a cooling fluid in contact with an upper surface of the second barrier layer. Mechanical stresses are minimized by appropriate material selection for the first layer, and a thin second layer.

Abstract: One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint at the metal-based coating and the groove. Another exemplary embodiment of a heat sink comprises a plurality of fins alternatingly arranged with a plurality of spacers. A method of fabricating a heat sink comprises preparing a surface of a graphite-based substrate, removing particulate matter generated from the preparation of the surface of the substrate, applying a metal-based coating at the surface of the substrate, and arranging the substrate to form a heat sink structure.

Abstract: One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint at the metal-based coating and the groove. Another exemplary embodiment of a heat sink comprises a plurality of fins alternatingly arranged with a plurality of spacers. A method of fabricating a heat sink comprises preparing a surface of a graphite-based substrate, removing particulate matter generated from the preparation of the surface of the substrate, applying a metal-based coating at the surface of the substrate, and arranging the substrate to form a heat sink structure.

Abstract: A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil material and is disposed relative to the fin core so as to envelope the fin core and a heat sink base, wherein the heat sink base is disposed so as to be in thermal communication with the plurality of heat sink fins.

Abstract: One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint at the metal-based coating and the groove. Another exemplary embodiment of a heat sink comprises a plurality of fins alternatingly arranged with a plurality of spacers. A method of fabricating a heat sink comprises preparing a surface of a graphite-based substrate, removing particulate matter generated from the preparation of the surface of the substrate, applying a metal-based coating at the surface of the substrate, and arranging the substrate to form a heat sink structure.

Abstract: A method and apparatus for providing an electromagnetic conduction seal in a device disposed within an electrical enclosure includes a metal EMC gasket defined by a first end an and opposite second end. The first end is operably secured to the device and at least the second end is allowed to float while remaining in electrical contact with the device. A lock strip is fixed to the device and is configured to provide limits of deflection of an intermediate portion of the gasket intermediate the first and second ends and captivate at least one floating end of the gasket. The intermediate portion provides an electromagnetic conduction seal between the device and with at least one of another device and/or the electrical enclosure.

Abstract: One embodiment of a heat sink comprises a metal support member having a groove disposed at a surface thereof and a fin disposed at the groove. The fin comprises a graphite-based material having a metal-based coating disposed thereon, and the fin is retained at the groove via a soldered joint at the metal-based coating and the groove. Another exemplary embodiment of a heat sink comprises a plurality of fins alternatingly arranged with a plurality of spacers. A method of fabricating a heat sink comprises preparing a surface of a graphite-based substrate, removing particulate matter generated from the preparation of the surface of the substrate, applying a metal-based coating at the surface of the substrate, and arranging the substrate to form a heat sink structure.

Abstract: A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.

Abstract: An electronic module, substrate assembly, and fabrication method, the assembly providing thermal conduction between an electronic device to be cooled and an aqueous coolant, while maintaining physical separation between the coolant and electronic device. The assembly includes a substrate, one or more electronic devices to be cooled, and a multilayer, impermeable barrier. The multilayer barrier includes a first layer, providing mechanical support for a second layer. The second, thinner layer provides an impermeable barrier, and a high effective thermal conductivity path between an electronic device and a cooling fluid in contact with an upper surface of the second barrier layer. Mechanical stresses are minimized by appropriate material selection for the first layer, and a thin second layer.

Abstract: A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil material and is disposed relative to the fin core so as to envelope the fin core and a heat sink base, wherein the heat sink base is disposed so as to be in thermal communication with the plurality of heat sink fins.

Abstract: An exemplary embodiment is a system and method for a device reliability test circuit. The method includes applying a DC voltage across the device for a period, wherein the DC voltage is less than the rated voltage of said device, and determining a failure point of the device based on applying the DC voltage.