Abstract: A design and method for fabricating a foil heat sink including a fm body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.

Abstract: An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device.

Abstract: A power supply to be tested is placed in a vacuum chamber; the power supply is turned on and gas pressure in the chamber is reduced. As the gas pressure is reduced below 1 atmosphere, the breakdown voltage decreases; when the breakdown voltage decreases to the value of the applied voltage, arcing occurs as long as the applied voltage is greater than a minima. When a site arcs, the site is noted; the power supply is removed from the vacuum chamber; the arc site is conformally coated and the coated cured. Thereafter, the power supply is returned to the vacuum chamber and the test process repeated until the power supply no longer arcs. Thus the partial pressure test can identify the sites that have a possibility of arcing in the field and the design of the power supply modified by use of one or more conformal coatings or by otherwise changing the configuration of the power supply.

Abstract: An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device.

Abstract: A semiconductor device, full bridge converter employing the same, and methods of fabrication thereof are provided. The device includes a vertical MOSFET having a parasitic body diode at a junction face between a body region and a semiconductor layer thereof. The parasitic body diode is suppressed by having no direct electrical connection to the body region, resulting in the parasitic body diode being open-circuited within the MOSFET. Co-packaged with the MOSFET is a separate bypass diode connected across a source and a drain of the MOSFET. The bypass diode functions to clamp the voltage across the MOSFET without employing the parasitic, electrically isolated body diode of the MOSFET.

Abstract: An exemplary embodiment is a system and method for a device reliability test circuit. The method includes applying a DC voltage across the device for a period, wherein the DC voltage is less than the rated voltage of said device, and determining a failure point of the device based on applying the DC voltage.

Abstract: A the power supply to be tested is placed in a vacuum chamber; the power supply is turned on and gas pressure in the chamber is reduced. As the gas pressure is reduced below 1 atmosphere, the breakdown voltage decreases; when the breakdown voltage decreases to the value of the applied voltage, arcing occurs as long as the applied voltage is greater than a minima. When a site arcs, the site is noted; the power supply is removed from the vacuum chamber; the arc site is conformally coated and the coated cured. Thereafter, the power supply is returned to the vacuum chamber and the test process repeated until the power supply no longer arcs. Thus the partial pressure test can identify the sites that have a possibility of arcing in the field and the design of the power supply modified by use of one or more conformal coatings or by otherwise changing the configuration of the power supply.

Abstract: A semiconductor device, full bridge converter employing the same, and methods of fabrication thereof are provided. The device includes a vertical MOSFET having a parasitic body diode at a junction face between a body region and a semiconductor layer thereof. The parasitic body diode is suppressed by having no direct electrical connection to the body region, resulting in the parasitic body diode being open-circuited within the MOSFET. Co-packaged with the MOSFET is a separate bypass diode connected across a source and a drain of the MOSFET. The bypass diode functions to clamp the voltage across the MOSFET without employing the parasitic, electrically isolated body diode of the MOSFET.

Abstract: The power supply of equipment being tested for common mode noise problems is connected to a source of power with the power and neutral input terminals of the power supply isolated from the power ground. Recorded common mode noise signals are then inserted between the power supply's neutral input terminal and power ground to produce problem conditions. When the cause of the problem conditions are identified, steps are taken to eliminate the condition.

Abstract: A test probe head has a plurality of electrically conducting wire members held in place in a frame by movable plates. The wire members are threaded through apertures in the plates and the plates are moved relative to each other to bend the wires to thereby hold the wires in position in the frame. The wires are used to make physical contact with both a support substrate for the test probe head and an integrated circuit under test. The physical contact of the wires with both the substrate and the integrated circuit provides electrical connections between the pads in the support substrate and those on the integrated circuit to perform the testing of the integrated circuit. With this arrangement, there is no bonding of the wires to the pads of the support substrate. The elimination of the bonding to the pads of the support substrate eliminates a major cause of probe head failures.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing and attached to a printed circuit board through an interconnect including a heating element embedded therein.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module mounted on a printed circuit board is enclosed within an insulated housing, and the area of the printed circuit board adjacent the cooled IC module is encapsulated in an insulated jacket.

Abstract: A cooling assembly for an integrated circuit chip module wherein a spot cooling evaporator is mounted on the hat of the module in a position opposite the integrated chip within the module.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.

Abstract: A cooling system for absorbing thermal energy from an integrated circuit device while preventing the formation of condensation thereon. The cooling system comprises a evaporator unit mounted on an integrated circuit device, housed within an airtight enclosure which is evacuated and then pressurized with dry air.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a moisture barrier on its outer wall surface.

Abstract: A cooling assembly for an integrated circuit (IC) chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a low thermal conductivity barrier between its inner and outer walls of insulation.

Abstract: A connector pin that has one or more regions along its length modified in cross-section so the region deforms plastically as a result of stress induced by displacement of connected members. As used herein, plastic definition means that the structure approaches a condition where it will continue to yield without increase in load. Each region therefore provides a deformable or "plastic" hinge, limiting a moment applied to the solder joint as a result of lateral displacement of the connector relative to the circuit board.