Abstract: Apparatus including speakers ported through keys of a keyboard are disclosed. An example electronic device includes a housing, and a keyboard carried by the housing. The keyboard includes a key having a keycap that covers an associated switch. The example electronic device further includes a speaker within the housing underneath the keyboard. The keycap includes an opening to define a port through which sound from the speaker is able to pass.

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: Techniques for battery retention are disclosed. In the illustrative embodiment, a thin polyurethane strap is used to hold a battery in place. The strap only requires a small amount of volume, allowing for a higher volume (and higher capacity) for the battery. In order to accommodate swelling, a computing device that has a battery held in place with such a strap can have an open area above the battery. The strap may have ridges to contact the battery and the component above the battery beyond the open area. If the battery swells, the ridges may be pressed down, accommodating the swelling battery.

Abstract: Methods and apparatus to improve bass response of speakers in portable devices are disclosed. An example speaker includes a speaker box having a front face and a back face, a distance between the front face and the back face being less than 1 inch. The speaker box has a first portion of a back volume and a second portion of the back volume, the first portion of the back volume defined between the back face and a first region of the front face, the second portion of the back volume defined between the back face a second region of the front face. The example speaker further includes an active speaker driver including a first diaphragm, the first diaphragm coupled to the first region of the front face. The example speaker also includes a second diaphragm coupled to the second region of the front face, the second diaphragm being passive.

Abstract: Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

Abstract: Example slot antennas for electronic user device and related methods are disclosed herein. An example electronic user device includes a first housing; a second housing rotatably coupled to the first housing; a display screen carried by the second housing; a dual-band antenna carried by the second housing; and a bezel about the display screen, the bezel to cover the dual-band antenna.

Abstract: An apparatus and system for reducing air turbulence in a fan using a flow shaper. The fan including an impeller, a first outlet, and a second outlet. The flow shaper including a partition structure arranged at an inflection area between the first outlet and the second outlet. The flow shaper further including a first fin for the first outlet defining a first channel between the partition structure and the first fin. The first channel extending from a proximity of the impeller to the first outlet.

Abstract: Methods and apparatus for moisture degree detection are disclosed. An example apparatus for use with an input device includes trace routing positioned at or proximate a contact area of the input device, the trace routing including a first electrode, and a second electrode separated from the first electrode by a distance; and an amplifier electrically coupled to the first electrode and the second electrode, the amplifier to provide a signal based on a resistance related to a degree of moisture present between the first electrode and the second electrode.

Abstract: Disclosed herein are devices, systems, and methods for self-sanitizing a device using the built-in screen display of the device (e.g., a laptop). The device includes a processor configured to execute instructions to determine a relationship between a location of a display of the device and a location of a keyboard surface of the device. The processor is also configured to execute instructions configured to, based on the relationship, enable a sanitization mode on the device and to configure the display to emit light toward the keyboard surface to sanitize the keyboard surface when the sanitization mode is enabled.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for magnetic connectors with asymmetric attach/detach mechanism. An example electronic device disclose herein includes a port having an opening to receive a connector and a magnet array associated with the port. The magnet array includes a first magnet, and a second magnet. The electronic device includes a spring to bias at least one of the first magnet or second magnet away from the opening.

Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.

Abstract: Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top wall and the bottom wall of the heat pipe.

Abstract: Keyboards for electronic devices with keys having integrated speakers are disclosed herein. An example keyboard includes a key having a key cap and a speaker coupled to the key cap. The speaker is disposed in or at least partially covered by the key cap.

Abstract: Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.

Abstract: A heat pipe, including: a variable dimension heat pipe exoskeleton formed of a heat-conductive material by blow molding or additive manufacturing, wherein the variable dimension heat pipe exoskeleton including: a first heat pipe exoskeleton portion with a dimension having a first value; and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value. Further, a method of manufacturing a heat pipe, including: providing a heat-conductive material; and performing blow molding or additive manufacturing to form a variable dimension heat pipe exoskeleton of the heat-conductive material, wherein the heat pipe exoskeleton has a first heat pipe exoskeleton portion with a dimension having a first value, and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value.

Abstract: An electronic device or a component thereof is described, which may include communication and/or thermal interconnects. The device may include hingedly coupled portions, where the interconnects are axially arranged (e.g., coincident) with respect to a hinge axis of the foldable electronic device.

Abstract: Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.

Abstract: Techniques for a vapor chamber with less dead space are disclosed. In an illustrative embodiment, a vapor chamber is formed by folding a sheet and sealing the edges. The edges seal the vapor chamber but take up a relatively large amount of space without allowing for vapor to be transported in that space. The folded edge takes up less space, reducing the overall footprint of the vapor chamber. The vapor chamber with a smaller footprint can allow for, e.g., more space for motherboard area, more space for a battery, and/or a smaller form factor overall.