Patents by Inventor Prakash Kurma Raju

Prakash Kurma Raju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155790
    Abstract: Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.
    Type: Application
    Filed: December 19, 2023
    Publication date: May 9, 2024
    Inventors: Deepak Sekar, Samarth Alva, Prakash Kurma Raju, Prasanna Pichumani, Arnab Sen
  • Publication number: 20240098938
    Abstract: Techniques for a vapor chamber with less dead space are disclosed. In an illustrative embodiment, a vapor chamber is formed by folding a sheet and sealing the edges. The edges seal the vapor chamber but take up a relatively large amount of space without allowing for vapor to be transported in that space. The folded edge takes up less space, reducing the overall footprint of the vapor chamber. The vapor chamber with a smaller footprint can allow for, e.g., more space for motherboard area, more space for a battery, and/or a smaller form factor overall.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: Intel Corporation
    Inventors: Ravishankar Srikanth, Vijith Halestoph R, Prakash Kurma Raju, Arnab Sen, Isha Garg, Ezekiel Poulose, Avinash Manu Aravindan
  • Patent number: 11930620
    Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: March 12, 2024
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
  • Patent number: 11903161
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a fan where the fan blades are decoupled from the center shaft. The fan can include a center shaft, a motor coil support, motor coils coupled to the motor coil support, a rotator coupled to the center shaft, and fan blades coupled to the rotator, where rotation of the fan blades is decoupled from the center shaft by the rotator. A blade support can be coupled to the rotator, where the blade support couples the fan blades to the rotator and magnets can be coupled to the blade support. In an example, the rotator can include an inner, an outer race, and bearings.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: February 13, 2024
    Assignee: Intel Corporation
    Inventors: Srinivas Rao Konakalla, Prakash Kurma Raju, Bijendra Singh, Juha Tapani Paavola, Prasanna Pichumani
  • Patent number: 11804657
    Abstract: A chassis for an electronic device is provided. The chassis comprises a chassis part made of conducting material. At least one slot antenna is formed in the chassis part made of conducting material.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: October 31, 2023
    Assignee: Intel Corporation
    Inventors: Jayprakash Thakur, Maruti Tamrakar, Sagar Gupta, Harry G. Skinner, Prakash Kurma Raju
  • Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Patent number: 11755080
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: September 12, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Publication number: 20230187816
    Abstract: A communication device including a chassis; and a wireless communication interface having an antenna and a mounting structure, the mounting structure mounting the antenna to the chassis, wherein the mounting structure is configured to arrange the antenna in a first position and in at least a second position, wherein in the first position the antenna is arranged in a first distance to a surface of the chassis, and in the second position the antenna is arranged in a second distance to the surface of the chassis, wherein the second distance is larger than the first distance, wherein the antenna is operational in the same frequency range in each of the first position and the second position.
    Type: Application
    Filed: November 11, 2022
    Publication date: June 15, 2023
    Inventors: Jayprakash THAKUR, Prakash KURMA RAJU, Smit KAPILA, Mousumi DEKA
  • Publication number: 20230087586
    Abstract: Keyboards that are selectably configurable between a standard interface and a braille interface. In embodiments, the keyboard is equipped with six keys corresponding to six dots of a braille matrix, each of the keys equipped with a shape memory alloy spring or other mechanism to cause each of the keys to selectably extend above the keyboard plane. On activation, the six keys are extended and the remaining keys deactivated, to provide an easy to locate braille interface. On subsequent activation, the six keys are retracted and the keyboard is reverted to a standard interface. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: November 30, 2022
    Publication date: March 23, 2023
    Inventors: Smit KAPILA, Prakash KURMA RAJU, Naveen KUMAR, Santosh GANGAL
  • Patent number: 11573055
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: February 7, 2023
    Assignee: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur
  • Publication number: 20230028777
    Abstract: A kickstand for ergonomically positioning a computer device is equipped with an integrated antenna. In embodiments, the kickstand stores into a recess on a computer device, and can be deployed to help place the computer device into an ergonomic position. A switch or other sensor in the computer device may detect when the kickstand is deployed, and switch a radio within the computer device from an internal antenna to the antenna integrated into the kickstand. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: August 1, 2022
    Publication date: January 26, 2023
    Inventors: Gavin SUNG, Jayprakash THAKUR, Prakash Kurma RAJU, Madhukiran SRINIVASAREDDY, Smit KAPILA, Maruti TAMRAKAR, Khader Shareef ISMAIL SHERIF, Vijith HALESTOPH R, Sathiya Seelan SEKAR
  • Publication number: 20230026512
    Abstract: Techniques for overlay surfaces for compute devices are disclosed. In one embodiment, an overlay surface on a base portion of a compute device can be moved from a folded or closed position (in which it does not cover the keyboard) to an unfolded or open position (in which it covers part of the keyboard). The base portion includes a touch sensor that allows the overlay surface to be used as a touch surface. In another embodiment, an overlay surface of a compute device is movable from one position adjacent a display of the compute device to another position adjacent a base of the compute device. The overlay surface is electrically switchable from a transparent state to an opaque state, allowing the display to be seen through it in one position and allowing it to be used as an opaque drawing surface in another position.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 26, 2023
    Applicant: Intel Corporation
    Inventors: Mallari C. Hanchate, Amruta Ranade, Sandeep Masti, Prakash Kurma Raju, Samarth Alva
  • Publication number: 20230024409
    Abstract: A noise suppressing heat exchanger (also referred to as heat sink) includes a plurality of heat dissipating fins formed with baffles. The baffles suppress noise from a fan by slowing air flow and creating internal reflections within the heat exchanger that reflect noise away from the air flow path, absorbing sound energy and potentially setting up standing waves which dissipate noise via destructive interference. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 6, 2022
    Publication date: January 26, 2023
    Inventors: Smit KAPILA, Prakash Kurma RAJU, Abhishek SRIVASTAV, Prasanna PICHUMANI, Raghavendra Subramanya Setty KANIVIHALLI
  • Patent number: 11551891
    Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: January 10, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy
  • Publication number: 20220413547
    Abstract: A cover for a tablet or similar computer device equipped with strap hinges is disclosed. In embodiments, the cover may include three strap hinges to allow the tablet to be placed in several different configurations. The cover is equipped with at least two magnets in different polarities, which may be detected by the tablet. Based on the detection of at least one magnet and its polarity, the tablet may cause the interface of its operating system to be placed into a configuration appropriate to the configuration of the cover. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 8, 2022
    Publication date: December 29, 2022
    Inventors: Gavin Sung, Mallari C. Hanchate, Prasanna Pichumani, Prakash Kurma Raju, Tim Liu
  • Publication number: 20220404862
    Abstract: Apparatus, systems, and articles of manufacture for separable electronic devices are disclosed. A separable electronics device includes a first panel having a first zipper component, the first panel including a front housing, display cover glass, a display panel, display electronics, and a first panel-panel interface. The separable electronics device further includes a second panel having a second zipper component, the second panel including a back housing, and a second panel-panel interface, wherein the first panel and the second panel are physically coupled by a mechanical connection of the first zipper component and the second zipper component.
    Type: Application
    Filed: August 26, 2022
    Publication date: December 22, 2022
    Inventors: Prakash Kurma Raju, Navneet Singh, Amruta Ranade, Ajmeer Kaja, Jeff Ku
  • Patent number: 11474568
    Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: October 18, 2022
    Assignee: INTEL CORPORATION
    Inventors: Bijendra Singh, Prakash Kurma Raju, Prasanna Pichumani, Kathiravan D
  • Publication number: 20220255233
    Abstract: Example slot antennas for electronic user device and related methods are disclosed herein. An example electronic user device includes a first housing; a second housing rotatably coupled to the first housing; a display screen carried by the second housing; a dual-band antenna carried by the second housing; and a bezel about the display screen, the bezel to cover the dual-band antenna.
    Type: Application
    Filed: April 29, 2022
    Publication date: August 11, 2022
    Inventors: Jayprakash Thakur, Prakash Kurma Raju, Gustavo Fricke
  • Publication number: 20220200154
    Abstract: A chassis for an electronic device is provided. The chassis comprises a chassis part made of conducting material. At least one slot antenna is formed in the chassis part made of conducting material.
    Type: Application
    Filed: September 24, 2021
    Publication date: June 23, 2022
    Inventors: Jayprakash THAKUR, Maruti TAMRAKAR, Sagar GUPTA, Harry G. SKINNER, Prakash KURMA RAJU
  • Patent number: D980842
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: March 14, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Ajay Kumar Vaidhyanathan, Bala Subramanya, Gurpreet Singh Sandhu, Navneet Kumar Singh, Nehakausar Shaikh Ramjan Pinjari