Patents by Inventor Prakash Kurma Raju

Prakash Kurma Raju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220104399
    Abstract: In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.
    Type: Application
    Filed: December 2, 2021
    Publication date: March 31, 2022
    Applicant: Intel Corporation
    Inventors: Javed Shaikh, Prakash Kurma Raju, Kathiravan Dhandapani
  • Publication number: 20220026962
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a keyboard, and a chassis, where a portion of the chassis is between the substrate and the keyboard. A transmission line is embedded in the portion of the chassis between the substrate and the keyboard. In some examples, the portion of the chassis between the substrate and the keyboard that includes the transmission line is a support plate for the keyboard.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 27, 2022
    Applicant: Intel Corporation
    Inventors: Santhosh Ap, Madhurkiran Sreenivasa Reddy, Prakash Kurma Raju, Prasanna Pichumani, Vamshi Krishna Aagiru, Nithesha Ananda
  • Patent number: 11231757
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 25, 2022
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Publication number: 20220015273
    Abstract: An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.
    Type: Application
    Filed: September 23, 2021
    Publication date: January 13, 2022
    Inventors: Bala P. Subramanya, Prakash Kurma Raju, Navneet K. Singh, Sachin Bedare, Vijith Halestoph R.
  • Patent number: 11206748
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Raghavendra Doddi, Ravishankar Srikanth, Kathiravan D, Prakash Kurma Raju
  • Patent number: 11139553
    Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventors: Jayprakash Thakur, Prakash Kurma Raju, Prasanna Pichumani, Akarsha Kadadevaramath
  • Patent number: 11119532
    Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 14, 2021
    Assignee: Intel Corporation
    Inventors: Sumod Cherukkate, Gopinath K, Prakash Kurma Raju, Ajesh K K
  • Publication number: 20210232184
    Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
    Type: Application
    Filed: April 12, 2021
    Publication date: July 29, 2021
    Inventors: Bijendra Singh, Prakash Kurma Raju, Prasanna Pichumani, Kathiravan D
  • Publication number: 20210218102
    Abstract: Techniques for battery retention are disclosed. In the illustrative embodiment, a thin polyurethane strap is used to hold a battery in place. The strap only requires a small amount of volume, allowing for a higher volume (and higher capacity) for the battery. In order to accommodate swelling, a computing device that has a battery held in place with such a strap can have an open area above the battery. The strap may have ridges to contact the battery and the component above the battery beyond the open area. If the battery swells, the ridges may be pressed down, accommodating the swelling battery.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 15, 2021
    Inventors: Prasanna Pichumani, Jagadish Vasudeva Singh, Prakash Kurma Raju, Vinay Kumar Chandrasekhara, Arvind Sundaram, Naoki Matsumura
  • Publication number: 20210218845
    Abstract: Techniques for video conferencing are disclosed. In one embodiment, a mirror assembly can be used to position a mirror in front of a camera, reflecting a view of the camera downward towards a whiteboard or other drawing surface, allowing a user to show a drawing during a video conference. In another embodiment, video data and audio data of a user in a video conference can be analyzed to determine what portions of the video data and audio data should be transmitted to a remote participant in the video conference. Unintentional input supplied by the user in the video data and audio data may be used to determine which portions of the video data and audio data to transmit.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 15, 2021
    Inventors: Aleksander Magi, Soethiha Soe, Marko Bartscherer, Prakash Kurma Raju, Arvind Sundaram, Ayeshwarya B. Mahajan, Akarsha Rajeshwar Kadadevaramath, Gokul V. Subramaniam, Raghavendra Doddi, Prasanna Pichumani
  • Publication number: 20210112685
    Abstract: Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Inventors: Aleksander Magi, Jeff Ku, Juha Paavola, Prakash Kurma Raju
  • Publication number: 20210109576
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first portion chassis, a second portion chassis, and a hinge that rotatably couples the first portion chassis to the second portion chassis. The electronic device also includes a flexible heat spreader that extends from the second portion chassis, through the hinge, and to the first portion chassis, where the flexible heat spreader includes frills that can accommodate deformations in the flexible heat spreader when the first portion chassis is rotated relative to the second portion chassis.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Prasanna Pichumani, Raghavendra S. Kanivihalli
  • Publication number: 20210112684
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Applicant: Intel Corporation
    Inventors: Penchala Pratap Binni Boyina, Kathiravan D, Babu Triplicane Gopikrishnan, Prakash Kurma Raju, Deepak Sekar, Hari Shanker Thakur
  • Patent number: 10976782
    Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: April 13, 2021
    Assignee: Intel Corporation
    Inventors: Bijendra Singh, Prakash Kurma Raju, Prasanna Pichumani, Kathiravan D
  • Publication number: 20210103317
    Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
    Type: Application
    Filed: November 21, 2020
    Publication date: April 8, 2021
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Samarth Alva, Bhavaneeswaran Anbalagan, Triplicane Gopikrishnan Babu, Prasanna Pichumani, Raghavendra Doddi, Sudheera Sudhakar, Ritu Bawa
  • Publication number: 20210034115
    Abstract: Computing devices comprise a releasably attachable display assembly to secure a display to a device housing. The display assembly comprises a cover glass to which a display is attached. A retention frame attached to the perimeter of the cover glass comprises a plurality of hooks along one edge and a plurality of snaps along the remaining edges. The hooks and snaps engage with internal retention features along the interior of the housing to secure the display assembly to the housing. A liquid adhesive secures the cover glass to the retention frame. The display assembly further comprises an energy absorber to form a seal between the frame and the housing. The display assembly allows for computing devices with displays that are easily removable for improved serviceability and narrower bezels for improved industrial design.
    Type: Application
    Filed: October 16, 2020
    Publication date: February 4, 2021
    Applicant: Intel Corporation
    Inventors: Prasanna Pichumani, Prakash Kurma Raju, Mikko A. Makinen, Vinay Kumar Chandrasekhara, Juha Tapani Paavola, Seppo O. Vesamaki, Timo Herranen
  • Publication number: 20210022266
    Abstract: In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 21, 2021
    Applicant: Intel Corporation
    Inventors: Javed Shaikh, Prakash Kurma Raju, Kathiravan Dhandapani
  • Publication number: 20200396864
    Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.
    Type: Application
    Filed: June 27, 2020
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
  • Patent number: D912662
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: March 9, 2021
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Prasanna Pichumani, Gokul V. Subramaniam
  • Patent number: D933059
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventors: Babu Triplicane Gopikrishnan, Kathiravan D, Prakash Kurma Raju, Prasanna Pichumani