Patents by Inventor Prashanth Kothnur
Prashanth Kothnur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12131105Abstract: A method includes measuring a subset of property values within a manufacturing chamber during a process performed on a substrate within the manufacturing chamber. The method further includes determining property values in the manufacturing chamber at locations removed from the locations the measurements are taken. The method further includes performing a corrective action based on the determined properties.Type: GrantFiled: September 15, 2021Date of Patent: October 29, 2024Assignee: Applied Materials, Inc.Inventors: Preetham Prahallada Rao, Prashanth Kothnur
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Publication number: 20240310819Abstract: A first selection of a first fabrication process and/or first manufacturing equipment to perform manufacturing operations of the first fabrication process is received. The first selection is input into a digital replica of the first manufacturing equipment, where the digital replica outputs physical conditions of the first fabrication process. Environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process is determined. A modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment is determined. Applying the modification to the first fabrication and/or providing the modification for display by a graphical user interface (GUI) is performed.Type: ApplicationFiled: May 30, 2024Publication date: September 19, 2024Inventors: Ala Moradian, Elizabeth Neville, Umesh Madhav Kelkar, Mark R. Denome, Prashanth Kothnur, Karthik Ramanathan, Kartik Shah, Orlando Trejo, Sergey Meirovich
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Patent number: 12043895Abstract: Methods of introducing precursors through a segmented showerhead are provided herein. In some embodiments, a method of introducing precursors through a segmented showerhead having a plurality of gas delivery portions that are fluidly isolated includes heating a first gas delivery portion to a first temperature; and simultaneously heating a second gas delivery portion to a second temperature different than the first temperature, wherein each of the first and second gas delivery portions (i) have a wedge shaped body that defines a plenum, (ii) are coplanar, and (iii) together form a showerhead having a circular shape.Type: GrantFiled: December 1, 2022Date of Patent: July 23, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Alexander Lerner, Prashanth Kothnur, Roey Shaviv, Satish Radhakrishnan
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Patent number: 12001197Abstract: A method including receiving, by a processing device, a first selection of at least one of a first fabrication process or first manufacturing equipment to perform manufacturing operations of the first fabrication process. The method can further include inputting the first selection into a digital replica of the first manufacturing equipment wherein the digital replica outputs physical conditions of the first fabrication process. The method may further include determining environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process. The processing device may further determine a modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment.Type: GrantFiled: April 14, 2021Date of Patent: June 4, 2024Assignee: Applied Materials, Inc.Inventors: Ala Moradian, Elizabeth Neville, Umesh Madhav Kelkar, Mark R. Denome, Prashanth Kothnur, Karthik Ramanathan, Kartik Shah, Orlando Trejo, Sergey Meirovich
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Patent number: 11970775Abstract: Embodiments of a showerhead are described herein. In some embodiments, a showerhead assembly includes: a first gas delivery portion having a first body, a first inlet, and a plurality of first tubes extending from the first body and defining a first plenum, wherein each tube of the plurality of first tubes includes a plurality of first holes; and a second gas delivery portion having a second body, a second inlet, and a plurality of second tubes extending from the second body and defining a second plenum fluidly independent from the first plenum, wherein each tube of the plurality of second tubes includes a plurality of second holes, and wherein the plurality of first tubes are disposed in an alternating pattern with the plurality of second tubes across a width of the showerhead assembly and a heat sink disposed between the plurality of first tubes and the plurality of second tubes.Type: GrantFiled: August 6, 2019Date of Patent: April 30, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Prashanth Kothnur, Satish Radhakrishnan, Alexander Lerner, Sergei Klimovich, Roey Shaviv
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Patent number: 11834743Abstract: Apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.Type: GrantFiled: September 13, 2019Date of Patent: December 5, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Alexander Lerner, Prashanth Kothnur, Roey Shaviv, Satish Radhakrishnan
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Patent number: 11692262Abstract: Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.Type: GrantFiled: July 16, 2020Date of Patent: July 4, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Alexander Jansen, Keith A. Miller, Prashanth Kothnur, Martin Riker, David Gunther, Emily Schooley
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Patent number: 11655534Abstract: Apparatus that forms low resistivity tungsten film on substrates. In some embodiments, the apparatus may provide reduced resistivity of tungsten by being configured to generate a plasma in a processing volume of a physical vapor deposition (PVD) chamber with a process gas of krypton and using an RF power with a frequency of approximately 60 MHz, apply bias power at frequency of approximately 13.56 MHz to a substrate, and sputter a tungsten target to deposit a tungsten thin film on the substrate. At least approximately 90% of the deposited tungsten thin film has a <110> crystalline orientation plane approximately parallel to a top surface of the substrate.Type: GrantFiled: July 5, 2022Date of Patent: May 23, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Wenting Hou, Jianxin Lei, Jothilingam Ramalingam, Prashanth Kothnur, William R. Johanson
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Publication number: 20230092987Abstract: Embodiments of apparatus for supplying vaporized reactants to a reaction chamber are described herein. In some embodiments, a showerhead assembly for depositing multiple materials on a substrate includes a plurality of gas delivery portions, each gas delivery portion having an inlet, a wedge shaped body that defines a plenum, and a plurality of openings disposed on a bottom surface of the gas delivery portion, wherein each of the plenums are fluidly isolated from each other.Type: ApplicationFiled: December 1, 2022Publication date: March 23, 2023Inventors: ALEXANDER LERNER, PRASHANTH KOTHNUR, ROEY SHAVIV, SATISH RADHAKRISHNAN
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Publication number: 20230078146Abstract: A method includes measuring a subset of property values within a manufacturing chamber during a process performed on a substrate within the manufacturing chamber. The method further includes determining property values in the manufacturing chamber at locations removed from the locations the measurements are taken. The method further includes performing a corrective action based on the determined properties.Type: ApplicationFiled: September 15, 2021Publication date: March 16, 2023Inventors: Preetham Prahallada Rao, Prashanth Kothnur
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Patent number: 11600476Abstract: A deposition system, and a method of operation thereof, includes: a cathode; a shroud below the cathode; a rotating shield below the cathode for exposing the cathode through the shroud and through a shield hole of the rotating shield; and a rotating pedestal for producing a material to form a carrier over the rotating pedestal, wherein the material having a non-uniformity constraint of less than 1% of a thickness of the material and the cathode having an angle between the cathode and the carrier.Type: GrantFiled: October 18, 2021Date of Patent: March 7, 2023Assignee: Applied Materials, Inc.Inventors: Anantha K. Subramani, Deepak Jadhav, Ashish Goel, Hanbing Wu, Prashanth Kothnur, Chi Hong Ching
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Publication number: 20230042777Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.Type: ApplicationFiled: October 24, 2022Publication date: February 9, 2023Inventors: Alexander N. LERNER, Roey SHAVIV, Prashanth KOTHNUR, Satish RADHAKRISHNAN, Xiaozhou CHE
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Publication number: 20220380888Abstract: Methods of processing a substrate in a PVD chamber are provided herein. In some embodiments, a method of processing a substrate in a PVD chamber, includes: sputtering material from a target disposed in the PVD chamber and onto a substrate, wherein at least some of the material sputtered from the target is guided to the substrate through a magnetic field provided by one or more upper magnets disposed about a processing volume of the PVD chamber above a support pedestal for the substrate in the PVD chamber, one or more first magnets disposed about the support pedestal and providing an increased magnetic field strength at an edge region of the substrate, and one or more second magnets disposed below the support pedestal that increase a magnetic field strength at a central region of the substrate.Type: ApplicationFiled: May 28, 2021Publication date: December 1, 2022Inventors: Goichi YOSHIDOME, Suhas BANGALORE UMESH, Sushil Arun SAMANT, Martin Lee RIKER, Wei LEI, Kishor Kumar KALATHIPARAMBIL, Shirish A. PETHE, Fuhong ZHANG, Prashanth KOTHNUR, Andrew TOMKO
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Patent number: 11505863Abstract: Methods and systems for forming films on substrates in semiconductor processes are disclosed. The method includes providing different materials each contained in separate ampoules. Material is flowed from each ampoule into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.Type: GrantFiled: April 21, 2020Date of Patent: November 22, 2022Assignee: Applied Materials, Inc.Inventors: Alexander N. Lerner, Roey Shaviv, Prashanth Kothnur, Satish Radhakrishnan, Xiaozhou Che
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Patent number: 11495440Abstract: Embodiments of the present disclosure generally relate to apparatuses for reducing particle contamination on substrates in a plasma processing chamber. In one or more embodiments, an edge ring is provided and includes a top surface, a bottom surface opposite the top surface and extending radially outward, an outer vertical wall extending between and connected to the top surface and the bottom surface, an inner vertical wall opposite the outer vertical wall, an inner lip extending radially inward from the inner vertical wall, and an inner step disposed between and connected to the inner wall and the bottom surface. During processing, the edge ring shifts the high plasma density zone away from the edge area of the substrate to avoid depositing particles on the substrate when the plasma is de-energized.Type: GrantFiled: August 18, 2020Date of Patent: November 8, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Bhaskar Kumar, Prashanth Kothnur, Sidharth Bhatia, Anup Kumar Singh, Vivek Bharat Shah, Ganesh Balasubramanian, Changgong Wang
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Publication number: 20220351988Abstract: Methods and apparatus for controlling a flow of process material to a deposition chamber.Type: ApplicationFiled: July 18, 2022Publication date: November 3, 2022Inventors: ALEXANDER LERNER, ROEY SHAVIV, PHILLIP STOUT, JOSEPH M. RANISH, PRASHANTH KOTHNUR, SATISH RADHAKRISHNAN
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Publication number: 20220341025Abstract: Apparatus that forms low resistivity tungsten film on substrates. In some embodiments, the apparatus may provide reduced resistivity of tungsten by being configured to generate a plasma in a processing volume of a physical vapor deposition (PVD) chamber with a process gas of krypton and using an RF power with a frequency of approximately 60 MHz, apply bias power at frequency of approximately 13.56 MHz to a substrate, and sputter a tungsten target to deposit a tungsten thin film on the substrate. At least approximately 90% of the deposited tungsten thin film has a <110> crystalline orientation plane approximately parallel to a top surface of the substrate.Type: ApplicationFiled: July 5, 2022Publication date: October 27, 2022Inventors: Wenting HOU, Jianxin LEI, Jothilingam RAMALINGAM, Prashanth KOTHNUR, William R. JOHANSON
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Publication number: 20220341029Abstract: Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.Type: ApplicationFiled: July 11, 2022Publication date: October 27, 2022Applicant: Applied Materials, Inc.Inventors: Alexander Jansen, Keith A. Miller, Prashanth Kothnur, Martin Riker, David Gunther, Emily Schooley
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Publication number: 20220334569Abstract: A method including receiving, by a processing device, a first selection of at least one of a first fabrication process or first manufacturing equipment to perform manufacturing operations of the first fabrication process. The method can further include inputting the first selection into a digital replica of the first manufacturing equipment wherein the digital replica outputs physical conditions of the first fabrication process. The method may further include determining environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process. The processing device may further determine a modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment.Type: ApplicationFiled: April 14, 2021Publication date: October 20, 2022Inventors: Ala Moradian, Elizabeth Neville, Umesh Madhav Kelkar, Mark R. Denome, Prashanth Kothnur, Karthik Ramanathan, Kartik Shah, Orlando Trejo, Sergey Meirovich
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Patent number: D969980Type: GrantFiled: October 20, 2020Date of Patent: November 15, 2022Assignee: Applied Materials, Inc.Inventors: Alexander N. Lerner, Graeme Jamieson Scott, Prashanth Kothnur