Abstract: Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Abstract: Techniques are disclosed for managing a switch fabric. In one embodiment, a server system is provided that includes a midplane, one or more server cards, switch modules and a management controller. The midplane may include a fabric interconnect for a switch fabric. The one or more server cards and the switch modules may be operatively connected to the midplane. The switch modules may be configured to switch network traffic for the one or more server cards. The management controller may be configured to manage the switch modules via the fabric interconnect.

Abstract: Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Abstract: A system comprises a server chassis and first and second hard disk drive carriers, wherein each carrier supports a hard disk drive. A first hinge rotatably connects a distal end of the first hard disk drive carrier to a first side of the chassis, wherein the first hinge allows the carrier to rotate about a first hinge axis between an open position and a closed position. The first hard disk drive carrier rotates in a first plane between an open position extending beyond the front of the chassis and a closed position within the chassis. A second hinge rotatably connects a distal end of the second hard disk drive carrier to a second side of the chassis that opposite the first side of the chassis, wherein the hinge allows the carrier to rotate about a second hinge axis between an open position and a closed position.

Abstract: Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Abstract: Methods, apparatuses, and computer products are provided for determining connectivity of a high speed link that includes an ac-coupling capacitor. Embodiments include transmitting, by a connectivity tester, a test signal on a lane within the high speed link; detecting on the lane, by the connectivity tester, a standing wave generated in response to the transmission of the test signal; determining, by the connectivity tester, whether the standing wave is resonating; if the standing wave is resonating, indicating, by the connectivity tester, that the lane of the high speed link has a closed connection; and if the standing wave is not resonating, indicating, by the connectivity tester, that the lane of the high speed link has an open connection.

Abstract: Controlling electromagnetic (‘EM’) radiation in a data center having a number EM sections, including: receiving, by an EM controller, a specification of preferred EM radiation characteristics for the data center; and setting, by the EM controller, a state of each EM section in accordance with the specification, where the state of each EM section may be one of: an absorption state in which the EM section absorbs EM radiation or a reflection state in which the EM section reflects EM radiation.

Abstract: A midplane that includes a direct connect adapter mounted within the midplane, the direct connect adapter including: a first opening for receiving a first computing component connector on a first side of the midplane; and a second opening for receiving a second computing component connector on a second side of the midplane, and the direct connect adapter mounted within the midplane electrically coupling the first computing component connector and the second computing component connector without electrically coupling the first computing component connector and the second computing component connector to the midplane.

Abstract: Controlling electromagnetic (‘EM’) radiation in a data center having a number EM sections, including: receiving, by an EM controller, a specification of preferred EM radiation characteristics for the data center; and setting, by the EM controller, a state of each EM section in accordance with the specification, where the state of each EM section may be one of: an absorption state in which the EM section absorbs EM radiation or a reflection state in which the EM section reflects EM radiation.

Abstract: An apparatus having reduced noise coupling includes a core layer having an upper and lower surface, the upper and lower surface each including a copper sheet layer, a pre-preg layer having an upper surface and a lower surface, the upper surface of the pre-preg layer coupled to the lower surface of the core layer, a core insulating layer having an upper surface and a lower surface, the upper surface of the core insulating layer coupled to the lower surface of the pre-preg layer, a return current reference layer disposed on the lower surface of the core insulator layer and high-speed signal traces disposed on the upper surface of the core insulating layer, each of the high speed signal traces disposed on a pedestal defined by a section of the pre-preg layer and the core insulating layer, each pedestal being separated by an air gap disposed between adjacent pedestals.

Abstract: Methods, apparatus, and product are disclosed for expanding functionality of hard drive bays in a computing system that include: providing, by a connector in a hard drive bay, access to two or more data communication busses of different type; receiving, by the connector of the hard drive bay, a device mounted within the hard drive bay; and communicately coupling, by the connector of the hard drive bay, the device to one of the data communication busses.

Abstract: Methods, apparatus, and product are disclosed for expanding functionality of hard drive bays in a computing system that include: detecting, by a fabric management module, that a new device has been added to a hard drive bay in the computing system; identifying, by the fabric management module, a data communications protocol that is used by the new device; selecting, by the fabric management module, a fabric that supports the data communications protocol that is used by the new device; and routing, by the fabric management module, data communications according to the data communications protocol that is used by the new device across the selected fabric.

Abstract: A system comprises a server chassis and first and second hard disk drive carriers, wherein each carrier supports a hard disk drive. A first hinge rotatably connects a distal end of the first hard disk drive carrier to a first side of the chassis, wherein the first hinge allows the carrier to rotate about a first hinge axis between an open position and a closed position. The first hard disk drive carrier rotates in a first plane between an open position extending beyond the front of the chassis and a closed position within the chassis. A second hinge rotatably connects a distal end of the second hard disk drive carrier to a second side of the chassis that opposite the first side of the chassis, wherein the hinge allows the carrier to rotate about a second hinge axis between an open position and a closed position.

Abstract: An apparatus, system, and method are disclosed for dynamic phase equalization in a communication channel. A transmitter history module stores a plurality of bits from a data stream that is transmitted through the communication channel. A transmitter detection module detects a pre-transition bit of a first value that is preceded in the data stream by at least one bit of the first value and followed by a transition bit with a second value. A driver module transmits the data stream by driving the communication channel. A transition module pre-drives the communication channel to the second voltage of the transition bit during a bit time interval of the pre-transition bit.

Abstract: Computer memory subsystems are disclosed for enhancing signal quality that include: one or more memory modules; a memory bus; and a memory controller connected to the memory modules through the memory bus, the memory controller including a reception buffer connected to the memory bus, the reception buffer capable of receiving an input signal from one of the memory modules, the memory controller including a reception characteristics table capable of storing reception characteristics for each of the memory modules connected to the memory controller, the memory controller including an equalizer connected to the reception buffer and the reception characteristics table, the equalizer capable of equalizing the received input signal in dependence upon the reception characteristics for the memory module from which the input signal was received, and the memory controller including memory controller logic connected to the equalizer, the memory controller logic capable of processing the equalized input signal.

Abstract: Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the plurality of high speed signal traces and forming pedestals having remaining insulating material, the plurality of high speed signal traces disposed on and coupled to the remaining insulating material, coupling pre-preg material on the high speed signal traces, removing the pre-preg material adjacent the trenches, thereby retaining the pre-preg material aligned with the high speed signal traces, and heating and pressing a core layer to the pre-preg layer, and heating and pressing the pre-preg layer to the core insulating layer.

Abstract: Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the plurality of high speed signal traces and forming pedestals having remaining insulating material, the plurality of high speed signal traces disposed on and coupled to the remaining insulating material, coupling pre-preg material on the high speed signal traces, removing the pre-preg material adjacent the trenches, thereby retaining the pre-preg material aligned with the high speed signal traces, and heating and pressing a core layer to the pre-preg layer, and heating and pressing the pre-preg layer to the core insulating layer.

Abstract: Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the plurality of high speed signal traces and forming pedestals having remaining insulating material, the plurality of high speed signal traces disposed on and coupled to the remaining insulating material, coupling pre-preg material on the high speed signal traces, removing the pre-preg material adjacent the trenches, thereby retaining the pre-preg material aligned with the high speed signal traces, and heating and pressing a core layer to the pre-preg layer, and heating and pressing the pre-preg layer to the core insulating layer.

Abstract: A method of transmitting a signal on a bi-directional universal serial bus (“USB”) circuit for boosting a signal on a USB bus disclosed. The circuit includes a first stage inverting buffer coupled to a second stage inverting buffer to form a non-inverting buffer circuit. A high pass filter is coupled in series with the non-inverting buffer circuit to provide AC coupling to the USB bus and to allow fast signal edges through the circuit. The booster circuit is arranged to improve signal quality over a USB bus to allow additional USB devices and longer USB busses to be utilized.

Abstract: The invention is directed to an on-chip probing apparatus. In accordance with an embodiment of the present invention, the on-chip probing apparatus includes: a plurality of switches on a chip; a plurality of externally accessible probe points on the chip; and a multiplexer for controlling the plurality of switches to selectively couple an output signal of the chip to one of the plurality of probe points.