Abstract: Material mixing for an additive manufacturing apparatus is provided. A further aspect employs multiple material inlets for simultaneously feeding a polymer and/or nanocomposite material in at least a first inlet, and ceramic or other particles in at least a second inlet, to a single additive manufacturing outlet nozzle. In another aspect, a three dimensional printing machine varies a chemical or compounding characteristic, such as a loading percentage, of printing material during printing. In another aspect, in situ mixing of a polymer and/or nanocomposite with variable amounts of ceramic, magnetic or other particles therein in an additive manufacturing apparatus, such as a multi-material aerosol jet printing machine.

Abstract: A multiband sensing system includes an active multiband sensing unit configured to transmit a radio frequency (RF) signal in multiple bands and communicate with a network. The active multiband sensing unit includes at least one transmitting antenna configured to transmit the RF signal. The multiband sensing system includes a passive multiband sensing unit including at least one receiving antenna configured to receive the RF signal, an acoustic actuator powered by the received RF signal including an actuating sensor element configured to actuate in response to receiving extracted modulated information of the RF signal, and an acoustic detector. The acoustic detector includes a detector transmitting antenna configured to backscatter a new frequency band signal to the active multiband sensing unit and a detector sensor element configured to sense data. The sensed data is modulated over the received RF signal to produce the new frequency band signal.

Abstract: Material mixing for an additive manufacturing apparatus is provided. A further aspect employs multiple material inlets for simultaneously feeding a polymer and/or nanocomposite material in at least a first inlet, and ceramic or other particles in at least a second inlet, to a single additive manufacturing outlet nozzle. In another aspect, a three dimensional printing machine varies a chemical or compounding characteristic, such as a loading percentage, of printing material during printing. In another aspect, in situ mixing of a polymer and/or nanocomposite with variable amounts of ceramic, magnetic or other particles therein in an additive manufacturing apparatus, such as a multi-material aerosol jet printing machine.

Abstract: A heterojunction device is provided. The heterojunction device includes a silicon (Si) substrate; and a film of silicon carbide (SiC) deposited on a surface of the Si substrate. The SiC has a Si:C ratio that increases or decreases from a SiC surface in contact with the Si substrate to an opposing SiC surface that is not in contact with the Si substrate.

Abstract: A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.

Abstract: The disclosure relates to wireless detection of analytes (such as bacteria) labeled by electrically, dielectrically, or magnetically active nanoparticles, for example in quality control monitoring for food supply chain management. The disclosed apparatus includes a detection vessel or vial, a resonant sensor tag, an inductively coupled reader to induce and detect resonance in the sensor tag, and an active nanoparticle for labeling. The disclosed wireless detection apparatus and methods use active nanoparticles for the development of wireless sensor systems which can be designed to be compatible with the existing RFID technology infrastructure. For example, commercial RFID readers (e.g., hand-held) used for tracking and tracing operation can be used with the disclosed apparatus to induce and measure a corresponding resonance frequency.

Abstract: A harmonic tag system includes a harmonic tag and a first antenna configured to receive a fundamental signal and transmit an identifier of the harmonic tag at a fundamental frequency. The harmonic tag system includes an energy harvesting unit configured to convert the fundamental signal into power. The power activates a sensor. The harmonic tag system also includes a harmonic doubler configured to generate a harmonic signal at a harmonic frequency based on (i) the fundamental signal and (ii) a sequence. The harmonic tag system further includes a digital modulation unit configured to selectively trigger an activation of the harmonic doubler. The harmonic doubler is triggered sequentially in an off state and an on state, and the digital modulation unit produces the sequence. The harmonic tag system also includes a second antenna configured to transmit data of the sensor at the harmonic frequency.

Abstract: The disclosure relates to wireless detection of analytes (such as bacteria) labeled by electrically, dielectrically, or magnetically active nanoparticles, for example in quality control monitoring for food supply chain management. The disclosed apparatus includes a detection vessel or vial, a resonant sensor tag, an inductively coupled reader to induce and detect resonance in the sensor tag, and an active nanoparticle for labeling. The disclosed wireless detection apparatus and methods use active nanoparticles for the development of wireless sensor systems which can be designed to be compatible with the existing RFID technology infrastructure. For example, commercial RFID readers (e.g., hand-held) used for tracking and tracing operation can be used with the disclosed apparatus to induce and measure a corresponding resonance frequency.

Abstract: A multiband sensing system includes an active multiband sensing unit configured to transmit a radio frequency (RF) signal in multiple bands and communicate with a network. The active multiband sensing unit includes at least one transmitting antenna configured to transmit the RF signal. The multiband sensing system includes a passive multiband sensing unit including at least one receiving antenna configured to receive the RF signal, an acoustic actuator powered by the received RF signal including an actuating sensor element configured to actuate in response to receiving extracted modulated information of the RF signal, and an acoustic detector. The acoustic detector includes a detector transmitting antenna configured to backscatter a new frequency band signal to the active multiband sensing unit and a detector sensor element configured to sense data. The sensed data is modulated over the received RF signal to produce the new frequency band signal.

Abstract: A heterojunction device is provided. The heterojunction device includes a silicon (Si) substrate; and a film of silicon carbide (SiC) deposited on a surface of the Si substrate. The SiC has a Si:C ratio that increases or decreases from a SiC surface in contact with the Si substrate to an opposing SiC surface that is not in contact with the Si substrate.

Abstract: A method for forming a compound on a substrate is provided. The method includes depositing a composition onto a surface of a substrate; illuminating the composition and the substrate with pulsed energy; melting the substrate and decomposing the composition simultaneously; and forming a compound on the substrate. A first component of the compound is derived from the substrate and a second component of the compound is derived from the composition.

Abstract: A method for forming a compound on a substrate is provided. The method includes depositing a composition onto a surface of a substrate; illuminating the composition and the substrate with pulsed energy; melting the substrate and decomposing the composition simultaneously; and forming a compound on the substrate. A first component of the compound is derived from the substrate and a second component of the compound is derived from the composition.

Abstract: A method for forming an integrated circuit includes transforming at least a portion of a first substrate layer to form a conductive region within the first substrate layer. An integrated circuit device is provided proximate an outer surface of the first substrate layer. The integrated circuit device transmits or receives electrical signals through the conductive region. A second substrate layer is disposed proximate to the outer surface of the first substrate layer to enclose the integrated circuit device in a hermetic environment.

Abstract: A method for forming an integrated circuit includes transforming at least a portion of a first substrate layer to form a conductive region within the first substrate layer. An integrated circuit device is provided proximate an outer surface of the first substrate layer. The integrated circuit device transmits or receives electrical signals through the conductive region. A second substrate layer is disposed proximate to the outer surface of the first substrate layer to enclose the integrated circuit device in a hermetic environment.

Abstract: A method for forming an integrated circuit includes transforming at least a portion of a first substrate layer to form a conductive region within the first substrate layer. An integrated circuit device is provided proximate an outer surface of the first substrate layer. The integrated circuit device transmits or receives electrical signals through the conductive region. A second substrate layer is disposed proximate to the outer surface of the first substrate layer to enclose the integrated circuit device in a hermetic environment.

Abstract: In one embodiment of the disclosure, a method includes providing a carrier substrate, forming a first region over an upper surface of the substrate, creating an electrical component using a planar process, embedding the electrical component in the dielectric layer, and removing a substrate portion of the electrical component. The first region includes a dielectric layer and may be made of any material that electrically isolates the electrical component from the carrier substrate. The electrical component may be created using a planar process thereby having an epitaxial surface that is embedded in the dielectric layer.

Abstract: A method for forming an integrated circuit includes transforming at least a portion of a first substrate layer to form a conductive region within the first substrate layer. An integrated circuit device is provided proximate an outer surface of the first substrate layer. The integrated circuit device transmits or receives electrical signals through the conductive region. A second substrate layer is disposed proximate to the outer surface of the first substrate layer to enclose the integrated circuit device in a hermetic environment.

Abstract: In one embodiment of the disclosure, a method includes providing a carrier substrate, forming a first region over an upper surface of the substrate, creating an electrical component using a planar process, embedding the electrical component in the dielectric layer, and removing a substrate portion of the electrical component. The first region includes a dielectric layer and may be made of any material that electrically isolates the electrical component from the carrier substrate. The electrical component may be created using a planar process thereby having an epitaxial surface that is embedded in the dielectric layer.

Abstract: A polarizing filter includes a portion with a filtering layer having a plurality of openings extending therethrough, where this portion has a maximum physical thickness in a radiation travel direction which is less than approximately one wavelength of the radiation being filtered. A method of making the filter includes: forming a filtering layer over a substrate; creating a plurality of openings through a portion of the filtering layer; and separating the filtering layer from the substrate.

Abstract: An method for building multi-layer circuits without post process via fills is disclosed. The method includes aligning a first contact on a first substrate layer with a second contact on a second substrate layer; and fusion bonding the first contact to the second contact. A multilayer circuit is also disclosed. The multilayer circuit includes a first substrate layer including a first contact. The multilayer circuit also includes a second substrate layer including a second contact that is fusion bonded to the first contact such that the first and second contacts are aligned.