Patents by Inventor Puke Zhou

Puke Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990661
    Abstract: The present disclosure relates to transverse magnetic wave (TM) mode filters and methods for manufacturing a TM mode filter. One example TM mode filter includes a filter body, a dielectric, and a transition layer, the filter body including a filter cavity and a cover, and having hollow confined space, the dielectric located in the hollow confined space, and the transition layer configured to connect the dielectric and the filter body. A coefficient of thermal expansion (CTE) of the transition layer is between a CTE of the filter body and a CTE of the dielectric.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: May 21, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Bengui Yuan, Puke Zhou, Jinyan Li
  • Publication number: 20210328316
    Abstract: The present disclosure relates to transverse magnetic wave (TM) mode filters and methods for manufacturing a TM mode filter. One example TM mode filter includes a filter body, a dielectric, and a transition layer, the filter body including a filter cavity and a cover, and having hollow confined space, the dielectric located in the hollow confined space, and the transition layer configured to connect the dielectric and the filter body. A coefficient of thermal expansion (CTE) of the transition layer is between a CTE of the filter body and a CTE of the dielectric.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Inventors: Bengui YUAN, Puke ZHOU, Jinyan LI
  • Patent number: 8947174
    Abstract: The present disclosure relates to telecommunication, and in particular, to a base station Radio Frequency (RF) duplexer, an RF module, and an RF system. A base station RF apparatus provided herein includes: an enclosure, an intermediate RF processing unit, and a duplexer. The enclosure is located on the duplexer; the intermediate RF processing unit is located inside a cavity enclosed by the enclosure and the duplexer, or on the duplexer; a duplexer cavity and a heat dissipation part exist on the surface of the duplexer; the opening of the duplexer cavity is opposite to or against the enclosure; the heat dissipation part is designed to dissipate heat of the intermediate RF processing unit; and the duplexer is integrally molded. The foregoing technical solution requires no external fasteners, reduces the time of production and assembly. In addition, waterproof design and shielding design are not required, and thus improves the reliability.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: February 3, 2015
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Haizhao Wang, Guangfu Si, Naier Meng, Bo Yang, Puke Zhou, Shengxiang Guo, Yi Zhang, Weihua Sun, Jianjun Zhou, Ke Zhang, Hao Li, Zhiwei Shang, Runxiao Zhang
  • Publication number: 20140176256
    Abstract: The present disclosure relates to telecommunication, and in particular, to a base station Radio Frequency (RF) duplexer, an RF module, and an RF system. A base station RF apparatus provided herein includes: an enclosure, an intermediate RF processing unit, and a duplexer. The enclosure is located on the duplexer; the intermediate RF processing unit is located inside a cavity enclosed by the enclosure and the duplexer, or on the duplexer; a duplexer cavity and a heat dissipation part exist on the surface of the duplexer; the opening of the duplexer cavity is opposite to or against the enclosure; the heat dissipation part is designed to dissipate heat of the intermediate RF processing unit; and the duplexer is integrally molded. The foregoing technical solution requires no external fasteners, reduces the time of production and assembly. In addition, waterproof design and shielding design are not required, and thus improves the reliability.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 26, 2014
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Haizhao WANG, Guangfu SI, Naier MENG, Bo YANG, Puke ZHOU, Shengxiang GUO, Yi ZHANG, Weihua SUN, Jianjun ZHOU, Ke ZHANG, Hao LI, Zhiwei SHANG, Runxiao ZHANG
  • Publication number: 20100207705
    Abstract: The present disclosure relates to telecommunication, and in particular, to a base station Radio Frequency (RF) duplexer, an RF module, and an RF system. A base station RF apparatus provided herein includes: an enclosure, an intermediate RF processing unit, and a duplexer. The enclosure is located on the duplexer; the intermediate RF processing unit is located inside a cavity enclosed by the enclosure and the duplexer, or on the duplexer; a duplexer cavity and a heat dissipation part exist on the surface of the duplexer; the opening of the duplexer cavity is opposite to or against the enclosure; the heat dissipation part is designed to dissipate heat of the intermediate RF processing unit; and the duplexer is integrally molded. The foregoing technical solution requires no external fasteners, reduces the time of production and assembly. In addition, waterproof design and shielding design are not required, and thus improves the reliability.
    Type: Application
    Filed: February 12, 2010
    Publication date: August 19, 2010
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haizhao Wang, Guangfu Si, Naier Meng, Bo Yang, Puke Zhou, Shengxiang Gao, Yi Zhang, Weihua Sun, Jianjun Zhou, Ke Zhang, Hao Li, Zhiwei Shang, Runxiao Zhang