Abstract: Disclosed are a method and system for establishing a bearer supporting uplink Semi-Persistent Scheduling (SPS) and a User Equipment (UE) thereof, and the method includes: an RRC entity of a UE parses an RRC connection reconfiguration message transmitted from an eNB to obtain logic channel configuration information, EPS bearer activation request information and RBID information, transmits the logic channel configuration information to an MAC entity of the UE and transmits the EPS bearer activation request information and the RBID information to an NAS of the UE; the MAC entity of the UE establishes an LC and an LCG between itself and an RLC entity according to the received logic channel configuration information, and establishes a mapping between the RBID and the LCG; the NAS of the UE establishes an EPS bearer between itself and an NAS of an EPC according to the received EPS bearer activation request information, and establishes correspondences between classifiers and LCs; and parses a QCI and the RBID from t

Abstract: Embodiments are provided for using a molded thermal plastic fin shell as part of a heat sink design for electronic devices. The heat sink design also includes metal components in contact with the electronics components of the device and the thermal plastic fin shell. The thermal plastic fin shell serves both as part of the heat sink design to dissipate heat to the air and as a protective casing or packaging for the device. The heat is transferred from the electronics components or heat sources in the device to the heat sink metal components and hence to the thermal plastic fin shell in contact with the metal. The thermal plastic fin shell dissipates the heat into the surrounding air. The combination of metal and thermal plastic materials in the heat sink design combines both desired properties of high thermal conductivity and ease of manufacture.

Abstract: Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.