Abstract: A device identifier (ID) is used across enterprise boundaries. A user can use the device ID to publish a device for sharing with other remote users. The remote users can discover devices that are shared by other users based on device IDs, connect to a selected device, and then verify that they have connected to the correct device based on its device ID. An account authority service may be used to manage the publication and/or discovery of the shared devices and their device IDs.

Abstract: A voltage adjustment system includes a power supply for providing an initial voltage signal, a plurality of buck converters for receiving the initial voltage signal and generating one adjustable output voltage signal respectively, a microcontroller for determining one adjustable output voltage signal to output and determining whether a variable voltage signal generated by a buck converter that outputs the adjustable output voltage signal is positive or negative, a display unit for displaying value of the adjustable output voltage signal that is outputted, a plurality of voltage control units corresponding to the plurality of buck converters, and a voltage variation adjustment circuit including two buttons. The variable voltage signal is added to the adjustable output voltage signal generated by the same buck converter. Selection of the two buttons causes the microcontroller to adjust absolute value of the variable voltage signal generated by the buck converter through the corresponding voltage control unit.

Abstract: The disclosure provides a device and method for preventing CSRF attacks, in which the method comprises: intercepting request sent from a client browser to a server; generating a token; generating a response to the request; inserting the token into the response to the request; and sending the response to the request to the client browser with the token inserted into the response. With the method and device of the disclosure, it is assured that a token is inserted into all the requests made by a user through a client browser for accessing a resource. And it can be assured that the request is issued by the user himself by verifying whether the token in the request is valid, thereby preventing a CSRF attack.

Abstract: A film scanning method is provided. When the film is judged as a negative film, the scanning device sets the scan exposure time for the film according to the base background color of the film. The negative film is scanned for the scan exposure time, wherein, the film passes through the scanning device at one time so as to complete the above judge of the film type and scanning of the film. The film scanning method automatically completes the recognition of film type, performs accurate scanning based on the scan exposure time, expands the dynamic range and reduces noise impacts, so as to obtain a scanned image with higher accuracy.

Abstract: A method of automatically identifying a scan region boundary, used for scanning a document under a non-unified background, includes: reading a reference linear scan data by a scanning device, the scanning device analyzing brightness values in each row of the reference linear scan data and determining a reference range value according to the brightness values in each row; and during scanning a document, the scanning device comparing brightness values of a linear scan data with the reference range value so as to determine the scan region boundary. The method confirms the scan boundary of a document and is not subjected to a backlight element or a document carrier. The method identifies the boundary of a document under a non-unified background, is applicable to scanning transparent and reflective documents and has strong resistance against environmental interference, not only simplifying the scanning device but also enhancing the automatic performance.

Abstract: The present invention discloses a pad structure and a method for testing a integrated circuit. The structure includes the first pads and the second pads, where the first pads are distributed over a peripheral portion of the integrated circuit and connected with lead-out wires of the integrated circuit, and the second pads are connected with a metal line at a circuit portion in the integrated circuit and are sized larger than the minimum characteristic dimension of the metal line and of the integrated circuit and smaller than the size of the first pads. The pad structure and method can position a test portion with improved efficiency. Correspondingly, a probe can be used to position the test portion with improved accuracy as well.

Abstract: The present invention discloses a failure detection method and a failure detection apparatus for detecting a defect in an electrical conductor. The failure detection method includes: providing at least two output terminals on the electrical conductor under test, the at least two output terminals having identical electric potentials; inputting a constant detection current sequentially to detection points arranged on the electrical conductor under test along a predetermined path; detecting an output current at one or more output terminals of the at least two output terminals; building a correspondence relationship between the detected one or more output currents at the one or more output terminals and positions of the detection points, based on information of the positions of the detection points and information of the detected one or more output currents at the one or more output terminals; and determining from the correspondence relationship whether the detection points have a defect.

Abstract: An integration approach to improve electromigration resistance in a semiconductor device is described. A via hole is formed in a stack that includes an upper dielectric layer, a middle TiN ARC, and a lower first metal layer and is filled with a conformal diffusion barrier layer and a second metal layer. A key feature is that the etch process can be selected to vary the shape and location of the via bottom. A round or partially rounded bottom is formed in the first metal layer to reduce mechanical stress near the diffusion barrier layer. On the other hand, a flat bottom which stops on or in the TiN ARC is selected when exposure of the first metal layer to subsequent processing steps is a primary concern. Electromigration resistance is found to be lower than for a via structure with a flat bottom formed in a first metal layer.

Abstract: An integration approach to improve electromigration resistance in a semiconductor device is described. A via hole is formed in a stack that includes an upper dielectric layer, a middle TiN ARC, and a lower first metal layer and is filled with a conformal diffusion barrier layer and a second metal layer. A key feature is that the etch process can be selected to vary the shape and location of the via bottom. A round or partially rounded bottom is formed in the first metal layer to reduce mechanical stress near the diffusion barrier layer. On the other hand, a flat bottom which stops on or in the TiN ARC is selected when exposure of the first metal layer to subsequent processing steps is a primary concern. Electromigration resistance is found to be lower than for a via structure with a flat bottom formed in a first metal layer.

Abstract: A federated realm discovery system within a federation determines a “home” realm associated with a portion of the user's credentials before the user's secret information (such as a password) is passed to a non-home realm. A login user interface accepts a user identifier and, based on the user identifier, can use various methods to identify an account authority service within the federation that can authenticate the user. In one method, a realm list of the user device can be used to direct the login to the appropriate home realm of the user. In another method, an account authority service in a non-home realm can look up the user's home realm and provide realm information directing the user device to login at the home realm.

Abstract: A federated realm discovery system within a federation determines a “home” realm associated with a portion of the user's credentials before the user's secret information (such as a password) is passed to a non-home realm. A login user interface accepts a user identifier and, based on the user identifier, can use various methods to identify an account authority service within the federation that can authenticate the user. In one method, a realm list of the user device can be used to direct the login to the appropriate home realm of the user. In another method, an account authority service in a non-home realm can look up the user's home realm and provide realm information directing the user device to login at the home realm.

Abstract: An integration approach to improve electromigration resistance in a semiconductor device is described. A via hole is formed in a stack that includes an upper dielectric layer, a middle TiN ARC, and a lower first metal layer and is filled with a conformal diffusion barrier layer and a second metal layer. A key feature is that the etch process can be selected to vary the shape and location of the via bottom. A round or partially rounded bottom is formed in the first metal layer to reduce mechanical stress near the diffusion barrier layer. On the other hand, a flat bottom which stops on or in the TiN ARC is selected when exposure of the first metal layer to subsequent processing steps is a primary concern. Electromigration resistance is found to be lower than for a via structure with a flat bottom formed in a first metal layer.

Abstract: In one aspect, the invention is an enamel composition comprising zinc oxide, diboron trioxide, zirconium dioxide, silicon oxide, sodium oxide, barium oxide, lithium oxide, at least one of aluminum oxide and aluminum oxide precursor compounds that form aluminum oxide upon sintering, and at least one of calcium oxide and calcium oxide precursor compounds that form calcium oxide upon sintering. In another aspect, the invention is a product coated with an enamel layer. In yet another aspect, the invention is a method of coating a product.

Abstract: Methods and systems for recognizing a film in a scanner are provided. First, the film is previewed by the scanner to obtain an original preview image. The original preview image comprises a film image corresponding to the film. The original preview image also comprises pixels and each pixel has a first hue value, a second hue value, and a third hue value. The pixels with luminance in a predetermined range are then selected from the original preview image to acquire a second preview image. Next, the second preview image is framed according to the first hue values of the pixels to obtain an image frame. Finally, the image frame is sectioned to recognize the film image.

Abstract: A processing method for the metal surface in a dual damascene manufacturing is applied to a dual damascene semiconductor structure. The dual damascene semiconductor structure has a metal structure and a spin-on-dielectric (SOD) layer formed on the metal structure, wherein the SOD layer has at least one opening exposing a partial surface of the metal structure. Before the opening is filled, the monoxide on the exposed surface is first removed, then the exposed surface is treated by the plasma at an angle inclined to an axis perpendicular to the exposed surface. The processing method provided in the present invention can avoid the exposed surface being damaged by the plasma and improve the adhesion force between the exposed metal surface and the stuff.

Abstract: A processing method for the metal surface in a dual damascene manufacturing is applied to a dual damascene semiconductor structure. The dual damascene semiconductor structure has a metal structure and a spin-on-dielectric (SOD) layer formed on the metal structure, wherein the SOD layer has at least one opening exposing a partial surface of the metal structure. Before the opening is filled, the monoxide on the exposed surface is first removed, then the exposed surface is treated by the plasma at an angle inclined to an axis perpendicular to the exposed surface. The processing method provided in the present invention can avoid the exposed surface being damaged by the plasma and improve the adhesion force between the exposed metal surface and the stuff.

Abstract: A transaction handling system and associated method are described for handling transactions based on a plurality of rule sets that apply to point sets (where the point sets contain points that can be consumed for goods and services, or have some other end-use connotation). Namely, the rule sets can be associated with respective point lots to define the characteristics and behavior of the respective point lots. For example, one rule in an applied rule set can determine whether a consumer is permitted to make a purchase without having sufficient points in the consumer's point lot, thus incurring a negative balance in the point lot. Another rule (e.g., a sandbox rule) can determine whether the consumer is permitted to use points only within a limited identified environment, or whether the consumer can use the points in any environment. An override rule set can override a default rule set on an individual account basis or on an individual consumer basis.

Abstract: A method for scanning and processing a negative film used in a scanner is disclosed. The method includes scanning the negative film to generate an original image; performing a calibration algorithm on the original image according to a calibration curve; and performing a negative algorithm on the calibration image by using negative characteristic parameters of the standard scanner to generate a final image.

Abstract: The present invention provides a method of performing a surface treatment respectively on the via and the trench in a dual damascene process by the plasma having the inclined angle. The residual and/or the metal surface oxide on the bottom of the via are removed in the via and the trench etching process, and the surface treatment is performed on the surface of the trench, thereby preventing the poor electrical and increasing the adhesive force between the surface of the trench and the barrier metal layer, resulting in solving the disadvantage which the surface treatment can not be respectively performed and the trench according to the prior art.

Abstract: A transaction handling system and associated method are described for handling transactions based on a plurality of rule sets that apply to point sets (where the point sets contain points that can be consumed for goods and services, or have some other end-use connotation). Namely, the rule sets can be associated with respective point lots to define the characteristics and behavior of the respective point lots. For example, one rule in an applied rule set can determine whether a consumer is permitted to make a purchase without having sufficient points in the consumer's point lot, thus incurring a negative balance in the point lot. Another rule (e.g., a sandbox rule) can determine whether the consumer is permitted to use points only within a limited identified environment, or whether the consumer can use the points in any environment. An override rule set can override a default rule set on an individual account basis or on an individual consumer basis.