Patents by Inventor Qiang Niu

Qiang Niu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12123995
    Abstract: An online stress monitoring system is used to obtain a stress distribution of each position, a geophone monitoring system is used to monitor high-frequency vibration signals produced by coal and rock fracture, a support resistance monitoring system is used to monitor working resistance of hydraulic supports in a working face, a well-ground joint microseismic system is used to monitor low-frequency vibration signals produced by the coal and rock fracture, and realize position of a microseismic source and inversion imaging of mining fractures, and an anchor stress monitoring system is used to monitor stress states of anchor bolts and cables. A data processing center is used to comprehensively process data obtained from the above five systems using an early warning model, thereby to obtain a prediction result of rock burst and determine whether to make early warning, thus workers can take timely measures according to the early warning situation.
    Type: Grant
    Filed: January 17, 2024
    Date of Patent: October 22, 2024
    Assignees: China University of Mining and Technology, Xuzhou Hongyi Technology Development Co., Ltd.
    Inventors: Anye Cao, Yaoqi Liu, Xu Yang, Qing Ge, Linming Dou, Siyuan Gong, Zhifeng Ma, Wu Cai, Qiang Niu, Changbin Wang
  • Publication number: 20240078413
    Abstract: Disclosed is a massive data-driven method for automatically locating a mine microseismic source, including: constructing a microseismic wave calibration data set by using a large-scale seismic data set containing seismic signals and non-seismic signals; constructing a pre-training calibration model based on a full convolution neural network through deep learning of a seismic wave calibration data set; using microseismic data of mine sites for transfer learning of an initial arrival time calibration model to construct an arrival time automatic calibration model suitable for mine microseismic signals; and automatically as well as accurately locating mine microseismic events based on an isokinetic homogeneous isotropic velocity model by using an optimization algorithm to deduce arrival time errors and through repeated iteration and fine-tuning.
    Type: Application
    Filed: December 9, 2022
    Publication date: March 7, 2024
    Inventors: Anye CAO, Changbin WANG, Xu YANG, Yaoqi LIU, Sen LI, Qiang NIU, Linming DOU
  • Patent number: 11795407
    Abstract: A gasifier for organic solid waste by injection into molten iron and slag bath includes a gasification furnace, a liquid level adjusting furnace and a slag discharge and heat exchange shaft furnace. The liquid level adjusting furnace, in communication with the bottom of the gasification furnace, contains 1200-1700° C. molten iron-based alloy liquid, which is covered with molten liquid slag layer. When gas pressure above or liquid volume in the liquid level adjusting furnace increases, liquid level of the molten liquid in the gasification furnace rises simultaneously. A particle material injection lance is immersed, through which organic particles to be gasified are blown into molten bath, and oxygen gas or oxygen-enriched air as gasifying agent is blown into the melt at the same time. Organic substance is gasified into CO-rich and H2-rich syngas, and most of inorganic substance enters molten slag and is discharged termly.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: October 24, 2023
    Inventor: Qiang Niu
  • Patent number: 11258270
    Abstract: A charger comprises a housing, a first multi-layer printed circuit board (PCB), a second multi-layer PCB, and a third multi-layer PCB. The first PCB comprises at least a portion of a primary side circuit. The second PCB comprises at least a portion of a secondary side circuit. The third PCB is perpendicular to the first PCB and the second PCB. An isolation coupling element is disposed on the third PCB. The isolation coupling element comprises a multi-layer PCB. The first PCB comprises a high voltage (HV) semiconductor package. A surface of a die paddle of the HV semiconductor package is exposed from a molding encapsulation of the HV semiconductor package.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: February 22, 2022
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Pei-Lun Huang, Yu-Ming Chen, Tien-Chi Lin, Jung-Pei Cheng, Yueh-Ping Yu, Zhi-Qiang Niu, Xiaotian Zhang, Long-Ching Wang
  • Publication number: 20210324280
    Abstract: A gasifier for organic solid waste by injection into molten iron and slag bath includes a gasification furnace, a liquid level adjusting furnace and a slag discharge and heat exchange shaft furnace. The liquid level adjusting furnace, in communication with the bottom of the gasification furnace, contains 1200-1700° C. molten iron-based alloy liquid, which is covered with molten liquid slag layer. When gas pressure above or liquid volume in the liquid level adjusting furnace increases, liquid level of the molten liquid in the gasification furnace rises simultaneously. A particle material injection lance is immersed, through which organic particles to be gasified are blown into molten bath, and oxygen gas or oxygen-enriched air as gasifying agent is blown into the melt at the same time. Organic substance is gasified into CO-rich and H2-rich syngas, and most of inorganic substance enters molten slag and is discharged termly.
    Type: Application
    Filed: March 19, 2020
    Publication date: October 21, 2021
    Inventor: Qiang NIU
  • Publication number: 20200412148
    Abstract: A charger comprises a housing, a first multi-layer printed circuit board (PCB), a second multi-layer PCB, and a third multi-layer PCB. The first PCB comprises at least a portion of a primary side circuit. The second PCB comprises at least a portion of a secondary side circuit. The third PCB is perpendicular to the first PCB and the second PCB. An isolation coupling element is disposed on the third PCB. The isolation coupling element comprises a multi-layer PCB. The first PCB comprises a high voltage (HV) semiconductor package. A surface of a die paddle of the HV semiconductor package is exposed from a molding encapsulation of the HV semiconductor package.
    Type: Application
    Filed: June 28, 2019
    Publication date: December 31, 2020
    Applicant: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Pei-Lun Huang, Yu-Ming Chen, Tien-Chi Lin, Jung-Pei Cheng, Yueh-Ping Yu, Zhi-Qiang Niu, Xiaotian Zhang, Long-Ching Wang
  • Patent number: 10818568
    Abstract: A charger comprises a housing, a first multi-layer printed circuit board (PCB), a second multi-layer PCB, and a third multi-layer PCB. The first PCB comprises at least a portion of a primary side circuit. The second PCB comprises at least a portion of a secondary side circuit. The third PCB is perpendicular to the first PCB and the second PCB. An isolation coupling element is disposed on the third PCB. The isolation coupling element comprises a multi-layer PCB. The first PCB comprises a high voltage (HV) semiconductor package. A surface of a die paddle of the HV semiconductor package is exposed from a molding encapsulation of the HV semiconductor package.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: October 27, 2020
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Pei-Lun Huang, Yu-Ming Chen, Tien-Chi Lin, Jung-Pei Cheng, Yueh-Ping Yu, Zhi-Qiang Niu, Xiaotian Zhang, Long-Ching Wang
  • Patent number: 10788408
    Abstract: A method for determining the diffusion radius of in-situ injection and remediation of contaminated soil and groundwater. According to the triangle method, the hole spacing is perpendicular to the groundwater flow direction, the row spacing is along the groundwater flow direction, and the flow diffusion in the groundwater during the effective time of the remediation agent reaction is considered. Under high pressure rotary injection, the remediation agent and a certain proportion of bromide ions are simultaneously injected into the aquifer as a tracer. The diffusion of the agent is determined by observing the phenomenon of slurry-returning and slurry-channeling of adjacent injection points. After the completion of the injection, the groundwater is quickly sampled in fixed depth, the tracer concentration is quickly detected on site, and the concentration of bromide ions in the groundwater is compared with the background value. Comprehensive determination determines the optimal diffusion radius.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: September 29, 2020
    Assignee: BCEG Environmental Remediation Co., Ltd
    Inventors: Yuewei Yang, Shupeng Li, Yue Zhang, Xiaobin Zhang, Lili Guo, Shuangchao Cui, Xiaowei Song, Fan Chen, Pengcheng Yin, Peng Liu, Yan Liu, Qiang Niu
  • Patent number: 10787865
    Abstract: An in-situ injection of soil and groundwater—high pressure rotary jet grouting in-situ remediation system and method. The system has an agent dispensing station, high pressure grouting pump, air compressor, rotary jet grouting drilling machine, second double-pipe water flow joint, automatic lifting mechanism for grouting drill pipe of rotary jet grouting drilling machine, high pressure jet drill pipe, inner tube for high pressure jet triple drill pipe, outer tube for high pressure jet triple drill pipe, agent jet nozzle, an air jet nozzle, cemented carbide block and a drill bit. Parameters are arranged according to the triangle method to ensure that the remediation area is covered within the diffusion radius of the agent. After positioning the GPS measuring point, a guided-boring rig is positioned at the center of the injection point.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: September 29, 2020
    Assignee: BCEG Environmental Remediation Co., Ltd
    Inventors: Shupeng Li, Yuewei Yang, Lili Guo, Peng Liu, Yue Zhang, Xiaowei Song, Fan Chen, Pengcheng Yin, Fuwang Wang, Yan Liu, Qiang Niu, Fanyang Bu
  • Patent number: 10682680
    Abstract: An in-situ chemical oxidation high pressure injection optimization remediation method for soil and groundwater. A field test determines the diffusion radius of the injection agent in a typical formation, the maximum single-hole grouting amount per linear meter and the injectability parameter. Density-increased supplementary investigation, soil and groundwater data analysis, is divided by spatial distribution into four concentration main partitions, eight concentration sub-partitions. By optimizing the single-hole grouting amount per linear meter, the preparation concentration of the oxidant, and the parameters of the formulation of each partition, the optimization of the dosing ratio of remediation agent of each partition is achieved. The specific construction performance is to adjust the lifting speed of the high pressure injection drill pipe during the injection process for finally achieve the purpose of reducing the dosing ratio parameters of the agent in the remediation plot.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: June 16, 2020
    Assignee: BCEG ENVIRONMENTAL REMEDIATION CO., LTD.
    Inventors: Yuewei Yang, Shupeng Li, Yue Zhang, Fuwang Wang, Lili Guo, Xiaowei Song, Fan Chen, Pengcheng Yin, Shuangchao Cui, Yan Liu, Qiang Niu
  • Patent number: 10630080
    Abstract: A charger comprises a housing, a first multi-layer printed circuit board (PCB), a second multi-layer PCB, and a third multi-layer PCB. The first PCB comprises at least a portion of a primary side circuit. The second PCB comprises at least a portion of a secondary side circuit. The third PCB is perpendicular to the first PCB and the second PCB. An isolation coupling element is disposed on the third PCB. The isolation coupling element comprises a multi-layer PCB. The first PCB comprises a high voltage (HV) semiconductor package. A surface of a die paddle of the HV semiconductor package is exposed from a molding encapsulation of the HV semiconductor package.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: April 21, 2020
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Pei-Lun Huang, Yu-Ming Chen, Tien-Chi Lin, Jung-Pei Cheng, Yueh-Ping Yu, Zhi-Qiang Niu, Xiaotian Zhang, Long-Ching Wang
  • Publication number: 20190224729
    Abstract: An in-situ chemical oxidation high pressure injection optimization remediation method for soil and groundwater. A field test determines the diffusion radius of the injection agent in a typical formation, the maximum single-hole grouting amount per linear meter and the injectability parameter. Density-increased supplementary investigation, soil and groundwater data analysis, is divided by spatial distribution into four concentration main partitions, eight concentration sub-partitions. By optimizing the single-hole grouting amount per linear meter, the preparation concentration of the oxidant, and the parameters of the formulation of each partition, the optimization of the dosing ratio of remediation agent of each partition is achieved. The specific construction performance is to adjust the lifting speed of the high pressure injection drill pipe during the injection process for finally achieve the purpose of reducing the dosing ratio parameters of the agent in the remediation plot.
    Type: Application
    Filed: May 16, 2017
    Publication date: July 25, 2019
    Inventors: Yuewei YANG, Shupeng LI, Yue ZHANG, Fuwang WANG, Lili GUO, Xiaowei SONG, Fan CHEN, Pengcheng YIN, Shuangchao CUI, Yan LIU, Qiang NIU
  • Publication number: 20190145190
    Abstract: An in-situ injection of soil and groundwater—high pressure rotary jet grouting in-situ remediation system and method. The system has an agent dispensing station, high pressure grouting pump, air compressor, rotary jet grouting drilling machine, second double-pipe water flow joint, automatic lifting mechanism for grouting drill pipe of rotary jet grouting drilling machine, high pressure jet drill pipe, inner tube for high pressure jet triple drill pipe, outer tube for high pressure jet triple drill pipe, agent jet nozzle, an air jet nozzle, cemented carbide block and a drill bit. Parameters are arranged according to the triangle method to ensure that the remediation area is covered within the diffusion radius of the agent. After positioning the GPS measuring point, a guided-boring rig is positioned at the center of the injection point.
    Type: Application
    Filed: May 16, 2017
    Publication date: May 16, 2019
    Inventors: Shupeng LI, Yuewei YANG, Lili GUO, Peng LIU, Yue ZHANG, Xiaowei SONG, Fan CHEN, Pengcheng YIN, Fuwang WANG, Yan LIU, Qiang NIU, Fanyang BU
  • Publication number: 20190120741
    Abstract: A method for determining the diffusion radius of in-situ injection and remediation of contaminated soil and groundwater. According to the triangle method, the hole spacing is perpendicular to the groundwater flow direction, the row spacing is along the groundwater flow direction, and the flow diffusion in the groundwater during the effective time of the remediation agent reaction is considered. Under high pressure rotary injection, the remediation agent and a certain proportion of bromide ions are simultaneously injected into the aquifer as a tracer. The diffusion of the agent is determined by observing the phenomenon of slurry-returning and slurry-channeling of adjacent injection points. After the completion of the injection, the groundwater is quickly sampled in fixed depth, the tracer concentration is quickly detected on site, and the concentration of bromide ions in the groundwater is compared with the background value. Comprehensive determination determines the optimal diffusion radius.
    Type: Application
    Filed: May 16, 2017
    Publication date: April 25, 2019
    Inventors: Yuewei YANG, Shupeng LI, Yue ZHANG, Xiaobin ZHANG, Lili GUO, Shuangchao CUI, Xiaowei SONG, Fan CHEN, Pengcheng YIN, Peng LIU, Yan LIU, Qiang NIU
  • Patent number: 10082816
    Abstract: The invention relates to a method of differential protection in the power distribution networks based on phase difference principles. The method comprises the following steps: collecting the current and voltage signals of each loading switch; calculating phase difference between the corresponding currents at two adjacent loading switches, wherein at least one of the two adjacent loading switches accords with ?I? max>n·?IT+?Idz; tripping the two adjacent loading switches if the phase difference corresponding to the two adjacent loading switches being greater than a threshold then a section between the two adjacent loading switches being determined as a fault section. The method only needs to calculate the phase difference between the corresponding currents at the two adjacent loading switches, and achieves the fault determination according to the phase difference being greater than the threshold.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: September 25, 2018
    Assignees: XJ GROUP CORPORATION, XJ ELECTRIC CO., LTD, XUCHANG XJ SOFTWARE TECHNOLOGIES LTD, JIANGSU ELECTRIC POWER COMPANY RESEARCH INSTITUTE, STATE GRID CORPORATION OF CHINA
    Inventors: Qiang Niu, Jingwan Liang, Shuai Jiang, Junhong Qiu, Huawei Jia, Meng Li, Lei Gao, Yongjian Tao, Yongxin Liu, Feng Li, Xintao Dong, Yake Xi
  • Publication number: 20170038785
    Abstract: The invention relates to a method of differential protection in the power distribution networks based on phase difference principles. The method comprises the following steps: collecting the current and voltage signals of each loading switch; calculating phase difference between the corresponding currents at two adjacent loading switches, wherein at least one of the two adjacent loading switches accords with ?I?max>n·?IT+?Idz; tripping the two adjacent loading switches if the phase difference corresponding to the two adjacent loading switches being greater than a threshold then a section between the two adjacent loading switches being determined as a fault section. The method only needs to calculate the phase difference between the corresponding currents at the two adjacent loading switches, and achieves the fault determination according to the phase difference being greater than the threshold.
    Type: Application
    Filed: March 21, 2016
    Publication date: February 9, 2017
    Inventors: Qiang Niu, Jingwan Liang, Shuai Jiang, Junhong Qiu, Huawei Jia, Meng Li, Lei Gao, Yongjian Tao, Yongxin Liu, Feng Li, Xintao Dong, Yake Xi
  • Patent number: 9337131
    Abstract: An ultrathin power semiconductor package with high thermal dissipation performance and its preparation method are disclosed. The package includes a lead frame unit with a staggered structure including an upper section and a lower section. A thin layer is attached on the surface of the lead frame unit having a plurality of contact holes on the upper section and at least one opening on the lower section. A semiconductor chip is attached on the opening on the lower section of the lead frame unit and then a plurality of metal bumps are deposited, where one metal bump is formed on each contact hole on the upper section and on each of the electrodes on the top surface of the semiconductor chip.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: May 10, 2016
    Assignee: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Yan Huo, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu, Yan Xun Xue, Demei Gong
  • Publication number: 20160093560
    Abstract: An ultrathin power semiconductor package with high thermal dissipation performance and its preparation method are disclosed. The package includes a lead frame unit with a staggered structure including an upper section and a lower section. A thin layer is attached on the surface of the lead frame unit having a plurality of contact holes on the upper section and at least one opening on the lower section. A semiconductor chip is attached on the opening on the lower section of the lead frame unit and then a plurality of metal bumps are deposited, where one metal bump is formed on each contact hole on the upper section and on each of the electrodes on the top surface of the semiconductor chip.
    Type: Application
    Filed: September 29, 2014
    Publication date: March 31, 2016
    Inventors: Yan Huo, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu, Yan Xun Xue, Demei Gong
  • Patent number: 9245831
    Abstract: A semiconductor package includes a lead frame having a die paddle and a plurality of leads connected to die paddle, where each lead has a lead surface parallel to die paddle and is a continuous extension bending upward from die paddle. A semiconductor chip is mounted on die paddle, where drain metal layer covering a first surface of chip is connected to die paddle, and source metal layer and gate metal layer are located on a second surface opposite to first surface with gate metal layer located at one corner of the second surface. A source metal plate and a gate metal plate are attached on source metal layer and gate metal layer respectively. A molding layer covers lead frame, semiconductor chip, source metal plate and gate metal plate, where lead surface, top surfaces of source metal plate and gate metal plate are exposed from top surface of molding layer.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: January 26, 2016
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Yan Huo, Zhi Qiang Niu, Ming-Chen Lu, Hongtao Gao
  • Patent number: 9118230
    Abstract: An interior permanent magnet machine includes a stator including a plurality of electrical conductors. The interior permanent magnet machine further includes a rotor concentrically disposed in relation to the stator. The rotor is configured to rotate relative to the stator about a rotational axis and includes a plurality of polar pieces arranged annularly about the rotational axis. At least one of the polar pieces includes a magnetic layer configured to magnetically interact with the electrical conductors. The magnetic layer has a substantially conic section shape.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: August 25, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: Sinisa Jurkovic, Khwaja M. Rahman, Qiang Niu, Peter J. Savagian