Abstract: A gas-liquid separation apparatus includes an inlet pipe for transferring liquid with gas dissolved therein and a separating pipe for separating the gas from the liquid. The separating pipe has a spiral-shaped guiding member therein. The separating pipe extends from the inlet pipe and is in alignment and communicating with the inlet pipe. An outlet pipe extends from a joint of the inlet pipe and the separating pipe and communicates with the separating pipe, for transferring therein the liquid after the liquid has been degassed by the spiral-shaped guiding member in the separating pipe. A gas storage device communicates with the separating pipe and outside for collecting the gas from the separating pipe and discharging the gas to the outside.

Abstract: A fastening device is used for connecting a first and a second fan together. The two fans each have an upper flange and a lower flange and a cylindrical body interconnecting the upper flange and the lower flange. The fastening device includes a plate-shaped pad and two resilient portions respectively extending perpendicularly from two opposite sides of the pad. The two resilient portions respectively extend through the lower flange of the first fan and the upper flange of the second fan, pressing against the first fan and the second fan toward each other. The pad is sandwiched between the lower flange of the first fan and the upper flange of the second fan.

Abstract: A gas-liquid separation apparatus includes a container and a separating pipe located in the container. The container includes an annular wall and two lids covering two ends of the wall. The container has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the container and in communication with the inlet and the outlet of the container. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the container. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the container. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the container.

Abstract: An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing.

Abstract: A heat dissipation device includes a heat conductive member, a fin unit coupled to a bottom surface of the heat conductive member and a plurality of LED modules attached to a top surface of the heat conductive member. The heat conductive member consists of a first plate, a second plate parallel to the first plate and a plurality of posts sandwiched between the first and second plates. Peripheries of the first and second plate are in a hermetical conjunction with each other to form a chamber containing a phase-changeable working fluid therein. The first and second plates therein define a plurality of through orifices. The posts each define therein a screwed orifice which is in alignment with corresponding through orifices of the first and second plates respectively and threadedly receives a screw extending through the LED module.

Abstract: An LED lamp includes a heat dissipation device and a plurality of LED modules. The heat dissipation device includes a heat conductive member and a fin unit. The LED modules are attached to a top surface of a first plate of the heat conductive member. The heat conductive member comprises a plurality of posts embedded in the top surface of the first plate. Peripheries of the first and second plates are in a hermetical conjunction with each other to form a chamber containing phase-changeable working fluid therein. The first plate has a plurality of receiving recessions which are depressed downwardly from the top surface thereof and respectively receive the posts. Screws are used to extend through the LED modules to threadedly engage in the posts thereby to intimately mount the LED modules on the top surface of the first plate of the heat conductive member.

Abstract: An LED assembly for an LED lamp includes a replaceable bracket and a plurality of LED units mounted on the bracket. The bracket includes a frame and a plurality of mutually crossed beams interconnected in the frame to define a plurality of square openings. Each LED unit includes a printed circuit board, a heat sink secured below the printed circuit board and fixed on the bracket, and a plurality of LEDs mounted on the printed circuit board to be exposed in the openings in the bracket. The bracket can have different configuration so that light beams generated by the LEDs are parallel to each other, in a convergent manner or in a divergent manner.

Abstract: A heat dissipation device adapted for removing heat from LED modules of an LED lamp includes a plurality of heat sinks, a plurality of fin sets and a plurality of heat pipes extending through the fin sets and thermally connecting the heat sinks and the fin sets together. The heat sinks each have a base plate with a bottom surface which is kept in contact with corresponding LED modules and a plurality of fins arranged on a top surface of the base plate. Each of the fin sets consists of a plurality of flakes and defines a plurality of air passages between the flakes. Air can flow through the heat dissipation device from a place thereunder to a place thereabove via the air passages between the flakes of the fin sets.

Abstract: A vapor chamber includes a base (100) and a cover (200). The cover is mounted on the base with a hermetically sealed cavity (102) defined between the base and the cover. A working fluid is contained in the cavity. A first wick structure (220) is spread on an inner surface (201) of the cover. A second wick structure (221) is disposed in the cavity. A third wick structure (110) is spread on an inner surface (101) of the base, and the second wick structure extends between the first wick structure and the third wick structure. A first vapor space (300) is defined in the cavity and surrounds the second wick structure. A second vapor space (400) is defined in the second wick structure and communicated with the first vapor space.

Abstract: A heat spreader for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, a working liquid contained between the lower plate and the upper plate, and a wick structure formed between the lower plate and the upper plate. Each of the upper plate and the lower plate defines a cavity receiving a portion of the wick structure therein, and a plurality of grooves extending radially from the cavity to a periphery thereof.

Abstract: A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomb apertures communicating with each other for containing the working liquid therein.

Abstract: A heat pipe includes a hollow metal casing and a wick structure arranged at an inner surface of the hollow metal casing. A part of the inner surface of the hollow metal casing is covered with the wick structure and other parts of the inner surface are uncovered with the wick structure.

Abstract: A pump comprises a base (10), a case (20) fixed on the base, a rotor (30) received between the case and the base, and an inner stator (40) and an outer stator (50) accommodated in the case. The rotor is sandwiched between the inner stator and the outer stator. When the inner stator and the outer stator are energized to generate respective magnetic fields, the rotor is driven to rotate by turning torques that are produced by mutual actions between the rotor and the magnetic fields. Thus, the interior and exterior magnetic fields of the rotor can be utilized sufficiently, and an operation efficiency of the pump is enhanced accordingly.

Abstract: A pump includes a base (10), a case (20) fixed on the base, a stator (30) embedded into the case, a rotor unit (40) sandwiched between the base and the case. The rotor unit includes an inner rotor (42) surrounded by the stator and an outer rotor (44) surrounding the stator. Magnetic fields produced by the stator have interior parts interacting with the inner rotor, and exterior parts interlinking with the outer rotor. Therefore, the magnetic fields are able to be utilized sufficiently to drive the rotor unit to have a high speed rotation, and an operation efficiency of the pump is enhanced accordingly.

Abstract: A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a sintered wick layer formed at an inner face of base. The plate has a meshed wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein.

Abstract: A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a first wick layer formed at an inner face of base. The plate has a second wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. An artery mesh is located in the chamber between the tank and the plate. The artery mesh is in porosity communication with the first wick layer and the second wick layer.

Abstract: An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.

Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

Abstract: A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.