Patents by Inventor Qiao-Li Ding

Qiao-Li Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7447029
    Abstract: A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: November 4, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Patent number: 7438449
    Abstract: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: October 21, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20080165536
    Abstract: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.
    Type: Application
    Filed: January 10, 2007
    Publication date: July 10, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20080158885
    Abstract: An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.
    Type: Application
    Filed: December 28, 2006
    Publication date: July 3, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • Patent number: 7391613
    Abstract: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: June 24, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20080128114
    Abstract: A cooling plate of a liquid cooling includes a chamber hermetically defined therein, an outlet, and an inlet. The outlet and the inlet communicate with the chamber for circulating liquid through the chamber. One of the outlet and the inlet is located in the other one of the outlet and the inlet.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 5, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • Patent number: 7375964
    Abstract: A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: May 20, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20080104992
    Abstract: A liquid cooling device includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is received in the sealed chamber and magnetically interacts with the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. The top cover covers the motor driving unit and thermally contacts with electronic components on the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 8, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20080098898
    Abstract: A gas-liquid separation apparatus includes a crust and a separating pipe located in the crust. The crust includes an annular wall and two lids covering two ends of the wall. The crust has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the crust and in communication with the inlet and the outlet of the crust. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the crust. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the crust. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the crust.
    Type: Application
    Filed: October 27, 2006
    Publication date: May 1, 2008
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20080098897
    Abstract: A gas-liquid separation apparatus includes an inlet pipe for transferring liquid with gas dissolved therein and a separating pipe for separating the gas from the liquid. The separating pipe has a spiral-shaped guiding member therein. The separating pipe extends from the inlet pipe and is in alignment and communicating with the inlet pipe. An outlet pipe extends from a joint of the inlet pipe and the separating pipe and communicates with the separating pipe, for transferring therein the liquid after the liquid has been degassed by the spiral-shaped guiding member in the separating pipe. A gas storage device communicates with the separating pipe and outside for collecting the gas from the separating pipe and discharging the gas to the outside.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 1, 2008
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20080075611
    Abstract: A miniature liquid cooling device includes a casing (10) defining a first chamber (102), a second chamber (104) and a third chamber (106) communicating with the first chamber. The first and the third chambers cooperatively form a work channel for liquid. An impeller (21) is rotatably mounted in the first chamber to circulate the liquid. A filter (17) is mounted in the second chamber and defines a plurality of orifices (1704). When the impeller rotates the liquid firstly enters the second chamber via an inlet (122) and flows through the filter, whereby air bubbles in the liquid leave the liquid and escape from the filter via the orifices. The escaped air bubbles enter the second chamber. The deaerated liquid flows into the work channel and finally is driven to flow out of the liquid cooling device via an outlet (124).
    Type: Application
    Filed: September 21, 2006
    Publication date: March 27, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, Zhi-Yong Zhou, Qiao-Li Ding
  • Patent number: 7349220
    Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: March 25, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Patent number: 7349219
    Abstract: A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: March 25, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20080062694
    Abstract: A heat dissipation device for a light emitting diode (LED) module includes a liquid cooling system. The liquid cooling system includes a heat-absorbing member, which includes an inlet, an outlet and at least one pipe extending between the inlet and the outlet. The inlet and the outlet are provided for permitting liquid to flow through the at least one pipe, which is in thermal contact with at least one LED of the LED module.
    Type: Application
    Filed: September 7, 2006
    Publication date: March 13, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20080053641
    Abstract: A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).
    Type: Application
    Filed: August 31, 2006
    Publication date: March 6, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Patent number: 7333338
    Abstract: A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.
    Type: Grant
    Filed: March 5, 2006
    Date of Patent: February 19, 2008
    Assignees: Fu Zhun Precison Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20070263361
    Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.
    Type: Application
    Filed: May 15, 2006
    Publication date: November 15, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20070263359
    Abstract: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.
    Type: Application
    Filed: May 12, 2006
    Publication date: November 15, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20070263360
    Abstract: A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.
    Type: Application
    Filed: May 15, 2006
    Publication date: November 15, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20070224059
    Abstract: A miniature pump in accordance with the present invention comprises a pump casing (10) and a liquid circulating unit (20) received in the pump casing. The pump casing comprises a hollow main body (14) transversely forming a spacing plate (126) and a partition wall (144) spaced from the spacing plate. The liquid circulating unit comprises a shaft (25) mounted between the partition wall and the spacing plate, a bearing (27) rotatably mounted the shaft, an impeller (26) attached to the bearing, a first pair of spaced magnetic spacers (21,22) surrounding an upper portion of the shaft and positioned above the bearing, and a second pair of spaced magnetic spacers (23, 24) surrounding a lower portion of the shaft and positioned below the bearing. The two pairs of magnetic spacers properly suspend the impeller in a stable position in an axial direction of the pump when the impeller rotates.
    Type: Application
    Filed: March 23, 2006
    Publication date: September 27, 2007
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding